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1. 发明申请

US20130020111A1 SUBSTRATE FOR POWER MODULE PACKAGE AND METHOD FOR MANUFACTURING THE SAME 审中-公开
标题翻译：用于功率模块封装的基板及其制造方法
公开(公告)号：US20130020111A1
公开(公告)日：2013-01-24
申请号：US13253866
申请日：2011-10-05
申请人： Kyu Hwan Oh , Jong Man Kim , Seog Moon Choi , Young Hoon Kwak , Kwang Soo Kim , Young Ki Lee
发明人： Kyu Hwan Oh , Jong Man Kim , Seog Moon Choi , Young Hoon Kwak , Kwang Soo Kim , Young Ki Lee
IPC分类号： H05K1/05 , H05K1/02 , H05K3/10 , H05K1/00
CPC分类号： H05K1/053 , H01L23/142 , H01L2924/0002 , H05K2203/0315 , Y10T29/49155 , H01L2924/00
摘要： Disclosed herein are a substrate for a power module package and a method for manufacturing the same, including: a base substrate made of a metal material; an anodized layer formed on the base substrate; and a circuit layer formed on the anodized layer, wherein the anodized layer is formed to correspond to circuit patterns on the circuit layer or is formed to be divided into a plurality of areas.
摘要翻译：本文公开了一种用于功率模块封装的基板及其制造方法，包括：由金属材料制成的基底; 形成在基底基板上的阳极化层; 以及形成在所述阳极氧化层上的电路层，其中所述阳极化层形成为对应于所述电路层上的电路图案，或者形成为被划分为多个区域。

2. 发明授权

US08736077B2 Semiconductor package substrate 有权
标题翻译：半导体封装基板
公开(公告)号：US08736077B2
公开(公告)日：2014-05-27
申请号：US13308441
申请日：2011-11-30
申请人： Jong Man Kim , Young Hoon Kwak , Kyu Hwan Oh , Seog Moon Choi , Tae Hoon Kim
发明人： Jong Man Kim , Young Hoon Kwak , Kyu Hwan Oh , Seog Moon Choi , Tae Hoon Kim
IPC分类号： H01L23/488
CPC分类号： H01L23/36 , H01L21/563 , H01L23/562 , H01L24/29 , H01L24/32 , H01L24/83 , H01L2224/26145 , H01L2224/26175 , H01L2224/29076 , H01L2224/291 , H01L2224/2919 , H01L2224/32225 , H01L2224/32245 , H01L2224/83385 , H01L2224/834 , H01L2224/83411 , H01L2224/83418 , H01L2224/83447 , H01L2224/83455 , H01L2224/83464 , H01L2224/83466 , H01L2224/83471 , H01L2224/8348 , H01L2224/83484 , H01L2924/15787 , H01L2924/00014 , H01L2924/01014 , H01L2924/014 , H01L2924/0665 , H01L2924/00
摘要： Disclosed herein is a semiconductor package substrate including a base substrate, a mounting member mounted on an upper portion of the base substrate, and an adhesive layer formed between the base substrate and the mounting member, wherein the adhesive layer includes a thermally conductive adhesive and a ductile adhesive formed at the outer circumference of the thermally conductive adhesive.
摘要翻译：本发明公开了一种半导体封装基板，其包括基底基板，安装在基底基板的上部的安装部件和形成在基底基板与安装部件之间的粘合层，其中粘合层包括导热粘合剂和在导热粘合剂的外周形成的韧性粘合剂。

3. 发明授权

US09153514B2 Power module package 有权
标题翻译：电源模块封装
公开(公告)号：US09153514B2
公开(公告)日：2015-10-06
申请号：US13610680
申请日：2012-09-11
申请人： Young Ho Sohn , Young Hoon Kwak , Jong Man Kim , Kyu Hwan Oh , Tae Hyun Kim
发明人： Young Ho Sohn , Young Hoon Kwak , Jong Man Kim , Kyu Hwan Oh , Tae Hyun Kim
IPC分类号： H01L29/72 , H01L23/31 , H01L23/373 , H01L23/433 , H01L23/495
CPC分类号： H01L23/3107 , H01L23/3735 , H01L23/4334 , H01L23/49537 , H01L23/49575 , H01L24/73 , H01L2224/32225 , H01L2224/32245 , H01L2224/45144 , H01L2224/48137 , H01L2224/48227 , H01L2224/48247 , H01L2224/73265 , H01L2924/13034 , H01L2924/1305 , H01L2924/13055 , H01L2924/13091 , H01L2924/181 , H01L2924/19107 , H01L2924/00012 , H01L2924/00 , H01L2924/00014
摘要： Disclosed herein is a power module package including: a first substrate having one surface and the other surface; a second substrate contacting one surface of the first substrate; a third substrate contacting one side of the other surface of the first substrate; a first lead frame contacting the other side of the other surface of the first substrate; and a second lead frame electrically connected to the third substrate.
摘要翻译：本文公开了一种功率模块封装，包括：具有一个表面和另一个表面的第一基板; 第二基板，与第一基板的一个表面接触; 第三基板，其接触所述第一基板的另一表面的一侧; 与所述第一基板的另一表面的另一侧接触的第一引线框架; 以及电连接到第三基板的第二引线框架。

4. 发明授权

US08493167B2 Transformer having the heat radiation function 失效
标题翻译：具有放热功能的变压器
公开(公告)号：US08493167B2
公开(公告)日：2013-07-23
申请号：US12981066
申请日：2010-12-29
申请人： Jong Man Kim , Kyu Bum Han , Seog Moon Choi
发明人： Jong Man Kim , Kyu Bum Han , Seog Moon Choi
IPC分类号： H01F27/08
CPC分类号： H01F27/085
摘要： Disclosed herein is a transformer having a heat radiation function. The transformer includes a pair of cores having an E-shape and facing and contacting each other to form central pillars and outer peripheral parts, a transforming coil part wound on the central pillars of the pair of cores and dropping voltage, and a heat radiation pipe formed to have a cylindrical shape and positioned inward from the transforming coil part to radiate heat generated from the transforming coil part, thereby well discharging heat generated from the coil.
摘要翻译：这里公开了具有散热功能的变压器。变压器包括一对具有E形并且彼此面对并相互接触以形成中心柱和外围部分的一对铁芯，缠绕在一对铁芯的中心柱上的变压线圈部分和降压电压，以及散热管形成为具有圆筒形状并且位于从变压线圈部向内的位置，以辐射由变压线圈部产生的热量，从而充分地排出线圈产生的热量。

5. 发明申请

US20120105186A1 TRANSFORMER HAVING THE HEAT RADIATION FUNCTION 失效
标题翻译：具有热辐射功能的变压器
公开(公告)号：US20120105186A1
公开(公告)日：2012-05-03
申请号：US12981066
申请日：2010-12-29
申请人： Jong Man Kim , Kyu Bum Han , Seog Moon Choi
发明人： Jong Man Kim , Kyu Bum Han , Seog Moon Choi
IPC分类号： H01F27/08
CPC分类号： H01F27/085
摘要： Disclosed herein is a transformer having a heat radiation function. The transformer includes a pair of cores having an E-shape and facing and contacting each other to form central pillars and outer peripheral parts, a transforming coil part wound on the central pillars of the pair of cores and dropping voltage, and a heat radiation pipe formed to have a cylindrical shape and positioned inward from the transforming coil part to radiate heat generated from the transforming coil part, thereby well discharging heat generated from the coil.
摘要翻译：这里公开了具有散热功能的变压器。变压器包括一对具有E形并且彼此面对并相互接触以形成中心柱和外围部分的一对铁芯，缠绕在一对铁芯的中心柱上的变压线圈部分和降压电压，以及散热管形成为具有圆筒形状并且位于从变压线圈部向内的位置，以辐射由变压线圈部产生的热量，从而充分地排出线圈产生的热量。

6. 发明申请

US20130343001A1 HEAT DISSIPATION SYSTEM FOR POWER MODULE 有权
标题翻译：电源模块散热系统
公开(公告)号：US20130343001A1
公开(公告)日：2013-12-26
申请号：US13588734
申请日：2012-08-17
申请人： Young Hoon Kwak , Jong Man Kim , Young Ho Sohn
发明人： Young Hoon Kwak , Jong Man Kim , Young Ho Sohn
IPC分类号： F28D15/00 , H05K7/20
CPC分类号： H01L23/473 , H01L2924/0002 , H01L2924/00
摘要： Disclosed herein is a heat dissipation system for a power module, the heat dissipation system including: first and second heat dissipation plates spaced apart from each other while facing each other, to form a cooling medium flow passage; first and second inflow lines extended to the cooling medium flow passage of the first and second heat dissipation plates, to transfer cooling media flowing therein at different flow rates or different fluxes to the cooling medium flow passage; and first and second inlets respectively connected with the first and second inflow lines to allow the cooling media to flow therein.
摘要翻译：本发明公开了一种用于功率模块的散热系统，该散热系统包括：彼此相对隔开的第一和第二散热板，形成冷却介质流动通道; 第一和第二流入管线延伸到第一和第二散热板的冷却介质流动通道，以将流过其中的不同流量或不同通量的冷却介质转移到冷却介质流动通道; 以及分别与第一和第二流入管线连接的第一和第二入口，以允许冷却介质流入其中。

7. 发明授权

US08897011B2 Heat dissipation system for power module 有权
标题翻译：电源模块散热系统
公开(公告)号：US08897011B2
公开(公告)日：2014-11-25
申请号：US13588734
申请日：2012-08-17
申请人： Young Hoon Kwak , Jong Man Kim , Young Ho Sohn
发明人： Young Hoon Kwak , Jong Man Kim , Young Ho Sohn
IPC分类号： H05K7/20
CPC分类号： H01L23/473 , H01L2924/0002 , H01L2924/00
摘要： Disclosed herein is a heat dissipation system for a power module, the heat dissipation system including: first and second heat dissipation plates spaced apart from each other while facing each other, to form a cooling medium flow passage; first and second inflow lines extended to the cooling medium flow passage of the first and second heat dissipation plates, to transfer cooling media flowing therein at different flow rates or different fluxes to the cooling medium flow passage; and first and second inlets respectively connected with the first and second inflow lines to allow the cooling media to flow therein.
摘要翻译：本发明公开了一种用于功率模块的散热系统，该散热系统包括：彼此相对隔开的第一和第二散热板，形成冷却介质流动通道; 第一和第二流入管线延伸到第一和第二散热板的冷却介质流动通道，以将流过其中的不同流量或不同通量的冷却介质转移到冷却介质流动通道; 以及分别与第一和第二流入管线连接的第一和第二入口，以允许冷却介质流入其中。

8. 发明授权

US08809177B2 Semiconductor device and method for manufacturing the same 有权
标题翻译：半导体装置及其制造方法
公开(公告)号：US08809177B2
公开(公告)日：2014-08-19
申请号：US13599453
申请日：2012-08-30
申请人： Jong Man Kim
发明人： Jong Man Kim
IPC分类号： H01L29/788 , H01L21/78
CPC分类号： H01L21/28273 , H01L21/28247 , H01L27/11521
摘要： A semiconductor device and a method for manufacturing the same are provided. The semiconductor device includes a gate pattern formed by patterning a tunnel insulating layer, a conductive film for a floating gate, a dielectric film, a conductive film for a control gate, and a gate metal film sequentially formed on a semiconductor substrate; a first barrier film formed on side walls of the gate metal film; and a second barrier film formed on an upper surface of the gate metal film.
摘要翻译：提供半导体器件及其制造方法。半导体器件包括通过图案化隧道绝缘层，用于浮置栅极的导电膜，电介质膜，用于控制栅极的导电膜和顺序形成在半导体衬底上的栅极金属膜形成的栅极图案; 形成在栅极金属膜的侧壁上的第一阻挡膜; 以及形成在所述栅极金属膜的上表面上的第二阻挡膜。

9. 发明授权

US07883913B2 Manufacturing method of image sensor of vertical type 失效
标题翻译：垂直型图像传感器的制造方法
公开(公告)号：US07883913B2
公开(公告)日：2011-02-08
申请号：US12638121
申请日：2009-12-15
申请人： Jong Man Kim
发明人： Jong Man Kim
IPC分类号： H01L21/00
CPC分类号： H01L27/1469 , H01L27/14621 , H01L27/1463 , H01L27/14634 , H01L27/14636
摘要： A manufacturing method of an image sensor of vertical type is provided that includes: forming an insulation layer with a metal wiring and a contact plug therein on a first substrate; bonding a second substrate having an image sensing unit over the insulation layer; forming a trench in the second substrate to divide the image sensing unit for each pixel; forming a PTI by gap-filling the trench with insulating material; forming a first material layer over the PTI, the image sensing unit, and the insulation layer; and forming a second material layer over the first material layer and performing a deuterium annealing process thereon. The crystal defects of the substrate generated when performing the trench etching on the donor substrate to define unit pixels are cured by performing the deuterium annealing process, making it possible to improve the sensitivity and illumination characteristics of the image sensor of vertical type.
摘要翻译：提供垂直型图像传感器的制造方法，其包括：在第一基板上形成具有金属布线的绝缘层和接触插塞; 将具有图像感测单元的第二基板结合在所述绝缘层上; 在所述第二基板中形成沟槽，以分割每个像素的图像感测单元; 通过用绝缘材料间隙填充沟槽来形成PTI; 在PTI，图像感测单元和绝缘层上形成第一材料层; 以及在所述第一材料层上形成第二材料层并在其上进行氘退火处理。通过执行氘退火处理来使通过施主衬底进行沟槽蚀刻而形成单位像素而产生的衬底的晶体缺陷被固化，从而可以提高垂直型图像传感器的灵敏度和照明特性。

10. 发明授权

US09103710B2 Apparatus and method of monitoring flow of liquid in pipe 有权
标题翻译：监测管道中液体流动的装置和方法
公开(公告)号：US09103710B2
公开(公告)日：2015-08-11
申请号：US13334584
申请日：2011-12-22
申请人： Tae Joon Kim , Ji Young Jeong , Yong Bum Lee , In Koo Hwang , Jae Hyuk Eoh , Jong Man Kim , Yeong Ii Kim
发明人： Tae Joon Kim , Ji Young Jeong , Yong Bum Lee , In Koo Hwang , Jae Hyuk Eoh , Jong Man Kim , Yeong Ii Kim
IPC分类号： G01F1/68 , G01F23/24 , G01F1/688
CPC分类号： G01F23/241 , G01F1/6888 , G01F23/248
摘要： An apparatus and method for monitoring a flow of liquid in a pipe are provided. The apparatus may include a temperature sensor attached to a pipe of a heat exchanger system to measure a temperature of the pipe, and a controller to determine whether a liquid is present in the pipe, based on a change in the measured temperature.
摘要翻译：提供一种用于监测管道中液体流动的装置和方法。该装置可以包括附接到热交换器系统的管道以测量管道的温度的温度传感器，以及基于测量温度的变化来确定管道中是否存在液体的控制器。

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