专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

1. 发明申请

US20070197017A1 Manufacturing method of semiconductor module 有权
标题翻译：半导体模块制造方法
公开(公告)号：US20070197017A1
公开(公告)日：2007-08-23
申请号：US10591723
申请日：2004-03-02
申请人： Kozo Fujimoto , Hirohiko Watanabe , Kazutaka Ikemi , Keiichi Matsumura , Masayoshi Shimoda , Katsumi Taniguchi , Tomoaki Goto
发明人： Kozo Fujimoto , Hirohiko Watanabe , Kazutaka Ikemi , Keiichi Matsumura , Masayoshi Shimoda , Katsumi Taniguchi , Tomoaki Goto
IPC分类号： H01L21/44
CPC分类号： H01L24/33 , H01L23/49562 , H01L24/37 , H01L24/40 , H01L24/45 , H01L24/48 , H01L24/83 , H01L24/84 , H01L2224/05639 , H01L2224/05644 , H01L2224/05647 , H01L2224/05655 , H01L2224/29109 , H01L2224/29111 , H01L2224/29113 , H01L2224/32225 , H01L2224/37147 , H01L2224/40095 , H01L2224/40225 , H01L2224/45032 , H01L2224/45124 , H01L2224/48091 , H01L2224/48227 , H01L2224/48472 , H01L2224/48699 , H01L2224/73265 , H01L2224/83191 , H01L2224/83801 , H01L2224/83825 , H01L2224/84825 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01014 , H01L2924/01015 , H01L2924/01019 , H01L2924/01022 , H01L2924/01028 , H01L2924/01029 , H01L2924/0103 , H01L2924/01032 , H01L2924/01033 , H01L2924/01047 , H01L2924/0105 , H01L2924/01051 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01083 , H01L2924/01088 , H01L2924/0132 , H01L2924/01322 , H01L2924/014 , H01L2924/1305 , H01L2924/13055 , H01L2924/157 , H01L2924/15787 , H01L2924/30105 , H01L2924/351 , H01L2924/00014 , H01L2924/01049 , H01L2924/00015 , H01L2924/00012 , H01L2924/00
摘要： The present invention provides a manufacturing method of a semiconductor module which enables the joining at a low temperature within a short time and can obtain more reliable joining portions by performing the joining without using a solder joining medium. The manufacturing method of a semiconductor module includes a first joining step for joining first circuit electrodes which are formed on a circuit board and back-surface-side die electrodes of a semiconductor die, a second joining step for joining the front-surface-side electrodes of the semiconductor die and one ends of lead frames, and a third joining step for joining another ends of the lead frame and second circuit electrodes which are formed on the circuit board, wherein a low-melting-temperature metal layer is formed on one conductive portion of a pair of conductive portions to be joined and, thereafter, the low-melting-temperature metal layer is heated and pressurized thus diffusing the low-melting-temperature metal layer into the pair of conductive portions by solid-liquid diffusion whereby the conductive portions are joined to each other.
摘要翻译：本发明提供一种半导体模块的制造方法，其能够在短时间内在低温下进行接合，并且可以通过在不使用焊料接合介质的情况下进行接合而获得更可靠的接合部。半导体模块的制造方法包括：第一接合步骤，用于接合形成在电路板上的第一电路电极和半导体管芯的背表面侧管芯电极;第二接合步骤，用于将前表面侧电极以及第三接合步骤，用于接合引线框架的另一端和形成在电路板上的第二电路电极，其中低熔点金属层形成在一个导电一部分要接合的导电部分的部分，然后将低熔点金属层加热和加压，从而通过固液扩散将低熔点金属层扩散到一对导电部分中，由此导电部分彼此连接。

2. 发明申请

US20070152025A1 Electronic part mounting method 审中-公开
标题翻译：电子零件安装方式
公开(公告)号：US20070152025A1
公开(公告)日：2007-07-05
申请号：US10591724
申请日：2004-03-02
申请人： Kozo Fujimoto , Kazutaka Ikemi , Hirohiko Watanabe , Keiichi Matsumura , Masayoshi Shimoda , Katsumi Taniguchi , Tomoaki Goto
发明人： Kozo Fujimoto , Kazutaka Ikemi , Hirohiko Watanabe , Keiichi Matsumura , Masayoshi Shimoda , Katsumi Taniguchi , Tomoaki Goto
IPC分类号： B23K31/02
CPC分类号： H01L24/12 , H01L24/16 , H01L24/81 , H01L2224/0554 , H01L2224/05568 , H01L2224/05573 , H01L2224/05624 , H01L2224/05644 , H01L2224/05647 , H01L2224/05655 , H01L2224/13099 , H01L2224/13147 , H01L2224/16 , H01L2224/81193 , H01L2224/81204 , H01L2224/81825 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01015 , H01L2924/01019 , H01L2924/01029 , H01L2924/01032 , H01L2924/01033 , H01L2924/01047 , H01L2924/0105 , H01L2924/01051 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01088 , H01L2924/01322 , H01L2924/014 , H01L2924/07811 , H05K3/328 , H05K2203/0278 , H01L2924/00 , H01L2224/05599 , H01L2224/0555 , H01L2224/0556
摘要： The present invention provides an electronic part mounting method which enables joining of electrodes at a low temperature and within a short time, can obtain the high reliability and, further, enables joining at a fine pitch. In an electronic part mounting method which joins circuit electrodes which are formed over a circuit board and die electrodes which are formed over the electronic parts thus mounting the electronic parts on the circuit board, a low-melting-point metal layer is preliminarily formed over the circuit electrode and/or the die electrode and, thereafter, the circuit electrode and the die electrode are arranged to face each other and are heated and pressurized for melting low-melting-point metal thus diffusing the low-melting-point metal into the circuit electrode and the die electrode by solid-liquid diffusion.
摘要翻译：本发明提供一种能够在低温和短时间内接合电极的电子部件安装方法，可以获得高可靠性，并且还能够以细间距进行接合。在电子部件安装方法中，将形成在电路板上的电路电极和形成在电子部件上的电极部分上的电极部件连接起来，从而将电子部件安装在电路板上，将低熔点金属层预先形成在电路电极和/或管芯电极，然后将电路电极和管芯电极配置成彼此面对并被加热和加压以熔化低熔点金属，从而将低熔点金属扩散到电路中电极和芯片电极通过固液扩散。

3. 发明授权

US07670879B2 Manufacturing method of semiconductor module including solid-liquid diffusion joining steps 有权
标题翻译：包括固液扩散接合步骤的半导体模块的制造方法
公开(公告)号：US07670879B2
公开(公告)日：2010-03-02
申请号：US10591723
申请日：2004-03-02
申请人： Kozo Fujimoto , Hirohiko Watanabe , Kazutaka Ikemi , Keiichi Matsumura , Masayoshi Shimoda , Katsumi Taniguchi , Tomoaki Goto
发明人： Kozo Fujimoto , Hirohiko Watanabe , Kazutaka Ikemi , Keiichi Matsumura , Masayoshi Shimoda , Katsumi Taniguchi , Tomoaki Goto
IPC分类号： H01L21/50 , H01L21/44
CPC分类号： H01L24/33 , H01L23/49562 , H01L24/37 , H01L24/40 , H01L24/45 , H01L24/48 , H01L24/83 , H01L24/84 , H01L2224/05639 , H01L2224/05644 , H01L2224/05647 , H01L2224/05655 , H01L2224/29109 , H01L2224/29111 , H01L2224/29113 , H01L2224/32225 , H01L2224/37147 , H01L2224/40095 , H01L2224/40225 , H01L2224/45032 , H01L2224/45124 , H01L2224/48091 , H01L2224/48227 , H01L2224/48472 , H01L2224/48699 , H01L2224/73265 , H01L2224/83191 , H01L2224/83801 , H01L2224/83825 , H01L2224/84825 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01014 , H01L2924/01015 , H01L2924/01019 , H01L2924/01022 , H01L2924/01028 , H01L2924/01029 , H01L2924/0103 , H01L2924/01032 , H01L2924/01033 , H01L2924/01047 , H01L2924/0105 , H01L2924/01051 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01083 , H01L2924/01088 , H01L2924/0132 , H01L2924/01322 , H01L2924/014 , H01L2924/1305 , H01L2924/13055 , H01L2924/157 , H01L2924/15787 , H01L2924/30105 , H01L2924/351 , H01L2924/00014 , H01L2924/01049 , H01L2924/00015 , H01L2924/00012 , H01L2924/00
摘要： The present invention provides a manufacturing method of a semiconductor module which enables the joining at a low temperature within a short time and can obtain more reliable joining portions by performing the joining without using a solder joining medium. The manufacturing method of a semiconductor module includes a first joining step for joining first circuit electrodes which are formed on a circuit board and back-surface-side die electrodes of a semiconductor die, a second joining step for joining the front-surface-side electrodes of the semiconductor die and one ends of lead frames, and a third joining step for joining another ends of the lead frame and second circuit electrodes which are formed on the circuit board, wherein a low-melting-temperature metal layer is formed on one conductive portion of a pair of conductive portions to be joined and, thereafter, the low-melting-temperature metal layer is heated and pressurized thus diffusing the low-melting-temperature metal layer into the pair of conductive portions by solid-liquid diffusion whereby the conductive portions are joined to each other.
摘要翻译：本发明提供一种半导体模块的制造方法，其能够在短时间内在低温下进行接合，并且可以通过在不使用焊料接合介质的情况下进行接合而获得更可靠的接合部。半导体模块的制造方法包括：第一接合步骤，用于接合形成在电路板上的第一电路电极和半导体管芯的背表面侧管芯电极;第二接合步骤，用于将前表面侧电极以及第三接合步骤，用于接合引线框架的另一端和形成在电路板上的第二电路电极，其中低熔点金属层形成在一个导电一部分要接合的导电部分的部分，然后将低熔点金属层加热和加压，从而通过固液扩散将低熔点金属层扩散到一对导电部分中，由此导电部分彼此连接。

4. 发明授权

US08847844B2 Antenna and antenna module 有权
标题翻译：天线和天线模块
公开(公告)号：US08847844B2
公开(公告)日：2014-09-30
申请号：US13339544
申请日：2011-12-29
申请人： Noboru Kato , Katsumi Taniguchi , Nobuo Ikemoto , Hiromi Murayama
发明人： Noboru Kato , Katsumi Taniguchi , Nobuo Ikemoto , Hiromi Murayama
IPC分类号： H01Q7/00 , G08B13/00 , H01Q21/00
CPC分类号： H01Q7/00 , G08B13/00 , H01Q21/0025
摘要： An antenna includes a flexible sheet, a first coil electrode being formed on a first main surface of the flexible sheet and a second coil electrode being formed on a second main surface of the flexible sheet. Another end portion of the first coil electrode and another end portion 32B of the second coil electrode oppose each other with the flexible sheet there between. One end portion of the first coil electrode opposes an electrode pad, which has a smaller area than the one end portion, with a mounting substrate there between. One end portion of the second coil electrode and a central electrode oppose each other with the flexible sheet there between, and the central electrode opposes an electrode pad, which has a smaller area than the central electrode, with the mounting substrate there between.
摘要翻译：天线包括柔性片，形成在柔性片的第一主表面上的第一线圈电极和形成在柔性片的第二主表面上的第二线圈电极。第一线圈电极的另一端部和第二线圈电极的另一端部32B彼此相对，并且其间具有柔性片。第一线圈电极的一端部与具有比一端部的面积小的电极焊盘与其间的安装基板相对。第二线圈电极的一个端部和中心电极彼此相对，并且中间电极与中心电极之间的柔性片相对，其间具有比中心电极更小的面积的电极焊盘。

5. 发明申请

US20120162028A1 Antenna Device, Battery Pack with Antenna, and Communication Terminal Device 有权
标题翻译：天线装置，天线电池组和通信终端装置
公开(公告)号：US20120162028A1
公开(公告)日：2012-06-28
申请号：US13334221
申请日：2011-12-22
申请人： Hiroyuki Kubo , Katsumi Taniguchi
发明人： Hiroyuki Kubo , Katsumi Taniguchi
IPC分类号： H01Q1/24 , H01Q7/06
CPC分类号： H01Q1/243 , G06K7/10336 , H01M2/1066 , H01Q1/38 , H01Q1/528 , H01Q7/06
摘要： A battery pack having a main surface and a side surface, and the external appearance thereof is an approximately rectangular parallelepiped shape. An antenna coil is provided on the main surface. The antenna coil is obtained by forming a coil conductor pattern on a flexible substrate. A substantially slit-shaped aperture is formed on the flexible substrate, and a magnetic material core is inserted into the aperture. In the antenna coil, the center of the coil aperture portion is offset from the center of the main surface of the battery pack in the outside edge portion direction of the main surface. A first end in the magnetic path direction of the magnetic material core is stretched along the side surface of the battery pack, and the second end of the magnetic material core is opened toward the center of the main surface of the battery pack.
摘要翻译：具有主表面和侧表面的电池组，其外观是大致长方体形状。天线线圈设在主表面上。通过在柔性基板上形成线圈导体图案来获得天线线圈。在柔性基板上形成基本上为狭缝状的孔，并且将磁性材料芯插入孔中。在天线线圈中，线圈开口部分的中心在主表面的外边缘部分方向上偏离电池组主表面的中心。磁性材料芯的磁路方向的第一端沿着电池组的侧面拉伸，并且磁性材料芯的第二端朝向电池组的主表面的中心开口。

6. 发明授权

US07203366B2 Video retrieval method and apparatus 失效
标题翻译：视频检索方法和装置
公开(公告)号：US07203366B2
公开(公告)日：2007-04-10
申请号：US10854153
申请日：2004-05-27
申请人： Takafumi Miyatake , Shigeo Sumino , Katsumi Taniguchi , Akio Nagasaka , Mitsuru Ikezawa , Hirotada Ueda
发明人： Takafumi Miyatake , Shigeo Sumino , Katsumi Taniguchi , Akio Nagasaka , Mitsuru Ikezawa , Hirotada Ueda
IPC分类号： G06K9/46
CPC分类号： G06F17/30787 , G06F17/30802 , G06F17/30817 , G06F17/30825 , G06F17/30858 , G11B27/105 , G11B27/28 , G11B31/00 , H04H60/37 , H04H60/48 , H04H60/59 , H04N5/147
摘要： A method of characterizing a video includes the steps of extracting frame images from an input video, calculating a time length between each of the frame images and a next one of the frame images, assigning index information determined by the calculated time length to each of the frame images, stringing together the index information assigned to the frame images, and characterizing the input video by the strung-together index information. The index information is a character code, and the strung-together index information is a character code string. The frame images include head frame images located at scene changes of the input video. The input video is being broadcasted or is included in a data base.
摘要翻译：一种表征视频的方法包括以下步骤：从输入视频中提取帧图像，计算每个帧图像与下一个帧图像之间的时间长度，将由所计算的时间长度确定的索引信息分配给每个帧图像，将分配给帧图像的索引信息串联在一起，并通过串联索引信息来表征输入视频。索引信息是字符代码，并且串联索引信息是字符代码串。帧图像包括位于输入视频的场景变化的头帧图像。输入视频正在广播或被包括在数据库中。

7. 发明授权

US09705194B2 Antenna module 有权
公开(公告)号：US09705194B2
公开(公告)日：2017-07-11
申请号：US13368358
申请日：2012-02-08
申请人： Noboru Kato , Jun Sasaki , Satoshi Ishino , Katsumi Taniguchi
发明人： Noboru Kato , Jun Sasaki , Satoshi Ishino , Katsumi Taniguchi
IPC分类号： H01Q9/04
CPC分类号： H01Q9/0407
摘要： In an antenna module, a main portion includes a plurality of insulating sheets made of a flexible material and laminated on each other. An antenna configured to transmit/receive a high-frequency signal is disposed in the main portion. A connection portion is disposed in the main portion and is connected to an electronic device that inputs/outputs the high-frequency signal. A signal transmission line is disposed in the main portion and has a strip line structure or a microstrip line structure to transmit the high-frequency signal. An impedance matching circuit is disposed in the main portion and between the antenna and end of a signal transmission line facing in a negative x direction. An impedance matching circuit is disposed in the main portion and between the connection portion and an end of the signal transmission line facing in a positive x direction.

8. 发明授权

US08691348B2 Thin-film manufacturing method and apparatus 有权
公开(公告)号：US08691348B2
公开(公告)日：2014-04-08
申请号：US13243044
申请日：2011-09-23
申请人： Tomonori Katano , Katsumi Taniguchi , Kungen Teii
发明人： Tomonori Katano , Katsumi Taniguchi , Kungen Teii
IPC分类号： C23C16/50 , C23C16/26 , C23C16/44 , C23C16/513
摘要： A thin-film manufacturing method includes the steps of: generating a plasma from source gas; extracting ions from the plasma; and depositing a thin film on one side or both sides of a substrate to be deposited with the ions. The method is performed in an apparatus including: a plasma chamber generating the plasma; a film deposition chamber accommodating the substrate to be deposited; an ion transfer path for transferring the ions from the plasma chamber to the film deposition chamber; a branch pipe branching from the ion transfer path; and an exhaust system connected to the branch pipe. The thin film is formed while the source gas except the ions is exhausted from the branch pipe.

9. 发明授权

US08597527B2 Method for forming a concavo-convex pattern and a method of manufacturing a patterned medium type magnetic recording medium 失效
标题翻译：用于形成凹凸图案的方法和制造图案化介质型磁记录介质的方法
公开(公告)号：US08597527B2
公开(公告)日：2013-12-03
申请号：US12548058
申请日：2009-08-26
申请人： Katsumi Taniguchi
发明人： Katsumi Taniguchi
IPC分类号： B44C1/22
CPC分类号： G11B5/855
摘要： The invention provides a method of forming a concavo-convex pattern by partly removing a magnetic layer and a carbon protective layer in an intermediate product of a magnetic recording medium having at least the magnetic layer and the protective layer formed on a substrate surface, wherein the magnetic layer is partly removed to form the concavo-convex pattern by a dry etching method using a etching gas of a mixture gas of argon and a deposition gas containing one or more types of carbon compounds. Also disclosed is a method of manufacturing a patterned medium type magnetic recording medium employing the method of forming a concavo-convex pattern. As a result a concavo-convex pattern free of after-corrosion and exhibiting good productivity is provided.
摘要翻译：本发明提供了一种形成凹凸图案的方法，该方法通过在至少具有磁性层和形成在基板表面上的保护层的磁记录介质的中间产物中部分除去磁性层和碳保护层，其中通过使用氩气的混合气体和含有一种或多种类型的碳化合物的沉积气体的蚀刻气体的干蚀刻方法，部分地去除磁性层以形成凹凸图案。还公开了使用形成凹凸图案的方法制造图案化介质型磁记录介质的方法。因此，提供了没有后腐蚀且显示出良好生产率的凹凸图案。

10. 发明授权

US08047445B2 Wireless IC device and method of manufacturing the same 有权
标题翻译：无线IC器件及其制造方法
公开(公告)号：US08047445B2
公开(公告)日：2011-11-01
申请号：US12940103
申请日：2010-11-05
申请人： Noboru Kato , Jun Sasaki , Satoshi Ishino , Katsumi Taniguchi
发明人： Noboru Kato , Jun Sasaki , Satoshi Ishino , Katsumi Taniguchi
IPC分类号： G06K19/06
CPC分类号： H01Q1/2225 , G06K19/07749 , G06K19/07779 , G06K19/07783 , G06K19/07784 , H01Q1/38 , H01Q7/00 , H04B5/0081 , Y10T29/49124
摘要： A wireless IC device includes a plurality of insulating sheets that are stacked on top of one another. Coil electrodes are arranged so as to sandwich the insulating sheets therebetween and define an antenna coil by being connected to one another. The coil electrodes are superposed with one another and thereby define a single ring when viewed in plan from a z-axis direction.
摘要翻译：无线IC器件包括堆叠在彼此顶部的多个绝缘片。线圈电极被布置成将绝缘片夹在其间并通过彼此连接来限定天线线圈。线圈电极彼此叠置，从而在从z轴方向的平面图中观察时限定单个环。

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式