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1. 发明申请

US20130062744A1 POWER MODULE PACKAGE 审中-公开
标题翻译：电源模块封装
公开(公告)号：US20130062744A1
公开(公告)日：2013-03-14
申请号：US13316121
申请日：2011-12-09
申请人： Kwang Soo Kim , Jung Eun Kang , Young Ki Lee
发明人： Kwang Soo Kim , Jung Eun Kang , Young Ki Lee
IPC分类号： H01L23/495
CPC分类号： H01L23/3677 , H01L23/36 , H01L24/73 , H01L2224/32225 , H01L2224/48227 , H01L2224/73265 , H01L2924/1305 , H01L2924/13055 , H01L2924/19105 , H01L2924/00 , H01L2924/00012
摘要： Disclosed herein is a power module package, including: a first substrate having one surface and the other surface; first vias formed to penetrate from one surface of the first substrate to the other surface thereof; a metal layer formed on one surface of the first substrate; semiconductor devices formed on the metal layer; and a metal plate formed on the other surface of the first substrate.
摘要翻译：本文公开了一种功率模块封装，包括：具有一个表面和另一个表面的第一基板; 形成为从第一基板的一个表面穿透到其另一个表面的第一通孔; 形成在所述第一基板的一个表面上的金属层; 形成在金属层上的半导体器件; 以及形成在所述第一基板的另一个表面上的金属板。

2. 发明授权

US08198543B2 Rigid-flexible circuit board and method of manufacturing the same 失效
标题翻译：刚性柔性电路板及其制造方法
公开(公告)号：US08198543B2
公开(公告)日：2012-06-12
申请号：US12618726
申请日：2009-11-14
申请人： Jung Eun Kang , Seog Moon Choi , Tae Hoon Kim , Young Ki Lee , Hye Sook Shin , Chang Hyun Lim
发明人： Jung Eun Kang , Seog Moon Choi , Tae Hoon Kim , Young Ki Lee , Hye Sook Shin , Chang Hyun Lim
IPC分类号： H05K1/00
CPC分类号： H05K3/4641 , H05K1/0203 , H05K1/053 , H05K1/189 , H05K3/462 , H05K3/4691 , H05K2203/0315 , Y10T29/49124 , Y10T29/49126 , Y10T29/49155 , Y10T29/49165
摘要： Disclosed is a rigid-flexible circuit board, which includes a rigid region and a flexible region, the rigid region including a flexible substrate having a first circuit layer on both surfaces thereof, a metal core substrate formed on the flexible substrate and having a second circuit layer on both surfaces thereof, and an adhesive layer disposed between the flexible substrate and the metal core substrate, wherein the metal core substrate includes a metal core having a through hole, and an insulating layer formed on a surface of the metal core, so that the rigid region and the flexible region are thermally separated from each other and heat dissipation properties of the rigid region are improved. A method of manufacturing the rigid-flexible circuit board is also provided.
摘要翻译：公开了一种刚性柔性电路板，其包括刚性区域和柔性区域，所述刚性区域包括在其两个表面上具有第一电路层的柔性基板，形成在柔性基板上的金属芯基板，并具有第二电路并且设置在柔性基板和金属芯基板之间的粘合层，其中金属芯基板包括具有通孔的金属芯和形成在金属芯的表面上的绝缘层，使得刚性区域和柔性区域彼此热分离，改善了刚性区域的散热性能。还提供了制造刚性柔性电路板的方法。

3. 发明授权

US08502374B2 Power module package and method for manufacturing the same 失效
标题翻译：电源模块封装及其制造方法
公开(公告)号：US08502374B2
公开(公告)日：2013-08-06
申请号：US13281285
申请日：2011-10-25
申请人： Kwang Soo Kim , Young Ki Lee , Sung Keun Park , Seog Moon Choi , Chang Hyun Lim
发明人： Kwang Soo Kim , Young Ki Lee , Sung Keun Park , Seog Moon Choi , Chang Hyun Lim
IPC分类号： H01L23/34
CPC分类号： H01L23/49575 , H01L23/3107 , H01L23/3142 , H01L23/4334 , H01L23/49531 , H01L24/48 , H01L2224/48137 , H01L2224/48247 , H01L2924/00014 , H01L2924/1305 , H01L2924/13055 , H01L2924/181 , H01L2924/19107 , H01L2924/00 , H01L2924/00012 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： Disclosed herein are a power module package and a method for manufacturing the same. The power module package includes: a base substrate having grooves formed between a plurality of semiconductor device mounting areas; semiconductor devices mounted on the semiconductor device mounting areas of the base substrate; and a molding formed on the base substrate and in inner portions of the grooves.
摘要翻译：这里公开了功率模块封装及其制造方法。功率模块封装包括：具有形成在多个半导体器件安装区域之间的沟槽的基底基板; 安装在基底基板的半导体器件安装区域上的半导体器件; 以及形成在基底基板上和凹槽的内部中的模制件。

4. 发明申请

US20130020687A1 POWER MODULE PACKAGE AND METHOD FOR MANUFACTURING THE SAME 审中-公开
标题翻译：功率模块封装及其制造方法
公开(公告)号：US20130020687A1
公开(公告)日：2013-01-24
申请号：US13301616
申请日：2011-11-21
申请人： Kwang Soo Kim , Young Ki Lee , Seog Moon Choi , Jin Suk Son
发明人： Kwang Soo Kim , Young Ki Lee , Seog Moon Choi , Jin Suk Son
IPC分类号： H01L23/495 , H01L21/56
CPC分类号： H01L21/50 , H01L21/565 , H01L23/24 , H01L23/3107 , H01L23/4334 , H01L23/49537 , H01L23/49575 , H01L23/49586 , H01L24/73 , H01L25/072 , H01L2224/32245 , H01L2224/48137 , H01L2224/48247 , H01L2224/73265 , H01L2924/1305 , H01L2924/13055 , H01L2924/181 , H01L2924/00012 , H01L2924/00
摘要： Disclosed herein are a power module package and a method for manufacturing the same. The power module package includes first and second lead frames disposed to face each other; ceramic coating layers formed on a portion of a first surface of both or one of both of the first and second lead frames; and semiconductor devices mounted on second surfaces of the first and second lead frames.
摘要翻译：这里公开了功率模块封装及其制造方法。功率模块封装包括彼此相对设置的第一和第二引线框架; 形成在所述第一引线框架和所述第二引线框架中的两个或第二引线框架的第一表面的一部分上的陶瓷涂层; 以及安装在第一和第二引线框架的第二表面上的半导体器件。

5. 发明申请

US20130009290A1 POWER MODULE PACKAGE AND METHOD FOR MANUFACTURING THE SAME 失效
标题翻译：功率模块封装及其制造方法
公开(公告)号：US20130009290A1
公开(公告)日：2013-01-10
申请号：US13247603
申请日：2011-09-28
申请人： Chang Hyun Lim , Young Ki Lee , Kwang Soo Kim , Seog Moon Choi
发明人： Chang Hyun Lim , Young Ki Lee , Kwang Soo Kim , Seog Moon Choi
IPC分类号： H01L25/065 , H01L21/98
CPC分类号： H01L23/49575 , H01L23/3107 , H01L23/4334 , H01L23/49531 , H01L23/49551 , H01L24/29 , H01L24/32 , H01L24/45 , H01L24/48 , H01L24/73 , H01L25/071 , H01L25/50 , H01L2224/291 , H01L2224/29187 , H01L2224/29188 , H01L2224/2919 , H01L2224/32245 , H01L2224/45139 , H01L2224/48227 , H01L2224/48247 , H01L2224/48463 , H01L2224/4847 , H01L2224/73265 , H01L2924/00014 , H01L2924/13034 , H01L2924/1305 , H01L2924/13055 , H01L2924/13091 , H01L2924/15311 , H01L2924/00 , H01L2224/45099 , H01L2224/05599
摘要： Disclosed herein is a power module package including: a first substrate; a second substrate having a pad for connection to the first substrate formed on one side or both sides of one surface thereof and having external connection terminals for connection to the outside formed on the other surface thereof; and a lead frame having one end bonded to the first substrate and the other end bonded to the pad of the second substrate to thereby vertically connect the first and second substrates to each other.
摘要翻译：本文公开了一种功率模块封装，包括：第一基板; 第二基板，其具有用于连接到其一个表面的一侧或两侧上的第一基板的焊盘，并且具有用于连接到形成在其另一个表面上的外部的外部连接端子; 以及引线框架，其一端接合到第一基板，另一端接合到第二基板的焊盘，从而使第一和第二基板彼此垂直连接。

6. 发明授权

US08598702B2 Semiconductor package 有权
标题翻译：半导体封装
公开(公告)号：US08598702B2
公开(公告)日：2013-12-03
申请号：US13408829
申请日：2012-02-29
申请人： Young Hoon Kwak , Kwang Soo Kim , Young Ki Lee
发明人： Young Hoon Kwak , Kwang Soo Kim , Young Ki Lee
IPC分类号： H01L23/34
CPC分类号： H01L23/473 , H01L2924/0002 , H05K7/20927 , H01L2924/00
摘要： Disclosed herein is a semiconductor package. The semiconductor package includes a semiconductor module, a first heat dissipation unit, a second heat dissipation unit and a housing. The semiconductor module contains a semiconductor device. The first heat dissipation unit is provided under the semiconductor module. The first heat dissipation unit includes at least one first pipe through which first cooling water passes. A first rotator is rotatably disposed in the first pipe. The second heat dissipation unit is provided on the semiconductor module. The second heat dissipation unit includes at least one second pipe through which second cooling water passes. A second rotator is rotatably disposed in the second pipe. The housing is provided on opposite sides of the semiconductor module, the first heat dissipation unit and the second heat dissipation unit and supports the semiconductor module, the first heat dissipation unit and the second heat dissipation unit.
摘要翻译：这里公开了半导体封装。半导体封装包括半导体模块，第一散热单元，第二散热单元和壳体。半导体模块包含半导体器件。第一散热单元设置在半导体模块的下方。第一散热单元包括至少一个第一冷却水通过的第一管道。第一旋转体可旋转地设置在第一管中。第二散热单元设置在半导体模块上。第二散热单元包括至少一个第二冷却水通过的第二管道。第二旋转体可旋转地设置在第二管中。壳体设置在半导体模块，第一散热单元和第二散热单元的相对侧上，并且支撑半导体模块，第一散热单元和第二散热单元。

7. 发明申请

US20130020111A1 SUBSTRATE FOR POWER MODULE PACKAGE AND METHOD FOR MANUFACTURING THE SAME 审中-公开
标题翻译：用于功率模块封装的基板及其制造方法
公开(公告)号：US20130020111A1
公开(公告)日：2013-01-24
申请号：US13253866
申请日：2011-10-05
申请人： Kyu Hwan Oh , Jong Man Kim , Seog Moon Choi , Young Hoon Kwak , Kwang Soo Kim , Young Ki Lee
发明人： Kyu Hwan Oh , Jong Man Kim , Seog Moon Choi , Young Hoon Kwak , Kwang Soo Kim , Young Ki Lee
IPC分类号： H05K1/05 , H05K1/02 , H05K3/10 , H05K1/00
CPC分类号： H05K1/053 , H01L23/142 , H01L2924/0002 , H05K2203/0315 , Y10T29/49155 , H01L2924/00
摘要： Disclosed herein are a substrate for a power module package and a method for manufacturing the same, including: a base substrate made of a metal material; an anodized layer formed on the base substrate; and a circuit layer formed on the anodized layer, wherein the anodized layer is formed to correspond to circuit patterns on the circuit layer or is formed to be divided into a plurality of areas.
摘要翻译：本文公开了一种用于功率模块封装的基板及其制造方法，包括：由金属材料制成的基底; 形成在基底基板上的阳极化层; 以及形成在所述阳极氧化层上的电路层，其中所述阳极化层形成为对应于所述电路层上的电路图案，或者形成为被划分为多个区域。

8. 发明授权

US08796730B2 Power semiconductor module 有权
标题翻译：功率半导体模块
公开(公告)号：US08796730B2
公开(公告)日：2014-08-05
申请号：US13313713
申请日：2011-12-07
申请人： Young Ki Lee , Dong Soo Seo , Kwang Soo Kim , Young Hoon Kwak
发明人： Young Ki Lee , Dong Soo Seo , Kwang Soo Kim , Young Hoon Kwak
IPC分类号： H01L29/739
CPC分类号： H01L23/4824 , H01L29/7393 , H01L2924/0002 , H01L2924/00
摘要： Disclosed herein is a power semiconductor module including: a circuit board having gate, emitter, and collector patterns formed thereon; a first semiconductor chip mounted on the circuit board, having gate and emitter terminals each formed on one surface thereof, and having a collector terminal formed on the other surface thereof; a second semiconductor chip mounted on the first semiconductor chip, having a cathode terminal formed on one surface thereof, and having an anode terminal formed on the other surface thereof; a first conductive connection member having one end disposed between the collector terminal of the first semiconductor chip and the cathode terminal of the second semiconductor chip and the other end contacting the collector pattern of the circuit board; and a second conductive connection member having one end contacting the anode terminal of the second semiconductor chip and the other end contacting the emitter pattern of the circuit board.
摘要翻译：本文公开了一种功率半导体模块，包括：电路板，其上形成有栅极，发射极和集电极图案; 安装在所述电路板上的第一半导体芯片，在其一个表面上形成有栅极和发射极端子，并且在其另一个表面上形成集电极端子; 安装在所述第一半导体芯片上的第二半导体芯片，具有在其一个表面上形成的阴极端子，并且在其另一个表面上形成阳极端子; 第一导电连接构件，其一端设置在第一半导体芯片的集电极端子和第二半导体芯片的阴极端子之间，另一端接触电路板的集电体图案; 以及第二导电连接构件，其一端接触第二半导体芯片的阳极端子，另一端接触电路板的发射极图案。

9. 发明授权

US08729683B2 Power module package and method for fabricating the same 有权
标题翻译：电源模块封装及其制造方法
公开(公告)号：US08729683B2
公开(公告)日：2014-05-20
申请号：US13235176
申请日：2011-09-16
申请人： Kwang Soo Kim , Ji Hyun Park , Young Ki Lee , Seog Moon Choi
发明人： Kwang Soo Kim , Ji Hyun Park , Young Ki Lee , Seog Moon Choi
IPC分类号： H01L23/495
CPC分类号： H01L24/43 , H01L23/3107 , H01L23/49537 , H01L23/49568 , H01L23/49575 , H01L23/49586 , H01L24/48 , H01L2224/32245 , H01L2224/43 , H01L2224/48137 , H01L2224/48247 , H01L2224/73265 , H01L2224/92247 , H01L2924/00014 , H01L2924/1305 , H01L2924/13055 , H01L2924/15724 , H01L2924/181 , H01L2924/00 , H01L2224/45099 , H01L2224/05599 , H01L2924/00012
摘要： Disclosed herein are a power module package and a method for manufacturing the same. The power module package includes: first and second lead frames arranged to face each other, both or either of the first and second frames being made of aluminum; anodized layers formed on portions of the lead frame(s) made of aluminum in the first and second lead frames; and semiconductor devices mounted on first surfaces of the first and second lead frames.
摘要翻译：这里公开了功率模块封装及其制造方法。功率模块封装包括：布置成彼此面对的第一和第二引线框架，第一和第二框架中的任一个或第二框架由铝制成; 阳极氧化层形成在第一和第二引线框架中由铝制成的引线框架的部分上; 以及安装在第一和第二引线框架的第一表面上的半导体器件。

10. 发明申请

US20130341782A1 SEMICONDUCTOR PACKAGE MODULE 审中-公开
标题翻译：半导体封装模块
公开(公告)号：US20130341782A1
公开(公告)日：2013-12-26
申请号：US13614112
申请日：2012-09-13
申请人： Kwang Soo Kim , Young Ki Lee , Bum Seok Suh
发明人： Kwang Soo Kim , Young Ki Lee , Bum Seok Suh
IPC分类号： H01L23/367
CPC分类号： H01L23/49575 , H01L23/467 , H01L23/473 , H01L23/49562 , H01L25/115 , H01L25/18 , H01L2224/16 , H01L2924/1305 , H01L2924/13055 , H01L2924/00
摘要： There is provided a semiconductor package module, and more particularly, a semiconductor package module constituted by modularizing power semiconductor devices incapable of being able to be easily integrated due to heat generated therefrom. To this end, the semiconductor package module includes a plurality of semiconductor packages; and a plurality of semiconductor packages; and a heat dissipation member having a pipe shape including a flow channel formed therein and including at least one or more through holes into which the semiconductor packages are inserted.
摘要翻译：提供了一种半导体封装模块，更具体地说，一种半导体封装模块，其通过模块化功率半导体器件而构成，该半导体封装模块不能由于其产生的热而容易地集成。为此，半导体封装模块包括多个半导体封装; 和多个半导体封装; 以及散热构件，其具有包括形成在其中的流动通道的管状，并且包括至少一个或多个通孔，半导体封装被插入其中。

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