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1. 发明授权

US07918383B2 Methods for placing substrates in contact with molten solder 有权
标题翻译：使基板与熔融焊料接触的方法
公开(公告)号：US07918383B2
公开(公告)日：2011-04-05
申请号：US11140420
申请日：2005-05-27
申请人： Kyle K. Kirby , Salman Akram , Daniel P. Cram , Roy T. Lange , Warren M. Farnworth
发明人： Kyle K. Kirby , Salman Akram , Daniel P. Cram , Roy T. Lange , Warren M. Farnworth
IPC分类号： B23K31/02
CPC分类号： B23K1/085 , B23K1/0016 , B23K3/0653 , B23K2101/40
摘要： Methods and devices for placing a semiconductor wafer or other substrate in contact with solder are described. A wave soldering apparatus includes a solder bath, a nozzle for producing a solder wave, and a jig for orienting a substrate in a substantially vertical orientation and placing the substrate in contact with a cascading solder wave. In another wave soldering apparatus, a jig orients a semiconductor wafer in a substantially horizontal orientation in contact with the solder wave. Another soldering apparatus includes a tank comprising molten solder and a fixture configured to orient one or more semiconductor wafers in a substantially vertical orientation. Methods of placing semiconductor wafers or other substrates in contact with solder using the devices of the present invention are also disclosed.
摘要翻译：描述了将半导体晶片或其它基板与焊料接触的方法和装置。波峰焊装置包括焊料槽，用于产生焊波的喷嘴和用于使基板垂直定向的夹具，并使基板与级联焊波接触。在另一种波峰焊装置中，夹具使得与焊波接触的大致水平取向的半导体晶片。另一个焊接装置包括一个包含熔融焊料和一个被配置为使一个或多个半导体晶片呈基本垂直取向取向的夹具的罐。还公开了使用本发明的装置将半导体晶片或其它基板与焊料接触的方法。

2. 发明授权

US07960829B2 Support structure for use in thinning semiconductor substrates and for supporting thinned semiconductor substrates 有权
标题翻译：用于减薄半导体衬底和用于支撑薄化半导体衬底的支撑结构
公开(公告)号：US07960829B2
公开(公告)日：2011-06-14
申请号：US11216617
申请日：2005-08-31
申请人： Alan G. Wood , Warren M. Farnworth , David R. Hembree , Sidney B. Rigg , William M. Hiatt , Peter Benson , Kyle K. Kirby , Salman Akram
发明人： Alan G. Wood , Warren M. Farnworth , David R. Hembree , Sidney B. Rigg , William M. Hiatt , Peter Benson , Kyle K. Kirby , Salman Akram
IPC分类号： H01L23/12
CPC分类号： G03F7/0037 , B33Y30/00 , B33Y70/00 , B33Y80/00 , G03F7/0047
摘要： A support structure for use with a semiconductor substrate in thinning, or backgrinding, thereof, as well as during post-thinning processing of the semiconductor substrate includes a portion that extends substantially along and around an outer periphery of the semiconductor substrate to impart the thinned semiconductor substrate with rigidity. The support structure may be configured as a ring or as a member that substantially covers an active surface of the semiconductor substrate and forms a protective structure over each semiconductor device carried by the active surface.
摘要翻译：用于半导体衬底的减薄或后研磨以及在半导体衬底的后变薄处理期间的支撑结构包括基本上沿着半导体衬底的外周延伸并围绕半导体衬底的外周延伸的部分，以使半导体衬底基板具有刚性。支撑结构可以被构造为环或作为基本上覆盖半导体衬底的有源表面并且在由有源表面承载的每个半导体器件上形成保护结构的构件。

3. 发明授权

US07956443B2 Through-wafer interconnects for photoimager and memory wafers 有权
标题翻译：用于光刻机和存储晶圆的透晶片互连
公开(公告)号：US07956443B2
公开(公告)日：2011-06-07
申请号：US12725724
申请日：2010-03-17
申请人： Salman Akram , Charles M. Watkins , Mark Hiatt , David R. Hembree , James M. Wark , Warren M. Farnworth , Mark E. Tuttle , Sidney B. Rigg , Steven D. Oliver , Kyle K. Kirby , Alan G. Wood , Lu Velicky
发明人： Salman Akram , Charles M. Watkins , Mark Hiatt , David R. Hembree , James M. Wark , Warren M. Farnworth , Mark E. Tuttle , Sidney B. Rigg , Steven D. Oliver , Kyle K. Kirby , Alan G. Wood , Lu Velicky
IPC分类号： H01L23/485
CPC分类号： H01L21/76877 , H01L21/6835 , H01L21/76898 , H01L23/481 , H01L24/45 , H01L27/14634 , H01L27/14636 , H01L2221/6834 , H01L2224/02166 , H01L2224/0554 , H01L2224/05567 , H01L2224/05573 , H01L2224/16 , H01L2224/45144 , H01L2224/48463 , H01L2924/00014 , H01L2924/01013 , H01L2924/01014 , H01L2924/01028 , H01L2924/01029 , H01L2924/0105 , H01L2924/01078 , H01L2924/01079 , H01L2924/04941 , H01L2924/10253 , H01L2924/12042 , H01L2924/14 , H01L2924/00 , H01L2224/05599 , H01L2224/0555 , H01L2224/0556
摘要： A through-wafer interconnect for imager, memory and other integrated circuit applications is disclosed, thereby eliminating the need for wire bonding, making devices incorporating such interconnects stackable and enabling wafer level packaging for imager devices. Further, a smaller and more reliable die package is achieved and circuit parasitics (e.g., L and R) are reduced due to the reduced signal path lengths.
摘要翻译：公开了一种用于成像器，存储器和其他集成电路应用的透晶片互连，从而消除了对引线接合的需要，使得结合这种互连的器件可堆叠并且实现成像器件的晶片级封装。此外，实现了更小且更可靠的管芯封装，并且由于信号路径长度的减小，电路寄生（例如，L和R）被减小。

4. 发明授权

US07855140B2 Method of forming vias in semiconductor substrates and resulting structures 有权
标题翻译：在半导体衬底和结构中形成通孔的方法
公开(公告)号：US07855140B2
公开(公告)日：2010-12-21
申请号：US11781083
申请日：2007-07-20
申请人： Charles M. Watkins , Kyle K. Kirby , Alan G. Wood , Salman Akram , Warren M. Farnworth
发明人： Charles M. Watkins , Kyle K. Kirby , Alan G. Wood , Salman Akram , Warren M. Farnworth
IPC分类号： H01L21/4763
CPC分类号： H01L21/76898
摘要： Methods for forming through vias in a semiconductor substrate and resulting structures are disclosed. In one embodiment, a through via may be formed by forming a partial via from an active surface through a conductive element thereon and a portion of the substrate underlying the conductive element. The through via may then be completed by laser ablation or drilling from a back surface. In another embodiment, a partial via may be formed by laser ablation or drilling from the back surface of a substrate to a predetermined distance therein. The through via may be completed from the active surface by forming a partial via extending through the conductive element and the underlying substrate to intersect the laser-drilled partial via. In another embodiment, a partial via may first be formed by laser ablation or drilling from the back surface of the substrate followed by dry etching to complete the through via.
摘要翻译：公开了在半导体衬底中形成贯通孔的方法和所得到的结构。在一个实施例中，可以通过从活性表面通过其上的导电元件和导电元件下面的基底的一部分形成部分通孔来形成通孔。然后可以通过从后表面的激光烧蚀或钻孔来完成通孔。在另一个实施例中，部分通孔可以通过激光烧蚀或从衬底的背面钻孔到其中的预定距离来形成。通孔可以通过形成延伸通过导电元件和下面的衬底以与激光钻孔的部分通孔相交的部分通孔从活性表面完成。在另一个实施例中，可以首先通过激光烧蚀或从衬底的背面进行钻孔形成部分通孔，然后通过干蚀刻来完成通孔。

5. 发明授权

US07531453B2 Microelectronic devices and methods for forming interconnects in microelectronic devices 有权
标题翻译：用于在微电子器件中形成互连的微电子器件和方法
公开(公告)号：US07531453B2
公开(公告)日：2009-05-12
申请号：US12027106
申请日：2008-02-06
申请人： Kyle K. Kirby , Salman Akram , David R. Hembree , Sidney B. Rigg , Warren M. Farnworth , William M. Hiatt
发明人： Kyle K. Kirby , Salman Akram , David R. Hembree , Sidney B. Rigg , Warren M. Farnworth , William M. Hiatt
IPC分类号： H01L21/44
CPC分类号： H01L21/76898 , H01L23/481 , H01L24/48 , H01L2224/48091 , H01L2224/48465 , H01L2924/00014 , H01L2924/01046 , H01L2924/01077 , H01L2924/01078 , H01L2924/01079 , H01L2924/12042 , H01L2924/14 , H05K1/0306 , H05K3/4038 , H05K3/422 , H05K3/423 , H05K2201/0305 , H05K2201/09827 , H05K2203/072 , H05K2203/1147 , H01L2924/00 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： Microelectronic devices, methods for packaging microelectronic devices, and methods for forming interconnects in microelectronic devices are disclosed herein. In one embodiment, a method comprises providing a microelectronic substrate having a front side and a backside. The substrate has a microelectronic die including an integrated circuit and a terminal operatively coupled to the integrated circuit. The method also includes forming a passage at least partially through the substrate and having an opening at the front side and/or backside of the substrate. The method further includes sealing the opening with a conductive cap that closes one end of the passage while another end of the passage remains open. The method then includes filling the passage with a conductive material.
摘要翻译：本文公开了微电子器件，用于封装微电子器件的方法，以及用于在微电子器件中形成互连的方法。在一个实施例中，一种方法包括提供具有正面和背面的微电子衬底。衬底具有包括集成电路的微电子管芯和可操作地耦合到集成电路的端子。该方法还包括至少部分地形成通过基底并且在基底的前侧和/或后侧具有开口的通道。该方法还包括用封闭通道一端的导电盖密封开口，同时通道的另一端保持打开。该方法然后包括用导电材料填充通道。

6. 发明授权

US07189954B2 Microelectronic imagers with optical devices and methods of manufacturing such microelectronic imagers 有权
公开(公告)号：US07189954B2
公开(公告)日：2007-03-13
申请号：US10894262
申请日：2004-07-19
申请人： Warren M. Farnworth , Sidney B. Rigg , William Mark Hiatt , Alan G. Wood , Peter A. Benson , James M. Wark , David R. Hembree , Kyle K. Kirby , Charles M. Watkins , Salman Akram
发明人： Warren M. Farnworth , Sidney B. Rigg , William Mark Hiatt , Alan G. Wood , Peter A. Benson , James M. Wark , David R. Hembree , Kyle K. Kirby , Charles M. Watkins , Salman Akram
IPC分类号： H01L31/0232 , H01L27/00
CPC分类号： H01L27/00 , B33Y80/00 , H01L27/14618 , H01L27/14625 , H01L27/14683 , H01L27/14687 , H01L2224/48091 , H01L2224/48227 , H01L2924/01077 , H01L2924/01078 , H01L2924/00014
摘要： Microelectronic imager assemblies comprising a workpiece including a substrate and a plurality of imaging dies on and/or in the substrate. The substrate includes a front side and a back side, and the imaging dies comprise imaging sensors at the front side of the substrate and external contacts operatively coupled to the image sensors. The microelectronic imager assembly further comprises optics supports superimposed relative to the imaging dies. The optics supports can be directly on the substrate or on a cover over the substrate. Individual optics supports can have (a) an opening aligned with one of the image sensors, and (b) a bearing element at a reference distance from the image sensor. The microelectronic imager assembly can further include optical devices mounted or otherwise carried by the optics supports.

7. 发明授权

US07709776B2 Microelectronic imagers with optical devices and methods of manufacturing such microelectronic imagers 有权
标题翻译：具有光学器件的微电子成像器和制造这种微电子成像器的方法
公开(公告)号：US07709776B2
公开(公告)日：2010-05-04
申请号：US12390195
申请日：2009-02-20
申请人： Warren M. Farnworth , Sidney B. Rigg , William Mark Hiatt , Alan G. Wood , Peter A. Benson , James M. Wark , David R. Hembree , Kyle K. Kirby , Charles M. Watkins , Salman Akram
发明人： Warren M. Farnworth , Sidney B. Rigg , William Mark Hiatt , Alan G. Wood , Peter A. Benson , James M. Wark , David R. Hembree , Kyle K. Kirby , Charles M. Watkins , Salman Akram
IPC分类号： H01L27/00 , H01L31/0232
CPC分类号： H01L27/00 , B33Y80/00 , H01L27/14618 , H01L27/14625 , H01L27/14683 , H01L27/14687 , H01L2224/48091 , H01L2224/48227 , H01L2924/01077 , H01L2924/01078 , H01L2924/00014
摘要： Microelectronic imager assemblies comprising a workpiece including a substrate and a plurality of imaging dies on and/or in the substrate. The substrate includes a front side and a back side, and the imaging dies comprise imaging sensors at the front side of the substrate and external contacts operatively coupled to the image sensors. The microelectronic imager assembly further comprises optics supports superimposed relative to the imaging dies. The optics supports can be directly on the substrate or on a cover over the substrate. Individual optics supports can have (a) an opening aligned with one of the image sensors, and (b) a bearing element at a reference distance from the image sensor. The microelectronic imager assembly can further include optical devices mounted or otherwise carried by the optics supports.
摘要翻译：微电子成像器组件包括包括衬底的工件和在衬底上和/或衬底中的多个成像管芯。基板包括前侧和后侧，并且成像管芯包括在基板的前侧的成像传感器和可操作地耦合到图像传感器的外部触点。微电子成像器组件还包括相对于成像管芯叠加的光学支架。光学支撑件可以直接在基板上或衬底上的盖上。单个光学支撑件可以具有（a）与图像传感器中的一个对准的开口，以及（b）与图像传感器相距一定距离处的轴承元件。微电子成像器组件还可以包括由光学器件支撑件安装或以其它方式承载的光学器件。

8. 发明授权

US07645635B2 Frame structure and semiconductor attach process for use therewith for fabrication of image sensor packages and the like, and resulting packages 有权
标题翻译：用于制造图像传感器封装等的框架结构和半导体附着工艺以及所产生的封装
公开(公告)号：US07645635B2
公开(公告)日：2010-01-12
申请号：US10919604
申请日：2004-08-16
申请人： Alan G. Wood , Kyle K. Kirby , Warren M. Farnworth , Salman Akram
发明人： Alan G. Wood , Kyle K. Kirby , Warren M. Farnworth , Salman Akram
IPC分类号： H01L21/00
CPC分类号： H01L27/14618 , B33Y80/00 , H01L27/14625 , H01L2224/48091 , H01L2924/00014
摘要： A semiconductor package such as an image sensor package, and methods for fabrication. A frame structure includes an array of frames, each having an aperture therethrough, into which an image sensor die in combination with a cover glass, filter, lens or other components may be installed in precise mutual alignment. Singulated image sensor dice and other components may be picked and placed into each frame of the frame structure. Alternatively, the frame structure may be configured to be aligned with and joined to a wafer bearing a plurality of image sensor dice, wherein optional, downwardly protruding skirts along peripheries of the frames may be received into kerfs cut along streets between die locations on the wafer, followed by installation of other package components. In either instance, the frame structure in combination with singulated image sensor dice or a joined wafer is singulated into individual image sensor packages. Various external connection approaches may be used for the packages.
摘要翻译：诸如图像传感器封装的半导体封装以及制造方法。框架结构包括每个具有穿过其中的孔的框架阵列，图像传感器与盖玻片，过滤器，透镜或其它部件组合的模具可以精确相互对准地安装在该框架中。单片图像传感器骰子和其他组件可以被拾取并放置在框架结构的每个帧中。或者，框架结构可以被配置为与承载多个图像传感器骰子的晶片对准并且连接到其上，其中沿着框架的周边的任选的向下突出的裙边可以被接收到沿着晶片上的模具位置之间沿着街道切割的切口，然后安装其他包装组件。在任一情况下，将帧结构与单独的图像传感器芯片或连接的晶片组合成单独的图像传感器封装。各种外部连接方法可用于包装。

9. 发明授权

US07598167B2 Method of forming vias in semiconductor substrates without damaging active regions thereof and resulting structures 有权
标题翻译：在半导体衬底中形成通孔的方法，而不损坏其有效区域和结果
公开(公告)号：US07598167B2
公开(公告)日：2009-10-06
申请号：US11140402
申请日：2005-05-27
申请人： Charles M. Watkins , Kyle K. Kirby , Alan G. Wood , Salman Akram , Warren M. Farnworth
发明人： Charles M. Watkins , Kyle K. Kirby , Alan G. Wood , Salman Akram , Warren M. Farnworth
IPC分类号： H01L21/4763
CPC分类号： H01L21/76898
摘要： Methods for forming through vias in a semiconductor substrate and resulting structures are disclosed. In one embodiment, a through via may be formed by forming a partial via from the active surface through a conductive element thereon and a portion of the semiconductor substrate underlying the conductive element. The through via may then be completed by laser ablation or drilling from the back surface. In another embodiment, a partial via may be formed by laser ablation or drilling from the back surface of a semiconductor substrate to a predetermined distance therein. The through via may be completed from the active surface by forming a partial via extending through the conductive element and the underlying semiconductor substrate to intersect the laser-drilled partial via. In another embodiment, a partial via may first be formed by ablation or drilling from the back surface of the semiconductor substrate followed by dry etching to complete the through via and expose the underside of the conductive element.
摘要翻译：公开了在半导体衬底中形成贯通孔的方法和所得到的结构。在一个实施例中，通孔可以通过在其上的导电元件和导电元件下面的半导体衬底的一部分从活性表面形成部分通孔而形成通孔。然后可以通过从后表面的激光烧蚀或钻孔来完成通孔。在另一个实施例中，部分通孔可以通过激光烧蚀或从半导体衬底的背面钻孔到其中的预定距离来形成。通孔可以通过形成延伸穿过导电元件和下面的半导体衬底以与激光钻孔的部分通孔相交的部分通孔从活性表面完成。在另一个实施例中，可以首先通过从半导体衬底的后表面进行烧蚀或钻孔形成部分通孔，然后进行干法蚀刻以完成通孔并暴露导电元件的下侧。

10. 发明申请

US20090155949A1 MICROELECTRONIC IMAGERS WITH OPTICAL DEVICES AND METHODS OF MANUFACTURING SUCH MICROELECTRONIC IMAGERS 有权
标题翻译：具有光学器件的微电子成像器和制造这种微电子成像器的方法
公开(公告)号：US20090155949A1
公开(公告)日：2009-06-18
申请号：US12390195
申请日：2009-02-20
申请人： Warren M. Farnworth , Sidney B. Rigg , William Mark Hiatt , Alan G. Wood , Peter A. Benson , James M. Wark , David R. Hembree , Kyle K. Kirby , Charles M. Watkins , Salman Akram
发明人： Warren M. Farnworth , Sidney B. Rigg , William Mark Hiatt , Alan G. Wood , Peter A. Benson , James M. Wark , David R. Hembree , Kyle K. Kirby , Charles M. Watkins , Salman Akram
IPC分类号： H01L31/0232
CPC分类号： H01L27/00 , B33Y80/00 , H01L27/14618 , H01L27/14625 , H01L27/14683 , H01L27/14687 , H01L2224/48091 , H01L2224/48227 , H01L2924/01077 , H01L2924/01078 , H01L2924/00014
摘要： Microelectronic imager assemblies comprising a workpiece including a substrate and a plurality of imaging dies on and/or in the substrate. The substrate includes a front side and a back side, and the imaging dies comprise imaging sensors at the front side of the substrate and external contacts operatively coupled to the image sensors. The microelectronic imager assembly further comprises optics supports superimposed relative to the imaging dies. The optics supports can be directly on the substrate or on a cover over the substrate. Individual optics supports can have (a) an opening aligned with one of the image sensors, and (b) a bearing element at a reference distance from the image sensor. The microelectronic imager assembly can further include optical devices mounted or otherwise carried by the optics supports.
摘要翻译：微电子成像器组件包括包括衬底的工件和在衬底上和/或衬底中的多个成像管芯。基板包括前侧和后侧，并且成像管芯包括在基板的前侧的成像传感器和可操作地耦合到图像传感器的外部触点。微电子成像器组件还包括相对于成像管芯叠加的光学支架。光学支撑件可以直接在基板上或衬底上的盖上。单个光学支撑件可以具有（a）与图像传感器中的一个对准的开口，以及（b）与图像传感器相距一定距离处的轴承元件。微电子成像器组件还可以包括由光学器件支撑件安装或以其它方式承载的光学器件。

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