专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

1. 发明授权

US08604383B2 Laser processing method 有权
标题翻译：激光加工方法
公开(公告)号：US08604383B2
公开(公告)日：2013-12-10
申请号：US11659376
申请日：2005-07-27
申请人： Koji Kuno , Tatsuya Suzuki , Takeshi Sakamoto
发明人： Koji Kuno , Tatsuya Suzuki , Takeshi Sakamoto
IPC分类号： B23K26/42 , H01L21/301
CPC分类号： H01L23/562 , B23K26/0622 , B23K26/40 , B23K26/53 , B23K2101/40 , B23K2103/172 , B23K2103/50 , B28D1/221 , B28D5/0011 , C03B33/0222 , H01L2924/0002 , H01L2924/00
摘要： This laser processing method irradiates a substrate 4 with laser light L while locating a light-converging point P within the substrate 4, so as to form a quality modified region 71 to become a starting point region for cutting within the substrate 4 along a line to cut 5. Here, the laser light L is oscillated pulsewise along a desirable part RP in the line to cut 5, and continuously in a predetermined part RC in the line to cut 5. Consequently, the quality modified region 71 is formed within the substrate 4 along the desirable part RP in the line to cut 5, whereas no quality modified region 71 is formed within the substrate 4 along the predetermined part RC in the line to cut 5.
摘要翻译：该激光加工方法在将聚光点P定位在基板4内的状态下照射激光L的基板4，从而形成质量改质区域71，成为基板4内的切割起点区域，这里，激光L沿着要切割的线5中的期望部分RP脉动地沿着切割线5中的预定部分RC连续振荡。因此，质量改质区域71形成在基板内沿着要切割的线5中的期望部分RP 4，而沿着切割线5中的预定部分RC，在基板4内不形成质量改质区域71。

2. 发明申请

US20080035611A1 Laser Processing Method And Semiconductor Device 有权
标题翻译：激光加工方法和半导体器件
公开(公告)号：US20080035611A1
公开(公告)日：2008-02-14
申请号：US11659376
申请日：2005-07-27
申请人： Koji Kuno , Tatsuya Suzuki , Takeshi Sakamoto
发明人： Koji Kuno , Tatsuya Suzuki , Takeshi Sakamoto
IPC分类号： B23K26/42
CPC分类号： H01L23/562 , B23K26/0622 , B23K26/40 , B23K26/53 , B23K2101/40 , B23K2103/172 , B23K2103/50 , B28D1/221 , B28D5/0011 , C03B33/0222 , H01L2924/0002 , H01L2924/00
摘要： A laser processing method which can reliably form a modified region within an object to be processed along a desirable part in a line to cut is provided. This laser processing method irradiates a substrate 4 with laser light L while locating a light-converging point P within the substrate 4, so as to form a quality modified region 71 to become a starting point region for cutting within the substrate 4 along a line to cut 5. Here, the laser light L is oscillated pulsewise along a desirable part RP in the line to cut 5, and continuously in a predetermined part RC in the line to cut 5. Consequently, the quality modified region 71 is formed within the substrate 4 along the desirable part RP in the line to cut 5, whereas no quality modified region 71 is formed within the substrate 4 along the predetermined part RC in the line to cut 5.
摘要翻译：提供一种激光加工方法，其能够沿着切割线中的期望部分可靠地形成待处理物体内的改质区域。该激光加工方法在将聚光点P定位在基板4内的状态下照射激光L的基板4，从而形成质量改质区域71，成为基板4内的切割起点区域，这里，激光L沿着要切割的线5中的期望部分RP脉动地沿着切割线5中的预定部分RC连续振荡。因此，质量改质区域71形成在基板内沿着要切割的线5中的期望部分RP 4，而沿着切割线5中的预定部分RC，在基板4内不形成质量改质区域71。

3. 发明申请

US20080218735A1 Laser Processing Method And Device 有权
标题翻译：激光加工方法与装置
公开(公告)号：US20080218735A1
公开(公告)日：2008-09-11
申请号：US10585343
申请日：2004-12-13
申请人： Kazuhiro Atsumi , Koji Kuno , Masayoshi Kusunoki , Tatsuya Suzuki , Kenshi Fukumitsu , Fumitsugu Fukuyo
发明人： Kazuhiro Atsumi , Koji Kuno , Masayoshi Kusunoki , Tatsuya Suzuki , Kenshi Fukumitsu , Fumitsugu Fukuyo
IPC分类号： G01N21/00 , G02B27/02
CPC分类号： B23K26/048 , B23K26/046 , B23K26/0648 , B23K26/38 , B23K26/40 , B23K26/53 , B23K2101/40 , B23K2103/50 , B23K2103/56 , B28D5/0011 , H01L21/67092 , H01L21/78
摘要： A laser processing method which can efficiently perform laser processing while minimizing the deviation of the converging point of a laser beam in end parts of an object to be processed is provided.This laser processing method comprises a preparatory step of holding a lens at an initial position set such that a converging point is located at a predetermined position within the object; a first processing step (S11 and S12) of emitting a first laser beam for processing while holding the lens at the initial position, and moving the lens and the object relative to each other along a main surface so as to form a modified region in one end part of a line to cut; and a second processing step (S13 and S14) of releasing the lens from being held at the initial position after forming the modified region in the one end part of the line to cut, and then moving the lens and the object relative to each other along the main surface while adjusting the gap between the lens and the main surface after the release, so as to form the modified region.
摘要翻译：提供了一种可以有效地执行激光加工同时最小化激光束在待处理物体的端部中的会聚点的偏差的激光加工方法。该激光加工方法包括：准备步骤，将透镜保持在初始位置，使得会聚点位于物体内的预定位置; 在将透镜保持在初始位置的同时发射用于处理的第一激光束并沿着主表面相对于彼此移动透镜和物体的第一处理步骤（S11和S12），以形成修改区域在一端切割一条线; 以及在要切割的线的一个端部中形成修改区域之后将透镜释放保持在初始位置的第二处理步骤（S13和S14），然后相对于每个移动透镜和物体另外沿着主表面，同时在释放之后调整透镜和主表面之间的间隙，从而形成改质区域。

4. 发明授权

US08624153B2 Laser processing method and device 有权
标题翻译：激光加工方法及装置
公开(公告)号：US08624153B2
公开(公告)日：2014-01-07
申请号：US10585343
申请日：2004-12-13
申请人： Kazuhiro Atsumi , Koji Kuno , Masayoshi Kusunoki , Tatsuya Suzuki , Kenshi Fukumitsu , Fumitsugu Fukuyo
发明人： Kazuhiro Atsumi , Koji Kuno , Masayoshi Kusunoki , Tatsuya Suzuki , Kenshi Fukumitsu , Fumitsugu Fukuyo
IPC分类号： B23K26/14
CPC分类号： B23K26/048 , B23K26/046 , B23K26/0648 , B23K26/38 , B23K26/40 , B23K26/53 , B23K2101/40 , B23K2103/50 , B23K2103/56 , B28D5/0011 , H01L21/67092 , H01L21/78
摘要： A laser processing method which can efficiently perform laser processing while minimizing the deviation of the converging point of a laser beam in end parts of an object to be processed is provided.This laser processing method comprises a preparatory step of holding a lens at an initial position set such that a converging point is located at a predetermined position within the object; a first processing step (S11 and S12) of emitting a first laser beam for processing while holding the lens at the initial position, and moving the lens and the object relative to each other along a main surface so as to form a modified region in one end part of a line to cut; and a second processing step (S13 and S14) of releasing the lens from being held at the initial position after forming the modified region in the one end part of the line to cut, and then moving the lens and the object relative to each other along the main surface while adjusting the gap between the lens and the main surface after the release, so as to form the modified region.
摘要翻译：提供了一种可以有效地执行激光加工同时最小化激光束在待处理物体的端部中的会聚点的偏差的激光加工方法。该激光加工方法包括：准备步骤，将透镜保持在初始位置，使得会聚点位于物体内的预定位置; 第一处理步骤（S11和S12），其在将透镜保持在初始位置的同时发射用于处理的第一激光束，并且沿着主表面相对于彼此移动透镜和物体，以在一个主表面上形成改质区域一段线切断; 以及第二处理步骤（S13和S14），其在形成要切割的线的一个端部中的改质区域之后，将透镜保持在初始位置，然后沿着彼此移动透镜和物体主表面同时调整透镜与主表面之间的间隙释放后，形成改质区域。

5. 发明授权

US08610028B2 Laser processing device 有权
标题翻译：激光加工装置
公开(公告)号：US08610028B2
公开(公告)日：2013-12-17
申请号：US12443045
申请日：2007-09-26
申请人： Koji Kuno , Tatsuya Suzuki , Norio Kurita , Tetsuya Osajima
发明人： Koji Kuno , Tatsuya Suzuki , Norio Kurita , Tetsuya Osajima
IPC分类号： B23K26/14 , B23K26/16 , B23K26/06
CPC分类号： B23K26/38 , B23K26/048 , B23K26/0624 , B23K26/0676 , B23K26/0853 , B23K26/0869 , B23K26/40 , B23K26/53 , B23K2101/40 , B23K2103/50
摘要： An apparatus comprises a table, a source emitting polarized laser light, a source emitting laser light, a plate changing the polarization direction of the laser light, a plate splitting the laser light into a laser light having polarization in an X direction and a laser light component having polarization in a Y direction, a plate orienting the polarization direction of the laser light to the X direction, a lens converging the laser light components, a lens arranged in parallel with the lens along the X direction and converges the laser light component, a control section controlling a device such that a converging point of the laser light component is located at a predetermined position with reference to a front face by detecting a reflected light, and a control section moving the table along a line while making the X direction substantially coincide with the line.
摘要翻译：一种装置，包括台，源极发射激光，源发射激光，改变激光的偏振方向的板，将激光分解为具有在X方向上具有偏振的激光的激光和激光在Y方向具有极化的部件，将激光的偏振方向定向为X方向的板，使激光成分会聚的透镜，沿着X方向平行配置的透镜，使激光成分会聚，控制部，其通过检测反射光来控制所述激光成分的会聚点相对于前面位于预定位置;以及控制部，其使所述台沿着一条线移动，同时使X方向基本上符合线条。

6. 发明申请

US20100006548A1 LASER WORKING METHOD 有权
标题翻译：激光工作方法
公开(公告)号：US20100006548A1
公开(公告)日：2010-01-14
申请号：US12444119
申请日：2007-09-26
申请人： Kazuhiro Atsumi , Koji Kuno , Tatsuya Suzuki
发明人： Kazuhiro Atsumi , Koji Kuno , Tatsuya Suzuki
IPC分类号： B23K26/06 , B23K26/38
CPC分类号： B23K26/046 , B23K26/048 , B23K26/40 , B23K26/53 , B23K2103/50
摘要： A converging point of processing laser light is made to accurately follow a laser light irradiation surface of an object to be processed. An object to be processed 1 is irradiated with measuring laser light along a line to cut 5, astigmatism is added to a reflected light component of the measuring laser light reflected by a front face 3 of the object 1 irradiated with the measuring laser light, a displacement sensor signal corresponding to a converged light image of the reflected light component having the astigmatism added thereto is detected, and the displacement sensor signal is made to become a feedback reference value corresponding to the quantity of the reflected light component, so as to locate the converging point of the processing laser light at a predetermined position with respect to the front face 3. This allows tire converging point of the processing laser light to follow the front face 3 of the object 1 reliably and accurately even when an area exhibiting an extremely low reflectance to the measuring laser light exists in a part of the front face 3 and lowers the quantity of the reflected light component of the measuring laser light.
摘要翻译：使处理激光的会聚点精确地跟随被处理物体的激光照射面。将被处理物体1沿着被切割线5的测量用激光照射，对被照射测量用激光的被检体1的正面3反射的测定用激光的反射光成分加上像散，检测对应于加有像散的反射光分量的会聚光图像的位移传感器信号，使位移传感器信号成为与反射光分量的量对应的反馈基准值，处理激光的会聚点相对于前面3在预定位置。即使当显示极低的区域时，处理激光的轮胎会聚点可靠地准确地跟随物体1的正面3 在前表面3的一部分中存在对测量激光的反射率，并且降低了反射光分量的量测量激光。

7. 发明授权

US07608214B2 Laser beam machining method 有权
标题翻译：激光束加工方法
公开(公告)号：US07608214B2
公开(公告)日：2009-10-27
申请号：US11665263
申请日：2005-10-05
申请人： Koji Kuno , Tatsuya Suzuki
发明人： Koji Kuno , Tatsuya Suzuki
IPC分类号： H01L21/268
CPC分类号： B23K26/40 , B23K26/0665 , B23K26/53 , B23K2101/40 , B23K2103/50 , B28D5/0011 , H01L21/78
摘要： To provide a laser processing method which can highly accurately cut a planar object to be processed having an irregular surface as an entrance surface for processing laser light.This laser processing method irradiates a planar object to be processed with laser light while locating a light-converging point within the object, thereby forming modified regions 71 to 77 to become a starting point region for cutting along lines to cut 5. The entrance surface r for the laser light in the object is an irregular surface. The lines to cut 5 extend over a depressed area surface r2 and a protruded area surface r1 in the entrance surface r. The modified region 71 is formed inside by a predetermined distance from the depressed area surface r2. At the time of irradiation with laser light along a part 51a on the protruded area surface r1, the light-converging point is located on the outside of the object. The modified region 72 is formed inside by a predetermined distance from the protruded area surface r1. At the time of irradiation with laser light along a part 51b on the depressed area surface r2, the light-converging point is located on the outside of the object.
摘要翻译：提供一种可以高精度地切割具有不规则表面的待处理平面物体作为处理激光的入射面的激光加工方法。这种激光加工方法在将聚光点定位在物体内的同时用激光照射待处理的平面物体，从而形成改质区域71〜77，成为沿切割线5切割的起点区域。入射面r 对于物体中的激光是不规则的表面。切割线5在入口面r的凹陷区域表面r2和突出区域表面r1上延伸。改质区域71形成在与凹陷区域表面r2相距预定距离的内侧。在沿着突出区域表面r1上的部分51a照射激光时，聚光点位于物体的外侧。改质区域72形成在与突出面r1相距预定距离的内侧。在沿着凹陷区域表面r2上的部分51b照射激光时，聚光点位于物体的外侧。

8. 发明授权

US08735770B2 Laser processing method for forming a modified region in an object 有权
标题翻译：用于在物体中形成改质区域的激光加工方法
公开(公告)号：US08735770B2
公开(公告)日：2014-05-27
申请号：US12444125
申请日：2007-09-27
申请人： Koji Kuno , Tatsuya Suzuki , Kazuhiro Atsumi
发明人： Koji Kuno , Tatsuya Suzuki , Kazuhiro Atsumi
IPC分类号： B23K26/14 , B23K26/16 , B23K26/06
CPC分类号： B23K26/048 , B23K26/046 , B23K26/40 , B23K26/53 , B23K2103/50 , B28D5/0011 , H01L21/02381 , H01L21/02675 , H01L21/67092 , H01L21/78
摘要： While a converging lens 108 is relatively moved along a line 50 including a line to cut 5, measuring laser light L2 is converged with the lens 108 when the lens 108 is positioned on a processing region 30 having an outer shape between an object to be processed 1 and a frame 22, and a reflected light component of the laser light L2 reflected by a front face 3 of the object 1 is detected. While keeping a substantially constant distance between the front face 3 and the lens 108 such that a converging point P of processing laser light L1 is positioned at a constant distance from the front face 3 according to the detection, the laser light L1 is converged by the lens 108, so as to form a molten processed region 13 within the object 1.
摘要翻译：当会聚透镜108沿着包括切割线5的线50相对移动时，当透镜108位于具有处于被处理物体之间的外形的处理区域30时，测量激光L2与透镜108会聚检测出由物体1的正面3反射的激光L2的反射光分量。在保持前表面3和透镜108之间保持基本上恒定的距离的同时，根据检测，处理激光L1的会聚点P位于距前表面3的恒定距离处，激光L1被透镜108，以便在物体1内形成熔融处理区域13。

9. 发明申请

US20100025386A1 LASER PROCESSING DEVICE 有权
标题翻译：激光加工设备
公开(公告)号：US20100025386A1
公开(公告)日：2010-02-04
申请号：US12443045
申请日：2007-09-26
申请人： Koji Kuno , Tatsuya Suzuki , Norio Kurita , Tetsuya Osajima
发明人： Koji Kuno , Tatsuya Suzuki , Norio Kurita , Tetsuya Osajima
IPC分类号： B23K26/06 , B23K26/38
CPC分类号： B23K26/38 , B23K26/048 , B23K26/0624 , B23K26/0676 , B23K26/0853 , B23K26/0869 , B23K26/40 , B23K26/53 , B23K2101/40 , B23K2103/50
摘要： The time required for forming a modified region within an object to be processed is shortened. An apparatus 100 comprises a mount table 107, a light source 101 for emitting linearly polarized laser light L, a light source 41 for emitting laser light L3, a wave plate 51 for changing the polarization direction of the laser light L, a polarizing plate 52 for splitting the laser light L into a laser light component L1 having a polarization direction in an X direction and a laser light component L2 having a polarization direction in a Y direction, a wave plate 55 for orienting the polarization direction of the split laser light component L2 to the X direction, a lens 31 for converging the laser light components L1, L3, a lens 32 which is arranged in parallel with the lens 31 along the X direction and converges the laser light component L2 having the polarization direction oriented to the X direction, a control section 105 for controlling a device 29 such that a converging point of the laser light component L2 is located at a predetermined position with reference to a front face 3 by detecting a reflected light component L4, and a control section 115 for moving the mount table 107 along a line 5 while making the X direction substantially coincide with the line 5.
摘要翻译：在待处理物体内形成改质区域所需的时间缩短。装置100包括安装台107，用于发射线偏振激光L的光源101，用于发射激光L3的光源41，用于改变激光L的偏振方向的波片51，偏振片52 为了将激光L分割成具有X方向的偏振方向的激光成分L1和Y方向的偏光方向的激光成分L2，将分割的激光成分的偏振方向定向的波片55 L2到X方向，用于使激光成分L1，L3聚光的透镜31，与透镜31平行配置的透镜32沿X方向会聚，具有偏振方向的激光成分L2朝向X 方向，控制部分105，用于控制装置29，使得激光部件L2的会聚点相对于前表面3位于预定位置，通过检测反射光分量L4;以及控制部分115，用于沿着线5移动安装台107，同时使X方向基本上与线5重合。

10. 发明申请

US20090039559A1 Laser Beam Machining Method 有权
标题翻译：激光束加工方法
公开(公告)号：US20090039559A1
公开(公告)日：2009-02-12
申请号：US11665263
申请日：2005-10-05
申请人： Koji Kuno , Tatsuya Suzuki
发明人： Koji Kuno , Tatsuya Suzuki
IPC分类号： B29C67/00
CPC分类号： B23K26/40 , B23K26/0665 , B23K26/53 , B23K2101/40 , B23K2103/50 , B28D5/0011 , H01L21/78
摘要： To provide a laser processing method which can highly accurately cut a planar object to be processed having an irregular surface as an entrance surface for processing laser light.This laser processing method irradiates a planar object to be processed with laser light while locating a light-converging point within the object, thereby forming modified regions 71 to 77 to become a starting point region for cutting along lines to cut 5. The entrance surface r for the laser light in the object is an irregular surface. The lines to cut 5 extend over a depressed area surface r2 and a protruded area surface r1 in the entrance surface r. The modified region 71 is formed inside by a predetermined distance from the depressed area surface r2. At the time of irradiation with laser light along a part 51a on the protruded area surface r1, the light-converging point is located on the outside of the object. The modified region 72 is formed inside by a predetermined distance from the protruded area surface r1. At the time of irradiation with laser light along a part 51b on the depressed area surface r2, the light-converging point is located on the outside of the object.
摘要翻译：提供一种可以高精度地切割具有不规则表面的待处理平面物体作为处理激光的入射面的激光加工方法。这种激光加工方法在将聚光点定位在物体内的同时用激光照射待处理的平面物体，从而形成改质区域71〜77，成为沿切割线5切割的起点区域。入射面r 对于物体中的激光是不规则的表面。切割线5在入口面r的凹陷区域表面r2和突出区域表面r1上延伸。改质区域71形成在与凹陷区域表面r2相距预定距离的内侧。在沿着突出区域表面r1上的部分51a照射激光时，聚光点位于物体的外侧。改质区域72形成在与突出面r1相距预定距离的内侧。在沿着凹陷区域表面r2上的部分51b照射激光时，聚光点位于物体的外侧。

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式