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    • 1. 发明专利
    • ES2183245T3
    • 2003-03-16
    • ES98103709
    • 1998-03-03
    • SANYU REC CO LTDITOH SEIYU KABUSHIKI KAISHA
    • HISANAGA NAOKATSUUEDA KENJIISHII KENJITSUNEMATSU EIJIKUSAKAWA SUSUMUHAMAGUCHI TAKASHI
    • C08G18/42C08G18/36C08G18/62C08G18/67C08G18/69H01B3/30
    • The present invention has for its object to provide a urethane-forming curable composition which has a low viscosity and therefore can sufficiently go round to details or minute cavities or the like of electric or electronic parts or devices to seal the same and which can give flexible curing products excellent in heat resistance, hydrolysis resistance (wet heat resistance) and moistureproofness and capable of preventing hardness changes as well as reductions in insulating performance over a long period of time even under severe conditions and therefore can reliably protect the electric or electronic parts or devices, and to provide insulated electric or electronic parts or devices treated for moistureproofness with the curing product produced from the composition. A hydrogenated OH-containing liquid polyisoprene (X) and a polyester polyol (Y) which is liquid at ordinary temperature and is constituted of fatty acid units (A) and polyhydric alcohol units (B) and which has an iodine value of not more than 50 are combinedly used as the polyol component. The fatty acid units (A) of this polyester polyol (Y) at least partly comprise hydroxy fatty acid oligomer (at least dimer) units (a). Electric or electronic parts or devices are treated for moistureproofness with the curing product of this urethane-forming curable composition.
    • 2. 发明公开
    • Electrically insulating, curable polyurethane compositions and electric or electronic device made therewith
    • 电绝缘的交联Polyrethan组合物和所得的合并电气或电子元件
    • EP0940417A1
    • 1999-09-08
    • EP98103709.6
    • 1998-03-03
    • San-yu Resin Kabushiki KaishaItoh Seiyu Kabushiki Kaisha
    • Hisanaga, NaokatsuUeda, KenjiIshii, KenjiTsunematsu, EijiKusakawa, SusumuHamaguchi, TakashiItoh, MasayaMorimoto, Yoshitsugu
    • C08G18/62C08G18/42C08G18/69H01B3/30
    • C08G18/36C08G18/6208C08G2190/00Y10T428/31551Y10T428/31609
    • The present invention has for its object to provide a urethane-forming curable composition which has a low viscosity and therefore can sufficiently go round to details or minute cavities or the like of electric or electronic parts or devices to seal the same and which can give flexible curing products excellent in heat resistance, hydrolysis resistance (wet heat resistance) and moistureproofness and capable of preventing hardness changes as well as reductions in insulating performance over a long period of time even under severe conditions and therefore can reliably protect the electric or electronic parts or devices, and to provide insulated electric or electronic parts or devices treated for moistureproofness with the curing product produced from the composition.
      A hydrogenated OH-containing liquid polyisoprene (X) and a polyester polyol (Y) which is liquid at ordinary temperature and is constituted of fatty acid units (A) and polyhydric alcohol units (B) and which has an iodine value of not more than 50 are combinedly used as the polyol component. The fatty acid units (A) of this polyester polyol (Y) at least partly comprise hydroxy fatty acid oligomer (at least dimer) units (a). Electric or electronic parts or devices are treated for moistureproofness with the curing product of this urethane-forming curable composition.
    • 本发明的目的是提供一种具有低粘度的聚氨酯形成可固化组合物,因此可充分地去圆细节或微小空腔或类似物电气或电子部件或装置的密封相同的,并且,可以给挠性 固化的耐热性,耐水解性(耐湿热性)优良和防湿并且能够防止硬度的变化,以及在超过甚至在恶劣条件下长时间绝缘性能的减少,因此能够可靠地保护电气或电子部件的产品或 设备,以及提供用于治疗与由该组合物生产的固化产物防湿绝缘电气或电子部件或装置。 氢化含OH的液体聚异戊二烯(X)和聚酯多元醇(Y)的所有的在常温下为液体,构成的脂肪酸单元(A)和多元醇单元(B),并且具有以不超过碘值 50组合使用作为多元醇成分。 该聚酯多元醇(Y)的脂肪酸单元(A)至少部分地包括羟基脂肪酸低聚物(至少二聚体)单元(a)。 电气或电子部件或装置被治疗与此氨基甲酸乙酯形成用固化性组合物的固化产物防湿。