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1. 发明专利

JP2003026758A One component type solid urethane resin composition 审中-公开
标题翻译：一种组分型固体URETHANE树脂组合物
公开(公告)号：JP2003026758A
公开(公告)日：2003-01-29
申请号：JP2001210827
申请日：2001-07-11
申请人： Kyoeisha Chem Co Ltd , Sanyu Rec Co Ltd , サンユレック株式会社 , 共栄社化学株式会社
发明人： HISANAGA NAOKATSU , TAKEI YOSHIMICHI , BESSHO AKIHIKO , KATAOKA KIYOO , TAKENAKA NAOMI
IPC分类号： C08G18/80 , C08G18/62
摘要： PROBLEM TO BE SOLVED: To provide a one component type solid urethane resin composition capable of being easily handled and showing excellent humidity resistance, cooling and heating cycle resistance and the like each required for sealing an electronic part.
SOLUTION: A one component type solid urethane resin composition contains (1) an isocyanate component composed of a blocked polyisocyanate and (2) a polyol component comprising a polyol which is solid at an ambient temperature and a diene-based polyol having no polyester bond, the ratio of the former to the latter being 1:1 to 4:1 by weight wherein the equivalent ratio of the hydroxy group to the isocyanate group is 0.8 to 1.2.
COPYRIGHT: (C)2003,JPO
摘要翻译：要解决的问题：提供能够容易地处理并显示出优异的耐湿性，冷却和加热循环阻力等的单组分型固体聚氨酯树脂组合物，这些都是密封电子部件所需的。解决方案：单组分型固体聚氨酯树脂组合物含有（1）由封端多异氰酸酯组成的异氰酸酯组分和（2）包含在环境温度下为固体的多元醇和不具有聚酯键的二烯类多元醇的多元醇组分，前者与后者的比例为1：1至4：1，其中羟基与异氰酸酯基的当量比为0.8至1.2。

2. 发明专利

JP2011086745A Resin sealing method of electronic component 审中-公开
标题翻译：电子元件的树脂密封方法
公开(公告)号：JP2011086745A
公开(公告)日：2011-04-28
申请号：JP2009237986
申请日：2009-10-15
申请人： Sanyu Rec Co Ltd , サンユレック株式会社
发明人： TAKEI YOSHIMICHI , BESSHO AKIHIKO , ISHII KENJI , MURAKAMI KOTARO , OKUNO ATSUSHI , HISANAGA NAOKATSU
IPC分类号： H01L21/56
摘要： PROBLEM TO BE SOLVED: To provide a method of ensuring highly reliable resin sealing by a comparatively simple method without causing damage, or the like, on an electronic component when the electronic component mounted on a substrate is resin-sealed.
SOLUTION: In the method of resin sealing the electronic component mounted on a substrate by using a compression molding apparatus with a cope or an upper die having the installation part of the substrate and a drag or lower die having a cavity, the substrate is installed in the cope while turning the electronic component mounting surface to the drag, and after the cavity of the drag is filled with polyurethane resin, compression molding is performed under vacuum atmosphere thus coating the electronic component with polyurethane resin.
COPYRIGHT: (C)2011,JPO&INPIT
摘要翻译：要解决的问题：当安装在基板上的电子部件被树脂密封时，提供一种通过比较简单的方法确保高可靠性树脂密封的方法，而不会在电子部件上造成损坏等。解决方案：在使用具有上基板的压缩成型设备或具有基板的安装部分的上模具和具有空腔的下模具的树脂密封安装在基板上的电子部件的方法中，基板在将电子部件安装面转向阻力的同时安装在托架中，并且在使用聚氨酯树脂填充阻力的空腔之后，在真空气氛下进行压塑，由此用聚氨酯树脂涂布电子部件。版权所有（C）2011，JPO＆INPIT

3. 发明专利

ES2183245T3 未知
公开(公告)号：ES2183245T3
公开(公告)日：2003-03-16
申请号：ES98103709
申请日：1998-03-03
申请人： SANYU REC CO LTD , ITOH SEIYU KABUSHIKI KAISHA
发明人： HISANAGA NAOKATSU , UEDA KENJI , ISHII KENJI , TSUNEMATSU EIJI , KUSAKAWA SUSUMU , HAMAGUCHI TAKASHI
IPC分类号： C08G18/42 , C08G18/36 , C08G18/62 , C08G18/67 , C08G18/69 , H01B3/30
摘要： The present invention has for its object to provide a urethane-forming curable composition which has a low viscosity and therefore can sufficiently go round to details or minute cavities or the like of electric or electronic parts or devices to seal the same and which can give flexible curing products excellent in heat resistance, hydrolysis resistance (wet heat resistance) and moistureproofness and capable of preventing hardness changes as well as reductions in insulating performance over a long period of time even under severe conditions and therefore can reliably protect the electric or electronic parts or devices, and to provide insulated electric or electronic parts or devices treated for moistureproofness with the curing product produced from the composition. A hydrogenated OH-containing liquid polyisoprene (X) and a polyester polyol (Y) which is liquid at ordinary temperature and is constituted of fatty acid units (A) and polyhydric alcohol units (B) and which has an iodine value of not more than 50 are combinedly used as the polyol component. The fatty acid units (A) of this polyester polyol (Y) at least partly comprise hydroxy fatty acid oligomer (at least dimer) units (a). Electric or electronic parts or devices are treated for moistureproofness with the curing product of this urethane-forming curable composition.

4. 发明专利

DE69806893D1 未知
公开(公告)号：DE69806893D1
公开(公告)日：2002-09-05
申请号：DE69806893
申请日：1998-03-03
申请人： SANYU REC CO LTD , ITOH SEIYU K K
发明人： HISANAGA NAOKATSU , UEDA KENJI , ISHII KENJI , TSUNEMATSU EIJI , KUSAKAWA SUSUMU , HAMAGUCHI TAKASHI , ITOH MASAYA , MORIMOTO YOSHITSUGU
IPC分类号： C08G18/42 , C08G18/36 , C08G18/62 , C08G18/67 , C08G18/69 , H01B3/30
摘要： The present invention has for its object to provide a urethane-forming curable composition which has a low viscosity and therefore can sufficiently go round to details or minute cavities or the like of electric or electronic parts or devices to seal the same and which can give flexible curing products excellent in heat resistance, hydrolysis resistance (wet heat resistance) and moistureproofness and capable of preventing hardness changes as well as reductions in insulating performance over a long period of time even under severe conditions and therefore can reliably protect the electric or electronic parts or devices, and to provide insulated electric or electronic parts or devices treated for moistureproofness with the curing product produced from the composition. A hydrogenated OH-containing liquid polyisoprene (X) and a polyester polyol (Y) which is liquid at ordinary temperature and is constituted of fatty acid units (A) and polyhydric alcohol units (B) and which has an iodine value of not more than 50 are combinedly used as the polyol component. The fatty acid units (A) of this polyester polyol (Y) at least partly comprise hydroxy fatty acid oligomer (at least dimer) units (a). Electric or electronic parts or devices are treated for moistureproofness with the curing product of this urethane-forming curable composition.

5. 发明专利

DE69806893T2 未知
公开(公告)号：DE69806893T2
公开(公告)日：2002-12-05
申请号：DE69806893
申请日：1998-03-03
申请人： SANYU REC CO LTD , ITOH SEIYU K K
发明人： HISANAGA NAOKATSU , UEDA KENJI , ISHII KENJI , TSUNEMATSU EIJI , KUSAKAWA SUSUMU , HAMAGUCHI TAKASHI , ITOH MASAYA , MORIMOTO YOSHITSUGU
IPC分类号： C08G18/42 , C08G18/36 , C08G18/62 , C08G18/67 , C08G18/69 , H01B3/30
摘要： The present invention has for its object to provide a urethane-forming curable composition which has a low viscosity and therefore can sufficiently go round to details or minute cavities or the like of electric or electronic parts or devices to seal the same and which can give flexible curing products excellent in heat resistance, hydrolysis resistance (wet heat resistance) and moistureproofness and capable of preventing hardness changes as well as reductions in insulating performance over a long period of time even under severe conditions and therefore can reliably protect the electric or electronic parts or devices, and to provide insulated electric or electronic parts or devices treated for moistureproofness with the curing product produced from the composition. A hydrogenated OH-containing liquid polyisoprene (X) and a polyester polyol (Y) which is liquid at ordinary temperature and is constituted of fatty acid units (A) and polyhydric alcohol units (B) and which has an iodine value of not more than 50 are combinedly used as the polyol component. The fatty acid units (A) of this polyester polyol (Y) at least partly comprise hydroxy fatty acid oligomer (at least dimer) units (a). Electric or electronic parts or devices are treated for moistureproofness with the curing product of this urethane-forming curable composition.

6. 发明专利

JP2002025342A URETHANE RESIN COMPOUND FOR ELECTRIC INSULATION 失效
公开(公告)号：JP2002025342A
公开(公告)日：2002-01-25
申请号：JP2000212472
申请日：2000-07-13
申请人： SANYU REC CO LTD , NIPPON POLYURETHANE KOGYO KK
发明人： HISANAGA NAOKATSU , TAKEI YOSHIMICHI , OKUNO TETSUYA , NAKAMURA TERUAKI , TAGAMI KENJI
IPC分类号： C08G18/42 , C08G18/79 , H01B3/30
摘要： PROBLEM TO BE SOLVED: To provide an urethane resin compound for electric insulation which is suitable for resin sealing of various electric parts like the parts of a high voltage transformer, enabled to evenly impregnate into minute cavity between coils of the high voltage transformer, enabled to form a hardened material with excellent heat resistance, thermal cycle, and withstanding strength against dielectric breakdown at high temperature. SOLUTION: The urethane resin compound contains (1) polyol component of castor oil group polyol with acid value of 0. 5 and less, and hydroxyl value of 200-300, (2) isocyanate component of diphenylmethane diisocyanate with phosphor content of 5 ppm or less, and chlorine component of 10 ppm or less, which is denatured in liquid state by carbodiimidation reaction.

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