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1. 发明授权

US07205501B2 Laser machining method and laser machining apparatus 有权
标题翻译：激光加工方法和激光加工设备
公开(公告)号：US07205501B2
公开(公告)日：2007-04-17
申请号：US10927185
申请日：2004-08-27
申请人： Kunio Arai , Kazuhisa Ishii , Hiroaki Ashizawa
发明人： Kunio Arai , Kazuhisa Ishii , Hiroaki Ashizawa
IPC分类号： B23K26/38
CPC分类号： H05K3/0038 , B23K26/04 , B23K26/0622 , B23K26/384 , B23K2101/42 , B23K2103/12
摘要： A laser machining method and a laser machining apparatus superior in hole position accuracy and hole quality. An outgoing beam outputted as short pulses is shaped by a pulse shaping unit so as to form a #1 branch beam. The #1 branch beam is supplied to a portion to be machined, so as to machine the portion. In this case, the #1 branch beam may be controlled to synchronize with the outgoing beam. When a piece to be machined is made from a metal material and at least one of an organic material and an inorganic material, the metal material is machined with a laser beam shaped to have a pulse width not shorter than 100 ns, and at least one of the organic material and the inorganic material is machined with a laser beam shaped to have a pulse width shorter than 100 ns.
摘要翻译：激光加工方法和激光加工装置，其孔位精度和孔质量优异。作为短脉冲输出的输出光束通过脉冲整形单元成形，从而形成＃1分支光束。将＃1分支光束供给到要加工的部分，以便加工该部分。在这种情况下，可以控制＃1分支光束与输出光束同步。当要被加工的零件由金属材料和有机材料和无机材料中的至少一种制成时，金属材料被加工成具有不小于100ns的脉冲宽度的激光束，并且至少一个的有机材料和无机材料用激光束加工成具有短于100ns的脉冲宽度。

2. 发明申请

US20050155958A1 Laser machining method and laser machining apparatus 有权
标题翻译：激光加工方法和激光加工设备
公开(公告)号：US20050155958A1
公开(公告)日：2005-07-21
申请号：US10927185
申请日：2004-08-27
申请人： Kunio Arai , Kazuhisa Ishii , Hiroaki Ashizawa
发明人： Kunio Arai , Kazuhisa Ishii , Hiroaki Ashizawa
IPC分类号： B23K26/04 , B23K26/06 , B23K26/073 , B23K101/40 , B23K101/42 , H05K3/00 , B23K26/40
CPC分类号： H05K3/0038 , B23K26/04 , B23K26/0622 , B23K26/384 , B23K2101/42 , B23K2103/12
摘要： A laser machining method and a laser machining apparatus superior in hole position accuracy and hole quality. An outgoing beam outputted as short pulses is shaped by a pulse shaping unit so as to form a #1 branch beam. The #1 branch beam is supplied to a portion to be machined, so as to machine the portion. In this case, the #1 branch beam may be controlled to synchronize with the outgoing beam. When a piece to be machined is made from a metal material and at least one of an organic material and an inorganic material, the metal material is machined with a laser beam shaped to have a pulse width not shorter than 100 ns, and at least one of the organic material and the inorganic material is machined with a laser beam shaped to have a pulse width shorter than 100 ns.
摘要翻译：激光加工方法和激光加工装置，其孔位精度和孔质量优异。作为短脉冲输出的输出光束通过脉冲整形单元成形，从而形成＃1分支光束。将＃1分支光束供给到要加工的部分，以便加工该部分。在这种情况下，可以控制＃1分支光束与输出光束同步。当要被加工的零件由金属材料和有机材料和无机材料中的至少一种制成时，金属材料被加工成具有不小于100ns的脉冲宽度的激光束，并且至少一个的有机材料和无机材料用激光束加工成具有短于100ns的脉冲宽度。

3. 发明申请

US20120031147A1 Method and Apparatus for Machining Thin-Film Layer of Workpiece 审中-公开
标题翻译：加工薄膜薄膜层的方法与装置
公开(公告)号：US20120031147A1
公开(公告)日：2012-02-09
申请号：US13254155
申请日：2010-02-24
申请人： Kunio Arai , Yasuhiko Kanaya , Kazuhisa Ishii , Hiroshi Honda
发明人： Kunio Arai , Yasuhiko Kanaya , Kazuhisa Ishii , Hiroshi Honda
IPC分类号： C03B35/24 , C03B23/02
CPC分类号： B23K37/0408 , B23K26/0006 , B23K26/0853 , B23K26/146 , B23K26/364 , B23K26/40 , B23K26/53 , B23K2103/16 , B23K2103/172 , B65G49/064 , B65G2249/045 , H01L21/6838 , H01L31/18
摘要： An apparatus for machining a thin-film layer of a workpiece, which is a transparent glass on which a thin-film layer is disposed on a top surface thereof, includes a workpiece-underside support mechanism for supporting the workpiece in a vertical direction by an air floatation mechanism and a suction mechanism, a clamp device for gripping the workpiece so as to follow the movement in the vertical direction of the workpiece, and a machining head for machining the thin-film layer with a laser beam. The machining head machines the thin-film layer on the top surface of the workpiece by irradiating the workpiece with a laser beam entering through the underside of the workpiece. Further including nozzles, the thin-film layer is machined while the cooling medium is delivered from the nozzles disposed by the thin-film layer side.
摘要翻译：作为在其上表面设置有薄膜层的透明玻璃的工件的薄膜层的加工装置包括：工件下侧支撑机构，用于将工件沿垂直方向支撑，空气浮起机构和抽吸机构，用于夹持工件以沿着工件的垂直方向移动的夹紧装置，以及用激光束加工薄膜层的加工头。加工头通过用通过工件下侧进入的激光束照射工件来在工件的顶表面上加工薄膜层。进一步包括喷嘴，在从由薄膜层侧设置的喷嘴输送冷却介质的同时加工薄膜层。

4. 发明授权

US06531677B2 Method and apparatus for drilling printed wiring boards 失效
标题翻译：印刷线路板钻孔方法和装置
公开(公告)号：US06531677B2
公开(公告)日：2003-03-11
申请号：US09970909
申请日：2001-10-05
申请人： Kunio Arai , Kazuhisa Ishii , Yasuhiko Kita
发明人： Kunio Arai , Kazuhisa Ishii , Yasuhiko Kita
IPC分类号： B23K2638
CPC分类号： B23K26/0613 , B23K26/0604 , B23K26/067 , B23K26/389 , H05K1/0366 , H05K3/0035 , H05K3/0038 , H05K2203/108
摘要： An improved method and apparatus for drilling blind via holes to connect between upper conductive layers and lower conductive layers of printed wiring boards with laser lights. The resin layer contacting the targeted conductive layer is drilled to remain the residual layer with laser lights, and the residual layer is removed with a UV laser beam whose energy density is lower than the decomposition energy threshold of the conductive layer and higher than that of the resin layer. The apparatus for this drilling has at least two laser paths. The spatial energy distributions are made top-hat-shaped with beam homogenizer units in the paths, and the diameters and the energy densities are adjusted independently.
摘要翻译：一种用于钻孔盲孔的改进方法和装置，以连接具有激光的印刷线路板的上导电层和下导电层。钻孔与目标导电层接触的树脂层用激光保持残留层，残余层用能量密度低于导电层分解能阈值的紫外激光束去除，高于树脂层。用于该钻孔的装置具有至少两个激光路径。空间能量分布由路径中的光束均化器单元制成顶帽形，直径和能量密度独立调整。

5. 发明申请

US20060076323A1 Method and apparatus for laser drilling 审中-公开
标题翻译：激光钻孔的方法和装置
公开(公告)号：US20060076323A1
公开(公告)日：2006-04-13
申请号：US11243998
申请日：2005-10-06
申请人： Kunio Arai , Kazuhisa Ishii
发明人： Kunio Arai , Kazuhisa Ishii
IPC分类号： B23K26/38
CPC分类号： B23K26/0846 , B23K26/18 , B23K26/382 , B23K26/40 , B23K2101/35 , B23K2103/12 , B23K2103/172 , B23K2103/42 , B23K2103/50 , H05K1/0393 , H05K3/0038 , H05K2201/0394 , H05K2203/0156 , H05K2203/1545 , Y10T156/1158 , Y10T156/19
摘要： There is provided a laser drilling method that prevents hanging, expansion, or crinkles of copper foil caused when an ultraviolet laser beam that requires no surface roughening is used for a thin double-sided copper-clad film. The drilling method of the copper-clad film comprises the steps of: using an ultraviolet laser as a laser beam; drilling after bonding a resin film to the backside of the film which is the opposite side to the laser-beam-incidence; and delaminating the resin film on the backside after drilling. The resin film bonded to the backside prevents the copper foil from hanging, thus allowing the laser beam to be efficiently applied to the copper foil, and allowing the copper foil to be completely removed by ablation. In the case of a blind hole, the resin film bonded to the backside prevents expansion of the copper foil. Crinkles can be also prevented.
摘要翻译：提供了一种激光打孔方法，当不需要表面粗糙化的紫外线激光束用于薄的双面覆铜膜时，防止铜箔的悬挂，膨胀或皱缩。铜包膜的钻孔方法包括以下步骤：使用紫外线激光器作为激光束; 在将树脂膜粘合到与激光束入射的相反侧的膜的背面之后进行钻孔; 并在钻孔后在背面剥离树脂膜。结合到背面的树脂膜防止铜箔悬垂，从而允许激光束有效地施加到铜箔上，并且通过烧蚀使铜箔完全去除。在盲孔的情况下，结合到背面的树脂膜防止铜箔膨胀。也可以防止皱纹。

6. 发明申请

US20080008854A1 Composite sheet, machining method for composite sheet and laser machining apparatus 审中-公开
标题翻译：复合片材，复合片材加工方法及激光加工设备
公开(公告)号：US20080008854A1
公开(公告)日：2008-01-10
申请号：US11808248
申请日：2007-06-07
申请人： Kunio Arai , Tadashi Matsumoto , Hiromi Nishiyama , Kazuhisa Ishii
发明人： Kunio Arai , Tadashi Matsumoto , Hiromi Nishiyama , Kazuhisa Ishii
IPC分类号： B32B3/10 , B23K26/00 , B29C35/08
CPC分类号： B23K26/082 , B23K26/067 , B23K26/384 , B23K26/389 , B23K2101/34 , B23K2101/40 , Y10T428/24298 , Y10T428/24306
摘要： A composite sheet whose product price can be reduced with a smaller number of manufacturing processes. A laser oscillator outputs a pulsed beam at a frequency f. A mask shapes the outer shape of the beam into a triangular, quadrangular or hexagonal shape. N pieces of time-sharing means time-share the beam to form N beams having a frequency f/N. N pairs of positioning means position the time-shared beams. A condensing lens condenses the beams. A rotating drum displaces a workpiece. A control means controls the time-sharing means, the N pairs of positioning means and a pedestal. The N pairs of positioning means are positioned to irradiate predetermined positions with the beams. The pedestal is moved. The time-sharing means are thereupon operated in predetermined order. The workpiece is machined to make holes whose outer shapes depend on the mask so that distances between sides of adjacent holes are equal to one another.
摘要翻译：一种复合片材，其制造价格可以减少，制造工艺数量较少。激光振荡器以频率 f输出脉冲波束。掩模将光束的外部形状形成为三角形，四边形或六边形形状。 N个分时装置意味着时间共享波束以形成具有频率f / N的N个波束。 N对定位装置定时共享光束。聚光镜聚光。旋转的滚筒移动工件。控制装置控制分时装置，N对定位装置和基座。 N对定位装置定位成用梁照射预定位置。基座移动。分时装置随后以预定的顺序操作。加工工件以形成其外形取决于掩模的孔，使得相邻孔的侧面之间的距离彼此相等。

7. 发明授权

US08366903B2 Method for manufacturing printed wiring board and electrolytic etching solution for use in the manufacturing method 有权
标题翻译：用于制造方法的印刷线路板和电解蚀刻溶液的制造方法
公开(公告)号：US08366903B2
公开(公告)日：2013-02-05
申请号：US12222995
申请日：2008-08-21
申请人： Toshinori Kawamura , Haruo Akahoshi , Kunio Arai
发明人： Toshinori Kawamura , Haruo Akahoshi , Kunio Arai
IPC分类号： H05K3/07
CPC分类号： H05K3/07 , H05K3/0035 , H05K3/0038 , H05K3/0055 , H05K2201/0112 , H05K2203/0315 , H05K2203/0346
摘要： In a method of manufacturing a printed wiring board, a via reaches from a surface copper layer to an inner-layer copper layer of a multilayer board, and copper layers and insulating layers are alternately layered. The wiring board is machined by a laser, and a process of machining the via includes forming a laser absorbing layer on a surface of a copper layer disposed on the surface of the multilayer board. The laser is irradiated, and an electrolytic etching and removal of the laser absorbing layer is carried out in this order.
摘要翻译：在制造印刷电路板的方法中，通孔从多层板的表面铜层到内层铜层到达，铜层和绝缘层交替层叠。接线板由激光加工，加工通孔的工序包括在设置在多层板的表面上的铜层的表面上形成激光吸收层。对激光进行照射，依次进行激光吸收层的电解蚀刻和去除。

8. 发明申请

US20110036493A1 SURFACE TREATMENT METHOD FOR COPPER AND SURFACE TREATMENT METHOD FOR PRINTED WIRING BOARD 审中-公开
标题翻译：用于印刷线路板的铜和表面处理方法的表面处理方法
公开(公告)号：US20110036493A1
公开(公告)日：2011-02-17
申请号：US12921656
申请日：2009-02-25
申请人： Toshinori Kawamura , Haruo Akahoshi , Kunio Arai
发明人： Toshinori Kawamura , Haruo Akahoshi , Kunio Arai
IPC分类号： B29C65/16 , C25D11/34
CPC分类号： H05K3/0038 , C25D7/0614 , C25D11/34 , H05K3/4652 , H05K2201/0112 , H05K2203/0315
摘要： The present invention provides a surface treatment method for a printed wiring board to form cupric oxide on a surface of an outer layer of copper foil of a laminated board formed by laminating copper foils to base resin layers the cupric oxide being formed to have thickness 0.6 μm to 3.0 μm by performing electrolytic anodizing in an alkaline aqueous solution containing copper oxide ions at a concentration of more than 0.001 mol/l but not more than the saturation point, under the conditions that the electrolytic solution contains sodium hydroxide or potassium hydroxide of 2 mol/l to 6 mol/l and liquid temperature is 50° C. to 90° C.
摘要翻译：本发明提供一种印刷线路板的表面处理方法，该印刷线路板在层压板的铜箔的外层的表面上形成氧化铜，所述层压板通过将铜箔层叠到形成为厚度为0.6μm的氧化铜的基础树脂层而形成通过在浓度大于0.001mol / l且不大于饱和点的含有氧化铜离子的碱性水溶液中，在电解液含有2mol的氢氧化钠或氢氧化钾的条件下进行电解阳极氧化至3.0μm / l至6mol / l，液体温度为50℃至90℃

9. 发明申请

US20080283491A1 Fabrication method of printed circuit board and printed circuit board machining apparatus 有权
标题翻译：印刷电路板和印刷电路板加工设备的制造方法
公开(公告)号：US20080283491A1
公开(公告)日：2008-11-20
申请号：US11987980
申请日：2007-12-06
申请人： Kunio Arai , Hiroshi Aoyama , Yasuhiko Kanaya
发明人： Kunio Arai , Hiroshi Aoyama , Yasuhiko Kanaya
IPC分类号： H01B13/00
CPC分类号： H05K3/465 , B23K26/0604 , B23K26/0661 , B23K26/0738 , B23K26/082 , B23K26/382 , B23K26/40 , B23K2101/35 , B23K2101/42 , B23K2103/16 , B23K2103/42 , B23K2103/50 , H05K3/0032 , H05K3/0035 , H05K3/045 , H05K3/107 , H05K3/16 , H05K3/4661 , H05K2201/0166 , H05K2201/09563 , H05K2203/0557 , H05K2203/108 , Y10T29/49155
摘要： There is provided a printed circuit board whose peel strength is large and a printed circuit board fabrication method and a printed circuit board machining apparatus that allow a fabrication time and a fabrication cost to be reduced. The fabrication method of the printed circuit board comprises steps of forming a resist layer on a surface of the printed circuit board whose surface is made of an insulator, of forming a hole that is connected from the surface of the resist layer to a conductor pattern of an inner layer and a hole and grooves having a depth not connected with the conductor layer of the inner layer by irradiating lasers, of filling a conductive material into the holes and the grooves to form a conductor pattern and of removing the resist layer to project a portion of the conductor pattern out of the surface of the insulating layer.
摘要翻译：提供了剥离强度大的印刷电路板和允许制造时间和制造成本降低的印刷电路板制造方法和印刷电路板加工装置。印刷电路板的制造方法包括以下步骤：在其表面由绝缘体制成的印刷电路板的表面上形成抗蚀剂层，形成从抗蚀剂层的表面连接到孔的导体图案内层和孔以及通过照射激光而不与内层的导体层连接的深度的凹槽，将导电材料填充到孔和凹槽中以形成导体图案并且去除抗蚀剂层以投射导体图案的部分从绝缘层的表面出来。

10. 发明授权

US6043453A Apparatus for laser processing with a mechanical cutter 失效
标题翻译：用机械切割机进行激光加工的设备
公开(公告)号：US6043453A
公开(公告)日：2000-03-28
申请号：US41005
申请日：1998-03-12
申请人： Kunio Arai
发明人： Kunio Arai
IPC分类号： B23K26/02 , B23K26/06 , B23K26/067 , B23K26/073 , B23K26/28 , H01L21/48 , B23K26/00
CPC分类号： B23K26/0738 , B23K26/037 , B23K26/066 , B23K26/067 , B23K26/28 , H01L21/4803 , H01L21/4864 , H05K2203/0228 , H05K2203/056
摘要： The apparatus is for spot-facing for exposing an inner-layer conductor embedded in an insulator of a printed circuit board. The spot-facing removes the entire insulator by a mechanical cutter, except a remaining part thereof, to a position just above the inner-layer conductor. The remaining part of the insulator is smaller in thickness than the insulator removed by the mechanical cutter. Then, the remaining part of the insulator is removed by scanning the part with a laser beam to expose the inner-layer conductor. The laser beam is in a slender (elongated) shape almost perpendicular to the scanning direction of the laser beam and has an almost uniform energy density along the slender shape. Cutter processing is sufficient to be done before the inner-layer conductor, and there is no fear of damaging the inner-layer conductor. Moreover, it is easy to control thermal influence on the portion of the circuit board to be processed by the laser beam, because the energy density of the laser beam is almost uniform. Therefore, the product yield according to the processing is improved.
摘要翻译：该装置用于曝光嵌入在印刷电路板的绝缘体中的内层导体的面对。点对面通过机械切割器将除了其余部分之外的整个绝缘体移除到刚好在内层导体上方的位置。绝缘体的剩余部分的厚度小于由机械切割器去除的绝缘体。然后，通过用激光束扫描该部分来去除绝缘体的剩余部分以暴露内层导体。激光束呈细长（细长）的形状，几乎垂直于激光束的扫描方向，沿着细长形状具有几乎均匀的能量密度。切割机处理足以在内层导体之前进行，并且不用担心损坏内层导体。此外，由于激光束的能量密度几乎均匀，因此易于控制由激光束处理的电路板的部分的热影响。因此，根据加工的产品产量提高。

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