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1. 发明专利

JP2017084972A 流路部材およびこれを備える半導体製造装置审中-公开
公开(公告)号：JP2017084972A
公开(公告)日：2017-05-18
申请号：JP2015211976
申请日：2015-10-28
申请人：京セラ株式会社 , Kyocera Corp
发明人： NAKAMURA KIYOTAKA , MORIYAMA MASAYUKI
IPC分类号： H01L23/473 , C23C16/458 , H01L21/3065 , H01L21/31
摘要：【課題】第2の金属層が剥離しにくく、長期間にわたる使用が可能な流路部材およびこれを備える半導体製造装置を提供する。【解決手段】本発明の流路部材10は、炭化珪素質セラミックスからなり、内部に流路1を有する基体2と、該基体2に接する第1の金属層3と、該第1の金属層3に接する第2の金属層4とを備える。そして、前記第1の金属層3は、主成分が金属珪素であり、かつセラミック粒子5を含有してなり、前記第1の金属層3における前記第2の金属層4との接触面6のピークカウントPcが80以上250以下である。【選択図】図1

2. 发明专利

JP2014167423A Nuclear reactor structural member and fuel assembly having the same 审中-公开
标题翻译：核反应堆结构构件和燃料组件
公开(公告)号：JP2014167423A
公开(公告)日：2014-09-11
申请号：JP2013039224
申请日：2013-02-28
申请人： Kyocera Corp , 京セラ株式会社
发明人： ODA TAKEHIRO , SHINO NAOYUKI , NAKAMURA KIYOTAKA
IPC分类号： G21C3/30 , G21C3/06
CPC分类号： Y02E30/40
摘要： PROBLEM TO BE SOLVED: To provide a nuclear reactor structural member which is free from flying off of silicon carbide fiber and thus less susceptible to scratches and chips even when surface temperature of the nuclear reactor structural member, such as a fuel cladding tube and fuel channel box, rises to a high temperature of 600°C or higher, and to provide a fuel assembly having the same.SOLUTION: A nuclear reactor structural member is a tabular member made of base materials, each comprising a silicon carbide sintered body with silicon carbide fiber on a surface thereof and silicon that covers both the surface of the silicon carbide sintered body and the silicon carbide fiber. The nuclear reactor structural member is resistant to damage due to contact with fuel rods, spacers, control rods, or the like during inserting and retracting operation and contact with radioactive contaminants contained in cooling water and, since the melting point of silicon is 1410°C, the silicon carbide fiber does not fly off even when surface temperature of the nuclear reactor structural member reaches as high as 1400°C, which allows the surface of the nuclear reactor structural member to be kept resistant to damage and to be used for a long period of time.
摘要翻译：要解决的问题：提供一种核反应堆结构件，其不会脱离碳化硅纤维，因此即使在诸如燃料包层管和燃料通道的核反应堆结构件的表面温度下也不易受划痕和碎屑的影响盒升高至600℃以上的高温，并提供具有该燃料组件的燃料组件。解决方案：核反应堆结构构件是由基材制成的板状构件，每个包括具有碳化硅的碳化硅烧结体其表面上的纤维和覆盖碳化硅烧结体的表面和碳化硅纤维的硅。核反应堆结构构件在插入和收回操作期间由于与燃料棒，间隔物，控制棒等的接触而受到损坏，并且与冷却水中包含的放射性污染物接触，并且由于硅的熔点为1410℃ 即使核反应堆结构件的表面温度高达1400℃，碳化硅纤维也不飞散，这使得核反应堆结构件的表面能够保持耐损坏并长期使用一段的时间。

3. 发明专利

JP2013030616A Circuit board and electronic apparatus including the same 有权
标题翻译：电路板和电子设备，包括它们
公开(公告)号：JP2013030616A
公开(公告)日：2013-02-07
申请号：JP2011165650
申请日：2011-07-28
申请人： Kyocera Corp , 京セラ株式会社
发明人： NAKAMURA KIYOTAKA , OHASHI YOSHIO , ABE YUICHI , HIRANO OSUKE , SEKIGUCHI KEIICHI , YOMO KUNIHIDE
IPC分类号： H05K1/09 , H05K1/02
摘要： PROBLEM TO BE SOLVED: To provide a highly reliable circuit board available over a long period of time in which a ceramic sintered body and a metal wiring layer can be bonded rigidly, and are not peeled off by the thermal cycle due to the heat generated by operation of an electronic component or repetition of operation, and to provide an electronic device obtained by mounting an electronic component on the circuit board.SOLUTION: In a circuit board 10 including a metal wiring layer 12 on at least one principal surface of a ceramic sintered body 11, the average diameter of holes is 2-10 μm in an arbitrary cross section of the metal wiring layer 12, the average area occupation rate of holes is 1-4 area%, and the average inter-centroid distance of holes is 7-15 μm.
摘要翻译：要解决的问题：为了提供高可靠性的电路板，其长时间可以被陶瓷烧结体和金属布线层刚性地粘合，并且由于热循环不会被剥离通过电子部件的操作产生的热量或重复操作，并且提供通过将电子部件安装在电路板上而获得的电子设备。解决方案：在包括陶瓷烧结体11的至少一个主表面上的金属布线层12的电路板10中，在金属布线层12的任意截面中，孔的平均直径为2-10μm 孔的平均占地率为1-4面积％，孔的平均中心距为7-15μm。版权所有（C）2013，JPO＆INPIT

4. 发明专利

JP2012136378A Circuit board and electronic device using the same 审中-公开
标题翻译：电路板和使用该电路的电子设备
公开(公告)号：JP2012136378A
公开(公告)日：2012-07-19
申请号：JP2010289002
申请日：2010-12-25
申请人： Kyocera Corp , 京セラ株式会社
发明人： ABE YUICHI , NAKAMURA KIYOTAKA , TANIGUCHI YOHEI
IPC分类号： C04B37/02 , H05K1/02 , H05K1/03
摘要： PROBLEM TO BE SOLVED: To provide a high-reliability circuit board which has good discharge characteristics and substantially avoids generation of great warpage of a supporting substrate thereof comprising ceramics, and an electronic device using the same.SOLUTION: In the circuit board 10, circuit members 2a, 2b consisting mainly of copper are disposed on the first principal face of a supporting substrate 1 consisting mainly of silicon nitride through first joining layers 3a, 3b comprising a brazing filler metal containing at least one active metal selected from titanium, zirconium, hafnium and niobium. In the surface of the principal face of the supporting substrate 1, crystal grains of the silicon nitride are coupled together by crystal grains of a silicide containing the active metal.
摘要翻译：解决的问题：提供一种高可靠性的电路板，其具有良好的放电特性，并且基本上避免了其包含陶瓷的支撑衬底产生大的翘曲，以及使用其的电子器件。解决方案：在电路板10中，主要由铜组成的电路部件2a，2b通过包括含有金属的钎料的第一接合层3a，3b设置在主要由氮化硅组成的支撑基板1的第一主面上选自钛，锆，铪和铌中的至少一种活性金属。在支撑基板1的主面的表面，氮化硅的晶粒通过含有活性金属的硅化物的晶粒连接在一起。版权所有（C）2012，JPO＆INPIT

5. 发明专利

JP2011176323A Heat radiating substrate and electronic apparatus using same 有权
标题翻译：使用相同的热辐射基板和电子设备
公开(公告)号：JP2011176323A
公开(公告)日：2011-09-08
申请号：JP2011058086
申请日：2011-03-16
申请人： Kyocera Corp , 京セラ株式会社
发明人： ABE YUICHI , NAKAMURA KIYOTAKA
IPC分类号： H01L23/36 , H01L23/12 , H01L23/13
CPC分类号： H01L2924/0002 , H01L2924/00
摘要： PROBLEM TO BE SOLVED: To provide a heat radiating substrate in which warpage is restrained and a heat radiating property is improved. SOLUTION: The heat radiating substrate includes a copper plate 41 as a circuit member on one principal face of a silicon nitride substrate 2 comprising a silicon-nitride based sintered body, and a copper plate 42 on the other principal surface as a heat radiating member. The copper plate 41 constituting the circuit member has higher hardness than that of the copper plate 42 constituting the heat radiating member in this heat radiating substrate 1. As the rigidity on the circuit member side becomes higher as compared with the heat radiating member side, the direction of warpage occurring on the heat radiating substrate can be controlled in such a manner that it protrudes toward the heat radiating member side. Thereby, the adhesion between the heat radiating member and a heat sink can be increased and the heat radiating property of the heat radiating substrate can be improved as well. COPYRIGHT: (C)2011,JPO&INPIT
摘要翻译：解决的问题：提供抑制翘曲并提高散热性的散热基板。解决方案：散热基板包括在包括氮化硅基烧结体的氮化硅衬底2的一个主面上作为电路部件的铜板41和作为热的另一个主表面上的铜板42 散热构件。构成电路部件的铜板41的硬度高于构成该散热基板1的散热部件的铜板42的硬度。由于与散热部件侧相比，电路部件侧的刚性变高，可以以这样的方式控制在散热基板上产生的翘曲方向，从而朝向散热构件侧突出。由此，可以提高散热构件和散热器之间的粘合性，并且也可以提高散热基板的散热性。版权所有（C）2011，JPO＆INPIT

6. 发明专利

JP2011067849A Brazing filler metal, and heat radiation base body joined by using the same 审中-公开
标题翻译：烧结填充金属和使用其加热的热辐射基体
公开(公告)号：JP2011067849A
公开(公告)日：2011-04-07
申请号：JP2009221931
申请日：2009-09-28
申请人： Kyocera Corp , 京セラ株式会社
发明人： ABE YUICHI , NAKAMURA KIYOTAKA , TANIGUCHI YOHEI
IPC分类号： B23K35/30 , B23K35/26 , C22C9/02 , C22C13/00 , C22C30/02 , H01L23/36 , H05K1/02
CPC分类号： H01L2924/0002 , H01L2924/00
摘要： PROBLEM TO BE SOLVED: To provide a brazing filler metal capable of firmly joining a ceramic member with a metal member, a heat radiation base body which is joined by using the brazing filler metal while allowing any short-circuit to hardly occur even when repeating the heat radiation, and an electronic apparatus in which electronic components are mounted on a circuit member of the heat radiation base body. SOLUTION: The brazing filler metal mainly consists of copper and tin, and contains at least one kind of active metal to be selected among titanium, zirconium, hafnium, and niobium, and silver wherein the content of silver is ≥5 mass% and ≤18 mass%. The brazing filler metal is capable of suppressing embrittlement caused by the coupling of the active metal with copper, and preventing degradation of the joining strength of a supporting substrate 21 with a circuit member 41 and a heat radiation member 42 associated with the embrittlement. The brazing filler metal has the viscosity so that any unnecessary projection thereof is less at a joined part between the supporting substrate 21, the circuit member 41 and the heat radiation member 42. COPYRIGHT: (C)2011,JPO&INPIT
摘要翻译：要解决的问题：为了提供能够将陶瓷构件与金属构件牢固地接合的钎焊料，通过使用钎料连接而允许任何短路的散热基体几乎不发生甚至重复放热的电子设备和电子部件安装在散热基体的电路部件上的电子设备。解决方案：钎料主要由铜和锡组成，并且含有选自钛，锆，铪和铌中的至少一种活性金属和银的含量≥5质量％的银， ≤18质量％。钎焊料能够抑制由于活性金属与铜的结合引起的脆化，能够防止伴随脆化的电路部件41和散热部件42的支承基板21的接合强度的劣化。钎焊料具有粘性，使得其在支撑基板21，电路部件41和散热部件42之间的接合部分的任何不必要的突起较小。（C）2011，JPO＆INPIT

7. 发明专利

JP2009088176A Heat dissipation substrate and electronic device using the same 审中-公开
标题翻译：散热基板和使用该散热基板的电子设备
公开(公告)号：JP2009088176A
公开(公告)日：2009-04-23
申请号：JP2007254936
申请日：2007-09-28
申请人： Kyocera Corp , 京セラ株式会社
发明人： ABE YUICHI , NAKAMURA KIYOTAKA
IPC分类号： H01L23/36
CPC分类号： H01L2924/0002 , H01L2924/00
摘要： PROBLEM TO BE SOLVED: To provide a heat dissipation substrate to which less thermal stress is repetitively given and which hardly warp and is durable. SOLUTION: The heat dissipation substrate 1 comprises a circuit member 41 provided on one main face side of a supporting substrate 2 formed of insulating ceramics, and a heat dissipation member 42 provided on the other main face side thereof. The circuit member 41 is bonded to the supporting substrate 2 via a first metal layer 41. At least part of the outer peripheral edge of the first metal layer 31 is formed in a repetitive uneven, stepped or wavy shape in a top view, and so it has a reduced volume while maintaining heat dissipation property. Thermal stress on the supporting substrate 2 and the first metal layer 31 is therefore reduced by different heat expansion coefficients of the supporting substrate 2, the first metal layer 31 and the circuit member 41, resulting in the highly durable heat dissipation substrate 1. COPYRIGHT: (C)2009,JPO&INPIT
摘要翻译：要解决的问题：提供一种散热基板，其中重复地给出较少的热应力，并且难以翘曲和耐用。散热基板1包括设置在由绝缘陶瓷形成的支撑基板2的一个主面侧上的电路部件41和设置在其另一主面侧的散热部件42。电路部件41通过第一金属层41与支撑基板2接合。第一金属层31的外周边缘的至少一部分在俯视图中形成为重复的不均匀，阶梯状或波浪状，它具有减小的体积，同时保持散热性能。因此，支撑基板2和第一金属层31的热应力由于支撑基板2，第一金属层31和电路部件41的不同的热膨胀系数而降低，导致高度耐用的散热基板1.
版权所有（C）2009，JPO＆INPIT

8. 发明专利

JP2008034611A Heat radiating substrate, and electronic apparatus using same 有权
标题翻译：热辐射基板和使用相同的电子设备
公开(公告)号：JP2008034611A
公开(公告)日：2008-02-14
申请号：JP2006206112
申请日：2006-07-28
申请人： Kyocera Corp , 京セラ株式会社
发明人： ABE YUICHI , NAKAMURA KIYOTAKA
IPC分类号： H01L23/36
CPC分类号： H01L2924/0002 , H01L2924/00
摘要： PROBLEM TO BE SOLVED: To relax the generated thermal stress of a heat radiating substrate in comparison with the case wherein its copper plates are coupled to it via its active-metal layers, by deforming its coupling layers when cooling them in their joining process to it, and by using one of its copper plates as a circuit member and using the other of its copper plates as a heat radiating member. SOLUTION: The heat radiating substrate 1 has a silicon nitride substrate 2 comprising a silicon-nitride-based sintered body, has active-metal layers 31, 32 sequentially laminated on both major surfaces of the silicon nitride substrate 2 and the coupling layers 51, 52 having copper as their main components, and further, has copper plates 41, 42 having copper or a copper alloy as their main components and disposed respectively on the coupling layers 51, 52 in the form of matrix of a plurality of rows and columns. Hereupon, one of the copper plates is used as a circuit member, and the other of the copper plates is used as a heat radiating member. COPYRIGHT: (C)2008,JPO&INPIT
摘要翻译：要解决的问题：与其铜板通过其活性金属层耦合到其上的情况相比，为了放松散热基板的产生的热应力，通过使其耦合层在其接合中冷却时使其耦合层变形，处理它，并且通过使用其铜板之一作为电路构件并且使用其另一个铜板作为散热构件。解决方案：散热基板1具有包括氮化硅基烧结体的氮化硅衬底2，其具有顺序层压在氮化硅衬底2的两个主表面上的活性金属层31,32和耦合层具有铜作为其主要成分的铜箔51,52，还具有以铜或铜合金为主要成分的铜板41,42，分别以多行的矩阵的形式配置在耦合层51,52上，列。因此，其中一个铜板用作电路元件，另一个铜板用作散热元件。版权所有（C）2008，JPO＆INPIT

9. 发明专利

JP2006066650A Metal-single crystal complex, its jointing method and heat dissipation substrate employing it 有权
标题翻译：金属单晶复合材料，其接合方法和散热基板使用
公开(公告)号：JP2006066650A
公开(公告)日：2006-03-09
申请号：JP2004247516
申请日：2004-08-26
申请人： Kyocera Corp , 京セラ株式会社
发明人： GENDOSHI TAKUYA , HAYAZAKI TETSUJI , NAKAMURA KIYOTAKA
IPC分类号： H01L23/373
CPC分类号： H01L2924/0002 , H01L2924/00
摘要： PROBLEM TO BE SOLVED: To provide a metal-single crystal complex capable of being employed as a highly reliable heat dissipation substrate, without permitting the existence of a pore on the surface of the substrate, and having high jointing strength without causing a crack or dielectric breakdown in addition to high heat dissipation characteristics and excellent heat resistant cycle characteristics. SOLUTION: The metal-single crystal complex is constituted of a single crystal substrate composed of the principal constituent of a metal compound single crystal jointed to a metal substrate composed of the principal constituent of copper or a copper alloy through an intermediate layer composed of the principal constituent of an active metal. COPYRIGHT: (C)2006,JPO&NCIPI

10. 发明专利

JP2005153365A Wet press, method for producing ceramic molding using it, and ceramic sintered body 审中-公开
标题翻译：湿式压机，使用它制造陶瓷成型的方法和陶瓷烧结体
公开(公告)号：JP2005153365A
公开(公告)日：2005-06-16
申请号：JP2003396427
申请日：2003-11-26
申请人： Kyocera Corp , 京セラ株式会社
发明人： OTA MIZUHO , NAKAMURA KIYOTAKA
IPC分类号： B28B7/38 , B28B3/02
摘要： PROBLEM TO BE SOLVED: To solve the following problem: in a wet press to obtain a ceramic molding by packing ceramic slurry in a mold, after molding, the molding is adhered to the mold surface of the press to lower productivity.
SOLUTION: The wet press 1 has a pressurization container to be filled with the ceramic slurry containing ceramic powder and a binder in a solvent, a pressurization member for pressurizing the ceramic slurry in the container, and a discharge opening 8 for discharging the solvent from the container through a porous material 3 in part of the inner wall surface of the container. A ceramic slurry adhesion prevention layer 5 is formed on the pressurization surface of the pressurization member.
COPYRIGHT: (C)2005,JPO&NCIPI
摘要翻译：解决以下问题：为了解决以下问题，在湿式压制机中，通过在模具中填充陶瓷浆料得到陶瓷成形体，在成型后，将成形体粘附到压机的模具表面，以降低生产率。解决方案：湿式压榨机1具有：填充陶瓷粉末和粘合剂的陶瓷浆料在溶剂中的加压容器，对容器内的陶瓷浆料进行加压的加压部件，以及排出口溶剂通过容器的内壁表面的一部分中的多孔材料3从容器中移出。在加压构件的加压面上形成陶瓷浆料附着防止层5。版权所有（C）2005，JPO＆NCIPI

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