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1. 发明授权

US07205501B2 Laser machining method and laser machining apparatus 有权
标题翻译：激光加工方法和激光加工设备
公开(公告)号：US07205501B2
公开(公告)日：2007-04-17
申请号：US10927185
申请日：2004-08-27
申请人： Kunio Arai , Kazuhisa Ishii , Hiroaki Ashizawa
发明人： Kunio Arai , Kazuhisa Ishii , Hiroaki Ashizawa
IPC分类号： B23K26/38
CPC分类号： H05K3/0038 , B23K26/04 , B23K26/0622 , B23K26/384 , B23K2101/42 , B23K2103/12
摘要： A laser machining method and a laser machining apparatus superior in hole position accuracy and hole quality. An outgoing beam outputted as short pulses is shaped by a pulse shaping unit so as to form a #1 branch beam. The #1 branch beam is supplied to a portion to be machined, so as to machine the portion. In this case, the #1 branch beam may be controlled to synchronize with the outgoing beam. When a piece to be machined is made from a metal material and at least one of an organic material and an inorganic material, the metal material is machined with a laser beam shaped to have a pulse width not shorter than 100 ns, and at least one of the organic material and the inorganic material is machined with a laser beam shaped to have a pulse width shorter than 100 ns.
摘要翻译：激光加工方法和激光加工装置，其孔位精度和孔质量优异。作为短脉冲输出的输出光束通过脉冲整形单元成形，从而形成＃1分支光束。将＃1分支光束供给到要加工的部分，以便加工该部分。在这种情况下，可以控制＃1分支光束与输出光束同步。当要被加工的零件由金属材料和有机材料和无机材料中的至少一种制成时，金属材料被加工成具有不小于100ns的脉冲宽度的激光束，并且至少一个的有机材料和无机材料用激光束加工成具有短于100ns的脉冲宽度。

2. 发明申请

US20050155958A1 Laser machining method and laser machining apparatus 有权
标题翻译：激光加工方法和激光加工设备
公开(公告)号：US20050155958A1
公开(公告)日：2005-07-21
申请号：US10927185
申请日：2004-08-27
申请人： Kunio Arai , Kazuhisa Ishii , Hiroaki Ashizawa
发明人： Kunio Arai , Kazuhisa Ishii , Hiroaki Ashizawa
IPC分类号： B23K26/04 , B23K26/06 , B23K26/073 , B23K101/40 , B23K101/42 , H05K3/00 , B23K26/40
CPC分类号： H05K3/0038 , B23K26/04 , B23K26/0622 , B23K26/384 , B23K2101/42 , B23K2103/12
摘要： A laser machining method and a laser machining apparatus superior in hole position accuracy and hole quality. An outgoing beam outputted as short pulses is shaped by a pulse shaping unit so as to form a #1 branch beam. The #1 branch beam is supplied to a portion to be machined, so as to machine the portion. In this case, the #1 branch beam may be controlled to synchronize with the outgoing beam. When a piece to be machined is made from a metal material and at least one of an organic material and an inorganic material, the metal material is machined with a laser beam shaped to have a pulse width not shorter than 100 ns, and at least one of the organic material and the inorganic material is machined with a laser beam shaped to have a pulse width shorter than 100 ns.
摘要翻译：激光加工方法和激光加工装置，其孔位精度和孔质量优异。作为短脉冲输出的输出光束通过脉冲整形单元成形，从而形成＃1分支光束。将＃1分支光束供给到要加工的部分，以便加工该部分。在这种情况下，可以控制＃1分支光束与输出光束同步。当要被加工的零件由金属材料和有机材料和无机材料中的至少一种制成时，金属材料被加工成具有不小于100ns的脉冲宽度的激光束，并且至少一个的有机材料和无机材料用激光束加工成具有短于100ns的脉冲宽度。

3. 发明申请

US20060076323A1 Method and apparatus for laser drilling 审中-公开
标题翻译：激光钻孔的方法和装置
公开(公告)号：US20060076323A1
公开(公告)日：2006-04-13
申请号：US11243998
申请日：2005-10-06
申请人： Kunio Arai , Kazuhisa Ishii
发明人： Kunio Arai , Kazuhisa Ishii
IPC分类号： B23K26/38
CPC分类号： B23K26/0846 , B23K26/18 , B23K26/382 , B23K26/40 , B23K2101/35 , B23K2103/12 , B23K2103/172 , B23K2103/42 , B23K2103/50 , H05K1/0393 , H05K3/0038 , H05K2201/0394 , H05K2203/0156 , H05K2203/1545 , Y10T156/1158 , Y10T156/19
摘要： There is provided a laser drilling method that prevents hanging, expansion, or crinkles of copper foil caused when an ultraviolet laser beam that requires no surface roughening is used for a thin double-sided copper-clad film. The drilling method of the copper-clad film comprises the steps of: using an ultraviolet laser as a laser beam; drilling after bonding a resin film to the backside of the film which is the opposite side to the laser-beam-incidence; and delaminating the resin film on the backside after drilling. The resin film bonded to the backside prevents the copper foil from hanging, thus allowing the laser beam to be efficiently applied to the copper foil, and allowing the copper foil to be completely removed by ablation. In the case of a blind hole, the resin film bonded to the backside prevents expansion of the copper foil. Crinkles can be also prevented.
摘要翻译：提供了一种激光打孔方法，当不需要表面粗糙化的紫外线激光束用于薄的双面覆铜膜时，防止铜箔的悬挂，膨胀或皱缩。铜包膜的钻孔方法包括以下步骤：使用紫外线激光器作为激光束; 在将树脂膜粘合到与激光束入射的相反侧的膜的背面之后进行钻孔; 并在钻孔后在背面剥离树脂膜。结合到背面的树脂膜防止铜箔悬垂，从而允许激光束有效地施加到铜箔上，并且通过烧蚀使铜箔完全去除。在盲孔的情况下，结合到背面的树脂膜防止铜箔膨胀。也可以防止皱纹。

4. 发明申请

US20120031147A1 Method and Apparatus for Machining Thin-Film Layer of Workpiece 审中-公开
标题翻译：加工薄膜薄膜层的方法与装置
公开(公告)号：US20120031147A1
公开(公告)日：2012-02-09
申请号：US13254155
申请日：2010-02-24
申请人： Kunio Arai , Yasuhiko Kanaya , Kazuhisa Ishii , Hiroshi Honda
发明人： Kunio Arai , Yasuhiko Kanaya , Kazuhisa Ishii , Hiroshi Honda
IPC分类号： C03B35/24 , C03B23/02
CPC分类号： B23K37/0408 , B23K26/0006 , B23K26/0853 , B23K26/146 , B23K26/364 , B23K26/40 , B23K26/53 , B23K2103/16 , B23K2103/172 , B65G49/064 , B65G2249/045 , H01L21/6838 , H01L31/18
摘要： An apparatus for machining a thin-film layer of a workpiece, which is a transparent glass on which a thin-film layer is disposed on a top surface thereof, includes a workpiece-underside support mechanism for supporting the workpiece in a vertical direction by an air floatation mechanism and a suction mechanism, a clamp device for gripping the workpiece so as to follow the movement in the vertical direction of the workpiece, and a machining head for machining the thin-film layer with a laser beam. The machining head machines the thin-film layer on the top surface of the workpiece by irradiating the workpiece with a laser beam entering through the underside of the workpiece. Further including nozzles, the thin-film layer is machined while the cooling medium is delivered from the nozzles disposed by the thin-film layer side.
摘要翻译：作为在其上表面设置有薄膜层的透明玻璃的工件的薄膜层的加工装置包括：工件下侧支撑机构，用于将工件沿垂直方向支撑，空气浮起机构和抽吸机构，用于夹持工件以沿着工件的垂直方向移动的夹紧装置，以及用激光束加工薄膜层的加工头。加工头通过用通过工件下侧进入的激光束照射工件来在工件的顶表面上加工薄膜层。进一步包括喷嘴，在从由薄膜层侧设置的喷嘴输送冷却介质的同时加工薄膜层。

5. 发明授权

US06531677B2 Method and apparatus for drilling printed wiring boards 失效
标题翻译：印刷线路板钻孔方法和装置
公开(公告)号：US06531677B2
公开(公告)日：2003-03-11
申请号：US09970909
申请日：2001-10-05
申请人： Kunio Arai , Kazuhisa Ishii , Yasuhiko Kita
发明人： Kunio Arai , Kazuhisa Ishii , Yasuhiko Kita
IPC分类号： B23K2638
CPC分类号： B23K26/0613 , B23K26/0604 , B23K26/067 , B23K26/389 , H05K1/0366 , H05K3/0035 , H05K3/0038 , H05K2203/108
摘要： An improved method and apparatus for drilling blind via holes to connect between upper conductive layers and lower conductive layers of printed wiring boards with laser lights. The resin layer contacting the targeted conductive layer is drilled to remain the residual layer with laser lights, and the residual layer is removed with a UV laser beam whose energy density is lower than the decomposition energy threshold of the conductive layer and higher than that of the resin layer. The apparatus for this drilling has at least two laser paths. The spatial energy distributions are made top-hat-shaped with beam homogenizer units in the paths, and the diameters and the energy densities are adjusted independently.
摘要翻译：一种用于钻孔盲孔的改进方法和装置，以连接具有激光的印刷线路板的上导电层和下导电层。钻孔与目标导电层接触的树脂层用激光保持残留层，残余层用能量密度低于导电层分解能阈值的紫外激光束去除，高于树脂层。用于该钻孔的装置具有至少两个激光路径。空间能量分布由路径中的光束均化器单元制成顶帽形，直径和能量密度独立调整。

6. 发明申请

US20080008854A1 Composite sheet, machining method for composite sheet and laser machining apparatus 审中-公开
标题翻译：复合片材，复合片材加工方法及激光加工设备
公开(公告)号：US20080008854A1
公开(公告)日：2008-01-10
申请号：US11808248
申请日：2007-06-07
申请人： Kunio Arai , Tadashi Matsumoto , Hiromi Nishiyama , Kazuhisa Ishii
发明人： Kunio Arai , Tadashi Matsumoto , Hiromi Nishiyama , Kazuhisa Ishii
IPC分类号： B32B3/10 , B23K26/00 , B29C35/08
CPC分类号： B23K26/082 , B23K26/067 , B23K26/384 , B23K26/389 , B23K2101/34 , B23K2101/40 , Y10T428/24298 , Y10T428/24306
摘要： A composite sheet whose product price can be reduced with a smaller number of manufacturing processes. A laser oscillator outputs a pulsed beam at a frequency f. A mask shapes the outer shape of the beam into a triangular, quadrangular or hexagonal shape. N pieces of time-sharing means time-share the beam to form N beams having a frequency f/N. N pairs of positioning means position the time-shared beams. A condensing lens condenses the beams. A rotating drum displaces a workpiece. A control means controls the time-sharing means, the N pairs of positioning means and a pedestal. The N pairs of positioning means are positioned to irradiate predetermined positions with the beams. The pedestal is moved. The time-sharing means are thereupon operated in predetermined order. The workpiece is machined to make holes whose outer shapes depend on the mask so that distances between sides of adjacent holes are equal to one another.
摘要翻译：一种复合片材，其制造价格可以减少，制造工艺数量较少。激光振荡器以频率 f输出脉冲波束。掩模将光束的外部形状形成为三角形，四边形或六边形形状。 N个分时装置意味着时间共享波束以形成具有频率f / N的N个波束。 N对定位装置定时共享光束。聚光镜聚光。旋转的滚筒移动工件。控制装置控制分时装置，N对定位装置和基座。 N对定位装置定位成用梁照射预定位置。基座移动。分时装置随后以预定的顺序操作。加工工件以形成其外形取决于掩模的孔，使得相邻孔的侧面之间的距离彼此相等。

7. 发明授权

US07361718B2 Alkali-soluble gap fill material forming composition for lithography 有权
标题翻译：用于光刻的碱溶性间隙填充材料形成组合物
公开(公告)号：US07361718B2
公开(公告)日：2008-04-22
申请号：US10540389
申请日：2003-12-25
申请人： Satoshi Takei , Kazuhisa Ishii , Shinya Arase
发明人： Satoshi Takei , Kazuhisa Ishii , Shinya Arase
IPC分类号： C08F212/02 , C08F20/06
CPC分类号： H01L21/02118 , G03F7/094 , G03F7/11 , H01L21/0274 , H01L21/31058 , H01L21/31133 , H01L21/31144 , H01L21/312 , H01L21/76224 , H01L21/76808
摘要： There is provided a gap fill material forming composition for lithography that is used in dual damascene process and contributes toward an improvement in production efficiency. Concretely, it is a gap fill material forming composition characterized in that the composition is used in manufacture of semiconductor device by a method comprising coating a photoresist on a substrate having a hole with aspect ratio shown in height/diameter of 1 or more, and transferring an image to the substrate by use of lithography process, and that the composition is coated on the substrate prior to coating of the photoresist, and comprises a polymer having a hydroxy group or a carboxy group and a crosslinking agent. The gap fill material layer obtained from the gap fill material forming composition can be etched back with an alkaline aqueous solution.
摘要翻译：提供了用于光刻的间隙填充材料形成组合物，其用于双镶嵌工艺，并有助于提高生产效率。具体地说，它是间隙填充材料形成组合物，其特征在于该组合物用于制造半导体器件，方法包括在具有高度/直径为1或更大的长宽比的孔的基底上涂覆光致抗蚀剂，并且转移通过使用平版印刷方法将图像转印到基板上，并且在涂覆光致抗蚀剂之前将组合物涂覆在基材上，并且包含具有羟基或羧基的聚合物和交联剂。从间隙填充材料形成组合物获得的间隙填充材料层可以用碱性水溶液回蚀。

8. 发明授权

US06520670B2 Light radiating device with large beam spot size and spatial optical communication device 有权
公开(公告)号：US06520670B2
公开(公告)日：2003-02-18
申请号：US09938324
申请日：2001-08-23
申请人： Ji Hao Liang , Kazuhisa Ishii , Tsuyoshi Maruyama
发明人： Ji Hao Liang , Kazuhisa Ishii , Tsuyoshi Maruyama
IPC分类号： H01L2331
CPC分类号： H01L33/58 , F21V5/002 , H01L2933/0091 , Y10S362/80
摘要： A light diffusion sheet receives light fluxes radiated from a light radiating element at a first plane of the light diffusion sheet and scatters or diffracts the received light fluxes, and radiates the scattered or diffracted light from an opposite second plane. A light distributing member distributes the light radiated from the second plane of the light diffusion sheet along some direction. A light radiating device is provided which has a relatively large light beam spot.

9. 发明授权

US08007979B2 Acrylic polymer-containing gap fill material forming composition for lithography 有权
标题翻译：含丙烯酸聚合物的间隙填充材料形成组合物用于光刻
公开(公告)号：US08007979B2
公开(公告)日：2011-08-30
申请号：US10544129
申请日：2004-02-20
申请人： Satoshi Takei , Kazuhisa Ishii , Takahiro Kishioka , Yasushi Sakaida
发明人： Satoshi Takei , Kazuhisa Ishii , Takahiro Kishioka , Yasushi Sakaida
IPC分类号： G03F7/004 , G03F7/032 , G03F7/033 , G03F7/26
CPC分类号： G03F7/094 , G03F7/038 , Y10S430/109 , Y10S430/128
摘要： There is provided a gap fill material forming composition for lithography that is used in dual damascene process and is excellent in flattening property and fill property. Concretely, it is a gap fill material forming composition characterized in that the composition is used in manufacture of semiconductor device by a method comprising coating a photoresist on a semiconductor substrate having a hole with aspect ratio shown in height/diameter of 1 or more, and transferring an image to the semiconductor substrate by use of lithography process, and that comprises a polymer, a crosslinking agent and a solvent.
摘要翻译：提供了一种用于光刻的间隙填充材料形成组合物，其用于双镶嵌工艺，并且具有优异的压平性能和填充性能。具体地说，它是一种间隙填充材料形成组合物，其特征在于该组合物用于制造半导体器件，方法包括在具有高度/直径为1或更大的高宽比的孔的半导体衬底上涂覆光致抗蚀剂，以及通过使用光刻工艺将图像转印到半导体衬底，并且包括聚合物，交联剂和溶剂。

10. 发明申请

US20060041078A1 Alkali-soluble gap filling material forming composition for lithography 有权
标题翻译：用于光刻的碱溶性间隙填充材料形成组合物
公开(公告)号：US20060041078A1
公开(公告)日：2006-02-23
申请号：US10540389
申请日：2003-12-25
申请人： Satoshi Takei , Kazuhisa Ishii , Shinya Arase
发明人： Satoshi Takei , Kazuhisa Ishii , Shinya Arase
IPC分类号： C08F120/62
CPC分类号： H01L21/02118 , G03F7/094 , G03F7/11 , H01L21/0274 , H01L21/31058 , H01L21/31133 , H01L21/31144 , H01L21/312 , H01L21/76224 , H01L21/76808
摘要： There is provided a gap fill material forming composition for lithography that is used in dual damascene process and contributes toward an improvement in production efficiency. Concretely, it is a gap fill material forming composition characterized in that the composition is used in manufacture of semiconductor device by a method comprising coating a photoresist on a substrate having a hole with aspect ratio shown in height/diameter of 1 or more, and transferring an image to the substrate by use of lithography process, and that the composition is coated on the substrate prior to coating of the photoresist, and comprises a polymer having a hydroxy group or a carboxy group and a crosslinking agent. The gap fill material layer obtained from the gap fill material forming composition can be etched back with an alkaline aqueous solution.
摘要翻译：提供了用于光刻的间隙填充材料形成组合物，其用于双镶嵌工艺，并有助于提高生产效率。具体地说，它是间隙填充材料形成组合物，其特征在于该组合物用于制造半导体器件，方法包括在具有高度/直径为1或更大的长宽比的孔的基底上涂覆光致抗蚀剂，并且转移通过使用平版印刷方法将图像转印到基板上，并且在涂覆光致抗蚀剂之前将组合物涂覆在基材上，并且包含具有羟基或羧基的聚合物和交联剂。从间隙填充材料形成组合物获得的间隙填充材料层可以用碱性水溶液回蚀。

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