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    • 5. 发明申请
    • CERIUM CARBONATE POWDER, CERIUM OXIDE POWDER, METHOD FOR PREPARING THE SAME, AND CMP SLURRY COMPRISING THE SAME
    • 碳酸钙粉末,氧化铈粉末,其制备方法和包括其的CMP浆料
    • WO2007055523A9
    • 2010-02-18
    • PCT/KR2006004686
    • 2006-11-10
    • LG CHEMICAL LTD
    • OH MYOUNG-HWANNHO JUN-SEOKKIM JONG-PILKIM JANG-YULCHO SEUNG-BEOM
    • C01F17/00C01B32/60
    • C01F17/005B82Y30/00C01F17/0043C01P2002/60C01P2002/76C01P2004/03C01P2004/54C01P2004/62C01P2004/64C09K3/1409C09K3/1463
    • Disclosed is a method of preparing cerium carbonate powder by mixing a cerium precursor solution with a carbonate precursor solution and subjecting the mixture solution to a precipitation reaction, wherein the concentration of cerium in the cerium precursor solution ranges from IM to 1OM, the molar concentration ratio of the cerium precursor to the carbonate precursor ranges from 1:1 to 1:7, and the cerium precursor solution contains at least one additive selected from the group consisting of carbonate compounds, acrylic compounds, and sulfate ion-containing compounds. According to the disclosed invention, cerium carbonate powder having a uniform particle size of 0.05 to 1ú can be prepared through a liquid-phase process by controlling the concentration of the cerium precursor solution, the molar concentration ratio of the cerium precursor to the carbonate precursor solution, the kind of additives, and the like. Also, the cerium carbonate powder is enabled to have a uniform shape with an aspect ratio of 1 to 5, even though it has an orthorhombic crystal structure.
    • 公开了一种通过将铈前体溶液与碳酸盐前体溶液混合并使混合溶液进行沉淀反应制备碳酸铈粉末的方法,其中铈前体溶液中铈的浓度为1M至10M,摩尔浓度比 碳酸酯前体的铈前体的范围为1:1至1:7,并且铈前体溶液含有至少一种选自碳酸酯化合物,丙烯酸酯化合物和含硫酸根离子的化合物的添加剂。 根据所公开的发明,通过控制铈前体溶液的浓度,铈前体与碳酸酯前体溶液的摩尔浓度比,可以通过液相法制备具有0.05〜1μ的均匀粒径的碳酸铈粉末 ,添加剂的种类等。 此外,碳酸铈粉末能够具有纵横比为1〜5的均匀形状,即使其具有正交晶体结构。
    • 6. 发明申请
    • CMP SLURRY AND METHOD FOR POLISHING SEMICONDUCTOR WAFER USING THE SAME
    • CMP浆料和使用其抛光半导体波长的方法
    • WO2007086665A1
    • 2007-08-02
    • PCT/KR2007000332
    • 2007-01-19
    • LG CHEMICAL LTD
    • CHO SEUNG-BEOMKIM JONG-PILNHO JUN-SEOKOH MYOUNG-HWANKIM JANG-YUL
    • C09K3/14
    • C09G1/02H01L21/3212
    • Disclosed is a CMP slurry in which a compound having a weight-average molecular weight of 30-500 and containing a hydroxyl group (OH), a carboxyl group (COOH), or both, is added to a CMP slurry comprising abrasive particles and water and having a first viscosity, so that the CMP slurry is controlled to have a second viscosity 5-30% lower than the first viscosity. Also disclosed is a method for polishing a semiconductor wafer using the CMP slurry. According to the disclosed invention, the agglomerated particle size of abrasive particles in the CMP slurry can be reduced, while the viscosity of the CMP slurry can be reduced and the global planarity of wafers upon polishing can be improved. Thus, the CMP slurry can be advantageously used in processes for manufacturing semiconductor devices requiring fine patterns and can improve the reliability and production of semiconductor devices through the use thereof in semiconductor processes.
    • 公开了一种CMP浆料,其中将包含重均分子量为30-500并含有羟基(OH),羧基(COOH)或二者)的化合物加入到包含磨料颗粒和水的CMP浆料中 并且具有第一粘度,使得CMP浆料被控制为具有比第一粘度低5-30%的第二粘度。 还公开了使用CMP浆料来研磨半导体晶片的方法。 根据所公开的发明,可以减少CMP浆料中的磨料颗粒的聚集粒度,同时可以减少CMP浆料的粘度,并且可以提高抛光时晶片的全局平面性。 因此,CMP浆料可以有利地用于制造需要精细图案的半导体器件的工艺中,并且可以通过其在半导体工艺中的使用来提高半导体器件的可靠性和生产。