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1. 发明专利

DE69806893T2 未知
公开(公告)号：DE69806893T2
公开(公告)日：2002-12-05
申请号：DE69806893
申请日：1998-03-03
申请人： SANYU REC CO LTD , ITOH SEIYU K K
发明人： HISANAGA NAOKATSU , UEDA KENJI , ISHII KENJI , TSUNEMATSU EIJI , KUSAKAWA SUSUMU , HAMAGUCHI TAKASHI , ITOH MASAYA , MORIMOTO YOSHITSUGU
IPC分类号： C08G18/42 , C08G18/36 , C08G18/62 , C08G18/67 , C08G18/69 , H01B3/30
摘要： The present invention has for its object to provide a urethane-forming curable composition which has a low viscosity and therefore can sufficiently go round to details or minute cavities or the like of electric or electronic parts or devices to seal the same and which can give flexible curing products excellent in heat resistance, hydrolysis resistance (wet heat resistance) and moistureproofness and capable of preventing hardness changes as well as reductions in insulating performance over a long period of time even under severe conditions and therefore can reliably protect the electric or electronic parts or devices, and to provide insulated electric or electronic parts or devices treated for moistureproofness with the curing product produced from the composition. A hydrogenated OH-containing liquid polyisoprene (X) and a polyester polyol (Y) which is liquid at ordinary temperature and is constituted of fatty acid units (A) and polyhydric alcohol units (B) and which has an iodine value of not more than 50 are combinedly used as the polyol component. The fatty acid units (A) of this polyester polyol (Y) at least partly comprise hydroxy fatty acid oligomer (at least dimer) units (a). Electric or electronic parts or devices are treated for moistureproofness with the curing product of this urethane-forming curable composition.

2. 发明专利

DE69806893D1 未知
公开(公告)号：DE69806893D1
公开(公告)日：2002-09-05
申请号：DE69806893
申请日：1998-03-03
申请人： SANYU REC CO LTD , ITOH SEIYU K K
发明人： HISANAGA NAOKATSU , UEDA KENJI , ISHII KENJI , TSUNEMATSU EIJI , KUSAKAWA SUSUMU , HAMAGUCHI TAKASHI , ITOH MASAYA , MORIMOTO YOSHITSUGU
IPC分类号： C08G18/42 , C08G18/36 , C08G18/62 , C08G18/67 , C08G18/69 , H01B3/30
摘要： The present invention has for its object to provide a urethane-forming curable composition which has a low viscosity and therefore can sufficiently go round to details or minute cavities or the like of electric or electronic parts or devices to seal the same and which can give flexible curing products excellent in heat resistance, hydrolysis resistance (wet heat resistance) and moistureproofness and capable of preventing hardness changes as well as reductions in insulating performance over a long period of time even under severe conditions and therefore can reliably protect the electric or electronic parts or devices, and to provide insulated electric or electronic parts or devices treated for moistureproofness with the curing product produced from the composition. A hydrogenated OH-containing liquid polyisoprene (X) and a polyester polyol (Y) which is liquid at ordinary temperature and is constituted of fatty acid units (A) and polyhydric alcohol units (B) and which has an iodine value of not more than 50 are combinedly used as the polyol component. The fatty acid units (A) of this polyester polyol (Y) at least partly comprise hydroxy fatty acid oligomer (at least dimer) units (a). Electric or electronic parts or devices are treated for moistureproofness with the curing product of this urethane-forming curable composition.

3. 发明专利

ES2183245T3 未知
公开(公告)号：ES2183245T3
公开(公告)日：2003-03-16
申请号：ES98103709
申请日：1998-03-03
申请人： SANYU REC CO LTD , ITOH SEIYU KABUSHIKI KAISHA
发明人： HISANAGA NAOKATSU , UEDA KENJI , ISHII KENJI , TSUNEMATSU EIJI , KUSAKAWA SUSUMU , HAMAGUCHI TAKASHI
IPC分类号： C08G18/42 , C08G18/36 , C08G18/62 , C08G18/67 , C08G18/69 , H01B3/30
摘要： The present invention has for its object to provide a urethane-forming curable composition which has a low viscosity and therefore can sufficiently go round to details or minute cavities or the like of electric or electronic parts or devices to seal the same and which can give flexible curing products excellent in heat resistance, hydrolysis resistance (wet heat resistance) and moistureproofness and capable of preventing hardness changes as well as reductions in insulating performance over a long period of time even under severe conditions and therefore can reliably protect the electric or electronic parts or devices, and to provide insulated electric or electronic parts or devices treated for moistureproofness with the curing product produced from the composition. A hydrogenated OH-containing liquid polyisoprene (X) and a polyester polyol (Y) which is liquid at ordinary temperature and is constituted of fatty acid units (A) and polyhydric alcohol units (B) and which has an iodine value of not more than 50 are combinedly used as the polyol component. The fatty acid units (A) of this polyester polyol (Y) at least partly comprise hydroxy fatty acid oligomer (at least dimer) units (a). Electric or electronic parts or devices are treated for moistureproofness with the curing product of this urethane-forming curable composition.

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