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1. 发明专利

JP2013138193A Heat sink and electronic component device including the same 审中-公开
标题翻译：包括其的散热和电子元件装置
公开(公告)号：JP2013138193A
公开(公告)日：2013-07-11
申请号：JP2012259924
申请日：2012-11-28
申请人： Kyocera Corp , 京セラ株式会社
发明人： ISHIMINE YUSAKU , SEKIGUCHI KEIICHI , FUJIO KAZUHIKO , MUNEISHI TAKESHI
IPC分类号： H01L23/36 , C04B35/622 , H05K7/20
CPC分类号： H01L2924/0002 , H01L2924/00
摘要： PROBLEM TO BE SOLVED: To provide a heat sink which improves heat radiation characteristics of individual fins thereby improving overall heat radiation characteristics, and to provide an electronic component device using the heat sink.SOLUTION: A heat sink includes: a substrate 1 on which a heating member is placed; and multiple columnar fins 2 joined to a surface of the substrate 1 which is opposite to the surface on which the heating member is placed and disposed at intervals. Each fin 2 has at least one of a recessed part 2a and a protruding part 2b at portions that face the adjacent fins 2. In the heat sink, surface areas of the fins, which enable heat radiation, are increased and thus heat radiation characteristics are improved.
摘要翻译：要解决的问题：提供一种散热器，其改善单个散热片的散热特性，从而改善整体散热特性，并提供使用散热器的电子部件装置。散热器包括：基板1，基板1 放置加热构件; 以及多个柱状翅片2，其接合到基板1的与放置加热构件的表面相对的表面，并间隔设置。每个翅片2在相邻散热片2的部分处具有凹部2a和突出部2b中的至少一个。在散热器中，散热片的能够进行热辐射的表面积增加，因此散热特性为改进。

2. 发明专利

JP2013135054A Circuit board and electronic device including the same 有权
标题翻译：电路板和电子设备，包括它们
公开(公告)号：JP2013135054A
公开(公告)日：2013-07-08
申请号：JP2011283676
申请日：2011-12-26
申请人： Kyocera Corp , 京セラ株式会社
发明人： NAKAMURA KIYOTAKA , OHASHI YOSHIO , YOMO KUNIHIDE , SEKIGUCHI KEIICHI
IPC分类号： H01L23/36 , H01L23/15
CPC分类号： H01L2224/48091 , H01L2224/73265 , H01L2924/12032 , H01L2924/1305 , H01L2924/13055 , H01L2924/13091 , H01L2924/00014 , H01L2924/00
摘要： PROBLEM TO BE SOLVED: To provide a highly reliable circuit board which can be used over a long term, and to provide an electronic device obtained by mounting an electronic component on the circuit board.SOLUTION: In a circuit board, a metal wiring layer is provided on at least one principal surface of a ceramic sintered compact, and the metal wiring layer consists of a first region in contact with the principal surface, and a second region on the first region. In a cross section perpendicular to the principal surface, the mean area occupation rate of pores in the second region is smaller than the mean area occupation rate of pores in the first region, and 0.1 area% or less.
摘要翻译：要解决的问题：提供可长期使用的高度可靠的电路板，并提供通过将电子部件安装在电路板上而获得的电子装置。解决方案：在电路板中，金属布线层为提供在陶瓷烧结体的至少一个主表面上，并且所述金属布线层由与所述主表面接触的第一区域和所述第一区域上的第二区域组成。在垂直于主表面的截面中，第二区域的孔的平均面积占有率小于第一区域的孔的平均面积占有率，0.1面积％以下。

3. 发明专利

JP2013051253A Circuit board and electronic apparatus including the same 审中-公开
标题翻译：电路板和电子设备，包括它们
公开(公告)号：JP2013051253A
公开(公告)日：2013-03-14
申请号：JP2011187282
申请日：2011-08-30
申请人： Kyocera Corp , 京セラ株式会社
发明人： SEKIGUCHI KEIICHI , ABE YUICHI , HIRANO OSUKE , NAKAMURA KIYOTAKA , OHASHI YOSHIO , YOMO KUNIHIDE
IPC分类号： H05K1/02 , H05K1/11 , H05K3/40
摘要： PROBLEM TO BE SOLVED: To provide a highly reliable circuit board which allows through holes to be formed into shapes that are less likely to dent while outer shapes of the through holes in a plain view of a substrate are being increased, thereby improving the heat radiation performance and enabling the long term use, and to provide an electronic apparatus formed by mounting electronic components on the circuit board.SOLUTION: A circuit board 10 includes: a base substrate 11 formed by a ceramic sintered body where through holes 12, penetrating from one main surface to the other main surface, are provided; through conductors 13 respectively provided in the through holes 12; and metal wiring layers 14 provided on at least any of the main surfaces of the base substrate 11 and electrically connecting with the through electrodes 13. In the plain view of the base substrate 11, the outer shape of each through hole 12 has a shape formed by joining multiple circles.
摘要翻译：要解决的问题：提供一种高度可靠的电路板，其允许通孔形成为不太可能凹陷的形状，而在基板的平面图中的通孔的外形增加，从而改善热辐射性能并且能够长期使用，并且提供通过将电子部件安装在电路板上而形成的电子设备。电路板10包括：由陶瓷烧结体形成的基底基板11，其中设置从一个主表面到另一个主表面穿透的通孔12; 分别设置在通孔12中的贯通导体13; 以及金属布线层14，其设置在基底基板11的至少任一个主表面上，并且与贯通电极13电连接。在基板11的平面图中，各贯通孔12的外形形成加入多个圈子。版权所有（C）2013，JPO＆INPIT

4. 发明专利

JP2010197193A Substrate for probe card, laminate for probe card, and probe card using the laminate for probe card 审中-公开
标题翻译：用于探针卡的基板，用于探针卡的层压板和用于探针卡的层压板的探针卡
公开(公告)号：JP2010197193A
公开(公告)日：2010-09-09
申请号：JP2009041994
申请日：2009-02-25
申请人： Kyocera Corp , 京セラ株式会社
发明人： YOMO KUNIHIDE , TANDA KENJI , SEKIGUCHI KEIICHI
IPC分类号： G01R1/073 , H01L21/66
CPC分类号： G01R1/07342
摘要： PROBLEM TO BE SOLVED: To provide a substrate for probe cards constituting a probe card capable of accurately inspecting the electric characteristics of electrode pads arranged on a semiconductor element such as an LSI chip of advanced high integration and to provide a laminate for probe cards; a probe card using the laminate for probe cards; and a semiconductor wafer inspection apparatus using the probe card.
SOLUTION: The substrates 1a, 1b, 1c for probe cards are composed of complex ceramics having a compound made of alumina and mullite as a principal component. The substrate is set such that the difference in thermal expansion coefficient between a support member 4 and a semiconductor wafer 6 may be small by adjusting each content of alumina and mullite, so that it is possible to reduce the differences of expansion which occur among the members of the semiconductor wafer 6, the substrates 1a, 1b, 1c for probe cards, and the support member 4 in inspection at high temperatures, thereby reducing the occurrence of positional displacements between probes 5 and electrode pads 7.
COPYRIGHT: (C)2010,JPO&INPIT
摘要翻译：要解决的问题：提供构成探针卡的探针卡的基板，该探针卡能够精确地检测布置在诸如高级集成度的LSI芯片的半导体元件上的电极焊盘的电特性，并提供用于探针的层压体牌; 用于探针卡的层压板的探针卡; 以及使用探针卡的半导体晶片检查装置。解决方案：用于探针卡的基板1a，1b，1c由具有由氧化铝和莫来石制成的化合物作为主要成分的复合陶瓷组成。通过调整各氧化铝和莫来石的含量，使得基板被设定为使得支撑构件4与半导体晶片6之间的热膨胀系数的差异可能较小，从而可以减少在构件之间发生的膨胀差异半导体晶片6，用于探针卡的基板1a，1b，1c以及高温检查中的支撑部件4，从而减少探头5和电极焊盘7之间的位置偏移的发生。版权所有（C））2010，JPO＆INPIT

5. 发明专利

JP2009181975A Vacuum pincette, substrate carrying apparatus ,and substrate processing apparatus using same 审中-公开
标题翻译：真空皮带，基材承载装置和基板加工装置
公开(公告)号：JP2009181975A
公开(公告)日：2009-08-13
申请号：JP2008017100
申请日：2008-01-29
申请人： Kyocera Corp , 京セラ株式会社
发明人： TSUBOKAWA KENJI , SEKIGUCHI KEIICHI
IPC分类号： H01L21/677 , B25J15/06
摘要： PROBLEM TO BE SOLVED: To provide a vacuum pincette, a substrate processing apparatus and a substrate processing apparatus using the same vacuum pincette for adsorbing particle generated from a substrate of a semiconductor wafer when the substrate of semiconductor wafer or the like is adsorbed and reliably adsorbing the substrate without clogging of adsorbing path due to absorption of dust in the atmosphere.
SOLUTION: The vacuum pincette 1 is provided with an attracting part 2 allowing the front end part of a plate body 7 to be branched to a couple of portions and provided to at least three portions of the front end part of the plate body 7 and each surface of the branching part to attract the substrate 8 by sucking the gas, a sucking path 4 for coupling the attracting part 3 and the other attracting part 3 of the branching part, and a sucking part 5 coupled with the attracting part 3 of the branching part via the sucking part 4 to suck the gas. This vacuum pincette 1 includes a part larger than the other part in the cross-sectional area in the course of the sucking path 4 coupled with the attracting part 3 of the branching part. The substrate 8 can surely be attracted without clogging of the sucking path 4.
COPYRIGHT: (C)2009,JPO&INPIT
摘要翻译：要解决的问题：提供一种真空pincette，基板处理装置和基板处理装置，当半导体晶片等的基板被吸附时，使用相同的真空pincette来吸附从半导体晶片的基板产生的粒子并且由于吸收大气中的灰尘而可靠地吸附基板而不堵塞吸附路径。解决方案：真空夹爪1设置有吸引部分2，允许板体7的前端部分分成几部分，并且设置在板体的前端部的至少三个部分 7和分支部分的每个表面通过吸入气体吸引基板8，用于联接吸引部分3和分支部分的另一个吸引部分3的吸入路径4以及与吸引部分3耦合的吸入部分5 通过吸引部分4分支，以吸取气体。在与分支部的吸引部3连接的吸引路径4的过程中，该真空pincette 1包括大于其他部分的部分的部分。可以可靠地吸引基板8而不堵塞吸引路径4.版权所有（C）2009，JPO＆INPIT

6. 发明专利

JP2014131015A Ceramic sintered body, flow-channel member using the same, and semiconductor inspection device and semiconductor manufacturing apparatus 有权
标题翻译：陶瓷烧结体，使用其的流通道部件，以及半导体检查装置和半导体制造装置
公开(公告)号：JP2014131015A
公开(公告)日：2014-07-10
申请号：JP2013240013
申请日：2013-11-20
申请人： Kyocera Corp , 京セラ株式会社
发明人： FUJIO KAZUHIKO , ISHIMINE YUSAKU , SEKIGUCHI KEIICHI
IPC分类号： H01L21/683 , H01L21/66
摘要： PROBLEM TO BE SOLVED: To provide a ceramic sintered body which suppresses formation of cracks, and to provide a flow-channel member using the same, and a semiconductor inspection device and a semiconductor manufacturing apparatus.SOLUTION: Because of having a first meshed hole therein of which at least a part is connected to the outside, ceramic sintered bodies 10, 20 and 30 suppress formation of cracks and the like. When the ceramic sintered bodies 10, 20 and 30 are used as a flow-channel member 40, a liquid is not leaked therefrom and the flow-channel member 40 has high reliability. When the flow-channel member 40 is used in a semiconductor inspection device 50 and a semiconductor manufacturing apparatus 60, the device and the apparatus have high reliability.
摘要翻译：要解决的问题：提供一种抑制裂纹形成的陶瓷烧结体，以及提供使用该陶瓷烧结体的流路部件，以及半导体检查装置和半导体制造装置。解决方案：由于在其中具有第一啮合孔其中至少一部分连接到外部，陶瓷烧结体10,20和30抑制裂纹等的形成。当陶瓷烧结体10,20和30用作流动通道部件40时，液体不会从其泄漏，并且流动通道部件40具有高的可靠性。当流路部件40用于半导体检查装置50和半导体制造装置60时，该装置和装置的可靠性高。

7. 发明专利

JP2014060393A Passage member and heat exchanger using the same and semiconductor production apparatus 有权
标题翻译：使用它们的通风构件和热交换器和半导体生产装置
公开(公告)号：JP2014060393A
公开(公告)日：2014-04-03
申请号：JP2013174642
申请日：2013-08-26
申请人： Kyocera Corp , 京セラ株式会社
发明人： FUJIO KAZUHIKO , SEKIGUCHI KEIICHI , ISHIMINE YUSAKU
IPC分类号： H01L23/473
CPC分类号： H01L2924/0002 , H01L2924/00
摘要： PROBLEM TO BE SOLVED: To provide a passage member having improved reliability, a heat exchanger using the same, and a semiconductor production apparatus.SOLUTION: A passage member includes a lid on which a workpiece is mounted, a bottom plate, and a plurality of sidewalls connected with the lid and bottom plate, and internally has a passage through which fluid flows. In the cross-sectional view orthogonal to the flow direction of the fluid, at least one of the plurality of sidewalls is widened from the bottom plate to the lid thus obtaining a passage member having improved reliability.
摘要翻译：要解决的问题：提供可靠性提高的通道构件，使用该通道的热交换器和半导体制造装置。通路构件包括其上安装有工件的盖，底板和多个与盖和底板连接的侧壁，并且内部具有流体流过的通道。在与流体的流动方向正交的横截面视图中，多个侧壁中的至少一个从底板加宽到盖子，从而获得具有改进的可靠性的通道构件。

8. 发明专利

JP2011007597A Board for probe card constituting probe card, laminate for probe card, and probe card using laminate for probe card 审中-公开
标题翻译：用于探针卡的探针卡，用于探针卡的层压板和使用层压板的探针卡用于探针卡
公开(公告)号：JP2011007597A
公开(公告)日：2011-01-13
申请号：JP2009150608
申请日：2009-06-25
申请人： Kyocera Corp , 京セラ株式会社
发明人： SEKIGUCHI KEIICHI , YOMO KUNIHIDE , TANDA KENJI
IPC分类号： G01R1/073 , H01L21/66
CPC分类号： G01R1/44 , G01R1/07307
摘要： PROBLEM TO BE SOLVED: To provide a board for a probe card constituting a probe card and a laminate for a probe card which accurately detects the predetermined position of a wafer and accurately inspects electric characteristics through electrode pads arranged on a semiconductor device such as a highly integrated LSI chip, a probe card having the laminate for a probe card and a probe, and a semiconductor wafer inspection apparatus using the probe card.SOLUTION: The board for the probe card 1 is formed of composite ceramics having a compound including alumina and mullite as a main component and includes a coloring agent having at least one of chromium oxide, cobalt oxide, manganese oxide, and iron oxide as a main component. It is set so that its thermal expansion coefficient has a small difference with that of the semiconductor wafer, and it reduces the reflection of light from the surface of the board as compared to a white board, thereby allowing positioning with respect to the electrode pads to be performed accurately.
摘要翻译：要解决的问题：提供构成探针卡的探针卡和用于探针卡的层压板的板，其精确地检测晶片的预定位置，并通过布置在诸如高度的半导体器件上的电极焊盘精确地检查电特性集成LSI芯片，具有用于探针卡和探针的层叠体的探针卡，以及使用探针卡的半导体晶片检查装置。解决方案：探针卡1的基板由具有包括氧化铝和莫来石的复合陶瓷构成作为主要成分，并且包括具有氧化铬，氧化钴，氧化锰和氧化铁中的至少一种作为主要成分的着色剂。其设定使得其热膨胀系数与半导体晶片的热膨胀系数具有小的差异，并且与白板相比，其减少了来自板的表面的光的反射，从而允许相对于电极焊盘定位准确执行。

9. 发明专利

JP2009006441A Vacuum tweezers, substrate carrier device using it and substrate treatment device 有权
标题翻译：真空二手，使用其和底板处理装置的基板载体装置
公开(公告)号：JP2009006441A
公开(公告)日：2009-01-15
申请号：JP2007169707
申请日：2007-06-27
申请人： Kyocera Corp , 京セラ株式会社
发明人： TSUBOKAWA KENJI , SEKIGUCHI KEIICHI
IPC分类号： B25J15/06 , H01L21/677
摘要： PROBLEM TO BE SOLVED: To solve the problem of lowering of a yield rate and reliability of a semiconductor element formed of a substrate, etc. by marring of the substrate by a suction surface of vacuum tweezers when the warped substrate is put in and out and the substrate changes its shape due to a temperature change and attachment of dirt in connecting and disconnecting the substrate. SOLUTION: These vacuum tweezers 1 are constituted by furnishing a suction part 3 the head end side of a plate type body 7 of which is forked off into two branches and to adsorb the substrate 8 at at least three points of each of surfaces of a head end part and a forked part of the plate type body 7 and internally providing a suction passage 4 communicated to the suction part 3, an outside surface of the suction part 3 is narrowed toward a suction surface 3a, and an outline of the suction surface 3a is a curve. It is made hard to pollute the substrate 8 as a contact area of the suction surface 3a and the substrate 8 is reduced. At the same time, it is possible to reduce possibility to mar the substrate 8 as it does not become linear contact but point contact since the outline of the suction surface 3a is the curve. COPYRIGHT: (C)2009,JPO&INPIT
摘要翻译：要解决的问题：为了解决当通过真空镊子的抽吸表面将基底等所形成的半导体元件的成品率和可靠性降低的问题，当弯曲的基板被放入并且由于在连接和断开衬底时污染物的温度变化和附着，衬底改变其形状。解决方案：这些真空镊子1通过将吸引部分3的板状体7的头端侧分成两个分支并在每个表面的至少三个点处吸附基板8而构成顶板部分和板状体7的叉形部分内部设置有与吸引部3连通的吸入通路4，吸引部3的外表面朝吸引面3a变窄，抽吸面3a是曲线。由于吸附面3a和基板8的接触面积减小，所以难以污染基板8。同时，由于吸附面3a的轮廓为曲线，所以能够降低不会引起基板8的可能性，因为它不会变成线性接触而是点接触。版权所有（C）2009，JPO＆INPIT

10. 发明专利

JP2013030616A Circuit board and electronic apparatus including the same 有权
标题翻译：电路板和电子设备，包括它们
公开(公告)号：JP2013030616A
公开(公告)日：2013-02-07
申请号：JP2011165650
申请日：2011-07-28
申请人： Kyocera Corp , 京セラ株式会社
发明人： NAKAMURA KIYOTAKA , OHASHI YOSHIO , ABE YUICHI , HIRANO OSUKE , SEKIGUCHI KEIICHI , YOMO KUNIHIDE
IPC分类号： H05K1/09 , H05K1/02
摘要： PROBLEM TO BE SOLVED: To provide a highly reliable circuit board available over a long period of time in which a ceramic sintered body and a metal wiring layer can be bonded rigidly, and are not peeled off by the thermal cycle due to the heat generated by operation of an electronic component or repetition of operation, and to provide an electronic device obtained by mounting an electronic component on the circuit board.SOLUTION: In a circuit board 10 including a metal wiring layer 12 on at least one principal surface of a ceramic sintered body 11, the average diameter of holes is 2-10 μm in an arbitrary cross section of the metal wiring layer 12, the average area occupation rate of holes is 1-4 area%, and the average inter-centroid distance of holes is 7-15 μm.
摘要翻译：要解决的问题：为了提供高可靠性的电路板，其长时间可以被陶瓷烧结体和金属布线层刚性地粘合，并且由于热循环不会被剥离通过电子部件的操作产生的热量或重复操作，并且提供通过将电子部件安装在电路板上而获得的电子设备。解决方案：在包括陶瓷烧结体11的至少一个主表面上的金属布线层12的电路板10中，在金属布线层12的任意截面中，孔的平均直径为2-10μm 孔的平均占地率为1-4面积％，孔的平均中心距为7-15μm。版权所有（C）2013，JPO＆INPIT

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