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    • 3. 发明申请
    • LIGHT EMITTING DIODE
    • 发光二极管
    • US20110316026A1
    • 2011-12-29
    • US13099127
    • 2011-05-02
    • Chang Youn KIMJoon Hee LEEJong Kyun YOUHong Chol LIMHwa Mok KIM
    • Chang Youn KIMJoon Hee LEEJong Kyun YOUHong Chol LIMHwa Mok KIM
    • H01L33/10
    • H01L33/10H01L33/025H01L2933/0091
    • An exemplary embodiment of the present invention relates to a light emitting diode (LED) including a substrate, a first nitride semiconductor layer arranged on the substrate, an active layer arranged on the first nitride semiconductor layer, a second nitride semiconductor layer arranged on the active layer, a third nitride semiconductor layer disposed between the first nitride semiconductor layer or between the second nitride semiconductor layer and the active layer, the third nitride semiconductor layer comprising a plurality of scatter elements within the third nitride semiconductor layer, and a distributed Bragg reflector (DBR) comprising a multi-layered structure, the substrate being arranged between the DBR and the third nitride semiconductor layer.
    • 本发明的示例性实施例涉及一种发光二极管(LED),其包括衬底,布置在衬底上的第一氮化物半导体层,布置在第一氮化物半导体层上的有源层,布置在有源层上的第二氮化物半导体层 层,设置在第一氮化物半导体层之间或第二氮化物半导体层和有源层之间的第三氮化物半导体层,在第三氮化物半导体层内包括多个散射元件的第三氮化物半导体层和分布式布拉格反射器 DBR),所述基板布置在所述DBR和所述第三氮化物半导体层之间。
    • 4. 发明申请
    • HIGH EFFICIENCY LIGHT EMITTING DIODE
    • 高效发光二极管
    • US20110227109A1
    • 2011-09-22
    • US12986774
    • 2011-01-07
    • Chang Youn KIMJoon Hee LEEJong Kyun YOUHong Chol LIM
    • Chang Youn KIMJoon Hee LEEJong Kyun YOUHong Chol LIM
    • H01L33/46H01L33/38
    • H01L33/22H01L33/20H01L33/382
    • Provided is a high-efficiency light emitting diode (LED) that includes: a support substrate; a semiconductor stack positioned on the support substrate, the semiconductor stack including a p-type compound semiconductor layer, an active layer, and an n-type compound semiconductor layer; a first electrode positioned between the support substrate and the semiconductor stack and in ohmic contact with the semiconductor stack; a first bonding pad positioned on a portion of the first electrode that is exposed outside of the semiconductor stack; and a second electrode positioned on the semiconductor stack. Protrusions are formed on exposed surfaces of the semiconductor stack. In addition, the second electrode may be positioned between the first electrode and the support substrate and contacted with the n-type compound semiconductor layer through openings of the semiconductor stack.
    • 提供了一种高效率发光二极管(LED),其包括:支撑基板; 位于所述支撑基板上的半导体堆叠,所述半导体堆叠包括p型化合物半导体层,有源层和n型化合物半导体层; 位于所述支撑衬底和所述半导体堆叠之间并与所述半导体堆叠欧姆接触的第一电极; 位于所述第一电极的暴露于所述半导体叠层外部的部分上的第一焊盘; 以及位于半导体堆叠上的第二电极。 突起形成在半导体堆叠的暴露表面上。 此外,第二电极可以位于第一电极和支撑衬底之间,并且通过半导体叠层的开口与n型化合物半导体层接触。
    • 10. 发明申请
    • LIGHT EMITTING DEVICE AND METHOD FOR FABRICATING THE SAME
    • 发光装置及其制造方法
    • US20110175131A1
    • 2011-07-21
    • US13076330
    • 2011-03-30
    • Won Cheol SEOYun Goo KIMChang Youn KIM
    • Won Cheol SEOYun Goo KIMChang Youn KIM
    • H01L33/00
    • H01L33/0079H01L33/387H01L33/46H01L33/60H01L33/62H01L2924/0002H01L2924/00
    • There is provided a light emitting device, which comprises compound semiconductor layers including a first conductive semiconductor layer, an active layer and a second conductive semiconductor layer; a metal reflection layer formed on a region of the second conductive semiconductor layer; an insulating structure formed at least in a boundary region of the second conductive semiconductor layer; a metal material structure formed to cover the second conductive semiconductor layer having the metal reflection layer and the insulating structure formed; and a substrate bonded to the metal material structure, wherein the boundary region of the second conductive semiconductor layer includes an outer region of the second conductive semiconductor layer along an outer circumference of the second conductive semiconductor layer.
    • 提供一种发光器件,其包括包括第一导电半导体层,有源层和第二导电半导体层的化合物半导体层; 形成在所述第二导电半导体层的区域上的金属反射层; 至少形成在所述第二导电半导体层的边界区域中的绝缘结构; 形成为覆盖形成有金属反射层和绝缘结构的第二导电半导体层的金属材料结构体; 以及与所述金属材料结构接合的基板,其中所述第二导电半导体层的边界区域沿着所述第二导电半导体层的外周包括所述第二导电半导体层的外部区域。