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1. 发明申请

US20070273950A1 Shutter Unit and Laser Processing Device Using Same 有权
标题翻译：快门单元和激光加工设备使用相同
公开(公告)号：US20070273950A1
公开(公告)日：2007-11-29
申请号：US10577550
申请日：2004-11-04
申请人： Norio Kurita , Tetsuya Osajima , Masayoshi Kusunoki , Tatsuya Suzuki , Toshimitsu Wakuda
发明人： Norio Kurita , Tetsuya Osajima , Masayoshi Kusunoki , Tatsuya Suzuki , Toshimitsu Wakuda
IPC分类号： G02B26/00 , H01S3/00
CPC分类号： G02B5/005
摘要： A shutter unit capable of preventing the scattering of the laser beam upon closing the optical path of the laser beam and capable of being miniaturized, and a laser processing device employing such a shutter unit. In a shutter unit 1, when the optical path of the laser beam L is opened, a rotating member 57 is rotated around an axis line γ, and an opening 61 is positioned on an optical axis α so as to pass the laser beam L therethrough. Meanwhile, when the optical path of the laser beam L is closed, the rotating member 57 is rotated and a reflective surface 62 is positioned on the optical axis α so as to reflect the laser beam L. Here, since the reflected laser beam L is absorbed by an optical absorption member 63, it is possible to prevent the scattering of the laser beam L when the optical path of the laser beam L is closed. In addition, since the opening 61 and reflective surface 62 are both formed on the rotating member 57 which rotates around the axis line γ that is substantially orthogonal to the optical axis α, it is possible to reduce the size of the shutter unit 1.
摘要翻译：一种快门单元，其能够防止在关闭激光束的光路并能够小型化时激光束的散射，以及采用这种快门单元的激光加工装置。在快门单元1中，当激光束L的光路打开时，旋转部件57围绕轴线γ转动，并且开口61位于光轴α上，以使激光束L穿过其中。同时，当激光束L的光路闭合时，旋转部件57旋转，反射面62位于光轴α上，以反射激光束L.这里，由于反射激光束L为通过光吸收构件63吸收，可以防止激光束L的光路闭合时的激光L的散射。此外，由于开口61和反射表面62都形成在围绕基本上与光轴α1正交的轴线gamma旋转的旋转部件57上，所以可以减小快门单元1的尺寸。

2. 发明授权

US08563893B2 Laser material processing system 有权
标题翻译：激光材料加工系统
公开(公告)号：US08563893B2
公开(公告)日：2013-10-22
申请号：US12096940
申请日：2006-12-12
申请人： Koji Kuno , Kenichi Muramatsu , Kazuhiro Atsumi , Tetsuya Osajima
发明人： Koji Kuno , Kenichi Muramatsu , Kazuhiro Atsumi , Tetsuya Osajima
IPC分类号： H01L21/78 , H01S3/13 , B23K26/00 , B23K26/06
CPC分类号： B23K26/048 , B23K26/046 , B23K26/0617 , B23K26/40 , B23K26/53 , B23K2101/40 , B23K2103/50
摘要： A laser processing apparatus comprises a converging lens 31 for converging processing laser light and rangefinding laser light L2 toward a wafer 1, an actuator for actuating the lens 31, a shaping optical system 49 for adding astigmatism to reflected light L3 of the rangefinding laser light, a quadrant photodiode 42 for receiving the reflected light L3 and outputting voltage values corresponding to its light quantities, and a controller for regulating the actuator, and positions a converging point P2 of the rangefinding laser light L2 between a focal point P0 of the lens and the lens 31, so as to make it possible to form a modified region at a position deeper from the front face 3, thereby suppressing adverse effects due to the reflected light L3. The control is based on an arithmetic value subjected to a division by a sum of the voltage values, so as to prevent the arithmetic value from being changed by the quantity of reflected light.
摘要翻译：激光加工装置包括用于会聚处理激光的聚光透镜31和朝向晶片1的测距激光L2，用于致动透镜31的致动器，用于对测距激光的反射光L3增加散光的整形光学系统49，用于接收反射光L3并输出与其光量相对应的电压值的象限光电二极管42，以及用于调节致动器的控制器，并将测距激光L2的会聚点P2定位在透镜的焦点P0和透镜31，从而能够在比正面3更深的位置形成改质区域，由此抑制由反射光L3引起的不利影响。控制基于经过除以电压值之和的算术值，以防止算术值被反射光量改变。

3. 发明申请

US20120196427A1 LASER WORKING METHOD, LASER WORKING APPARATUS, AND ITS MANUFACTURING METHOD 审中-公开
标题翻译：激光工作方法，激光工作装置及其制造方法
公开(公告)号：US20120196427A1
公开(公告)日：2012-08-02
申请号：US13362781
申请日：2012-01-31
申请人： Makoto Nakano , Koji Kuno , Tetsuya Osajima , Takashi Inoue , Masayoshi Kumagai
发明人： Makoto Nakano , Koji Kuno , Tetsuya Osajima , Takashi Inoue , Masayoshi Kumagai
IPC分类号： H01L21/78 , B23P11/00 , B23K26/00
CPC分类号： H01L21/78 , B23K26/0006 , B23K26/046 , B23K26/0624 , B23K26/064 , B23K26/0861 , B23K26/128 , B23K26/40 , B23K26/402 , B23K26/53 , B23K2103/50 , B23K2103/56 , B28D1/221 , B28D5/00 , C03B33/0222 , H01L23/544 , H01L2223/54453 , Y10T29/49826
摘要： An object is irradiated with a laser light modulated by a reflection type spatial light modulator such that aberration of the laser light converged inside the object becomes a predetermined aberration or less. Therefore, aberration of the laser light generated at a position on which a converging point of the laser light is located is made as small as possible, to enhance the energy density of the laser light at that position, which makes it possible to form a modified region with a high function as a starting point for cutting. In addition, because the reflection type spatial light modulator is used, it is possible to improve the utilization efficiency of the laser light as compared with a transmissive type spatial light modulator.
摘要翻译：用由反射型空间光调制器调制的激光照射物体，使得会聚在物体内的激光的像差成为预定像差或更小。因此，在激光的会聚点所在的位置处产生的激光的像差尽可能地小，以增强该位置处的激光的能量密度，这使得可以形成经修改的具有高功能的区域作为切割的起点。此外，由于使用反射型空间光调制器，与透射型空间光调制器相比，可以提高激光的利用效率。

4. 发明申请

US20100025386A1 LASER PROCESSING DEVICE 有权
标题翻译：激光加工设备
公开(公告)号：US20100025386A1
公开(公告)日：2010-02-04
申请号：US12443045
申请日：2007-09-26
申请人： Koji Kuno , Tatsuya Suzuki , Norio Kurita , Tetsuya Osajima
发明人： Koji Kuno , Tatsuya Suzuki , Norio Kurita , Tetsuya Osajima
IPC分类号： B23K26/06 , B23K26/38
CPC分类号： B23K26/38 , B23K26/048 , B23K26/0624 , B23K26/0676 , B23K26/0853 , B23K26/0869 , B23K26/40 , B23K26/53 , B23K2101/40 , B23K2103/50
摘要： The time required for forming a modified region within an object to be processed is shortened. An apparatus 100 comprises a mount table 107, a light source 101 for emitting linearly polarized laser light L, a light source 41 for emitting laser light L3, a wave plate 51 for changing the polarization direction of the laser light L, a polarizing plate 52 for splitting the laser light L into a laser light component L1 having a polarization direction in an X direction and a laser light component L2 having a polarization direction in a Y direction, a wave plate 55 for orienting the polarization direction of the split laser light component L2 to the X direction, a lens 31 for converging the laser light components L1, L3, a lens 32 which is arranged in parallel with the lens 31 along the X direction and converges the laser light component L2 having the polarization direction oriented to the X direction, a control section 105 for controlling a device 29 such that a converging point of the laser light component L2 is located at a predetermined position with reference to a front face 3 by detecting a reflected light component L4, and a control section 115 for moving the mount table 107 along a line 5 while making the X direction substantially coincide with the line 5.
摘要翻译：在待处理物体内形成改质区域所需的时间缩短。装置100包括安装台107，用于发射线偏振激光L的光源101，用于发射激光L3的光源41，用于改变激光L的偏振方向的波片51，偏振片52 为了将激光L分割成具有X方向的偏振方向的激光成分L1和Y方向的偏光方向的激光成分L2，将分割的激光成分的偏振方向定向的波片55 L2到X方向，用于使激光成分L1，L3聚光的透镜31，与透镜31平行配置的透镜32沿X方向会聚，具有偏振方向的激光成分L2朝向X 方向，控制部分105，用于控制装置29，使得激光部件L2的会聚点相对于前表面3位于预定位置，通过检测反射光分量L4;以及控制部分115，用于沿着线5移动安装台107，同时使X方向基本上与线5重合。

5. 发明申请

US20080212063A1 Laser Beam Machining System 有权
标题翻译：激光束加工系统
公开(公告)号：US20080212063A1
公开(公告)日：2008-09-04
申请号：US10585825
申请日：2004-12-13
申请人： Norio Kurita , Tetsuya Osajima
发明人： Norio Kurita , Tetsuya Osajima
IPC分类号： G01C3/00
CPC分类号： B23K26/046 , B23K26/048 , B23K26/40 , B23K26/53 , B23K26/702 , B23K2103/50
摘要： To provide a laser processing apparatus which can converge a laser beam for processing an object to be processed at a position as close as possible to a predetermined position.This laser processing apparatus is one for irradiating an object to be processed with a processing laser beam while positioning a converging point within the object so as to form a modified region caused by multiphoton absorption within the object along a line along which, the object should be cut in the object, and comprises an objective lens unit 5 including a processing objective lens 42 which converges the processing laser beam and a rangefinding laser beam for measuring a displacement of a main surface of the object on an identical axis, a light-receiving part 45 which receives a reflected light beam of the rangefinding laser beam on the main surface, and an actuator 43 which holds the processing objective lens 42 according to the received reflected light beam such that the lens 42 is capable of freely advancing and retracting with respect to the main surface; and a housing 21 to which a laser unit for emitting the processing laser beam is attached. The objective lens unit 5 is detachably attached to the housing 21.
摘要翻译：提供一种激光加工装置，其能够会聚用于尽可能靠近预定位置的位置处理待处理物体的激光束。该激光加工装置是将处理用激光束照射在被处理物上的装置，同时将物镜上的会聚点定位在物体内，形成由物体内的多光子吸收引起的改质区域，切割物体，并且包括物镜单元5，其包括会聚处理激光束的处理物镜42和用于测量物体在同一轴上的位移的测距激光束，光接收部分 45，其在主表面上接收测距激光束的反射光束;以及致动器43，其根据接收的反射光束保持处理物镜42，使得透镜42能够相对于透镜42自由地前进和后退主面; 以及安装有用于发射处理激光束的激光单元的壳体21。物镜单元5可拆卸地附接到壳体21。

6. 发明授权

US07360953B2 Light guiding device 失效
标题翻译：导光装置
公开(公告)号：US07360953B2
公开(公告)日：2008-04-22
申请号：US10522180
申请日：2003-07-04
申请人： Kazuhito Kawai , Tetsuya Osajima
发明人： Kazuhito Kawai , Tetsuya Osajima
IPC分类号： G02B6/26 , G02B6/36
CPC分类号： G02B6/04 , G02B6/10 , G02B6/4206 , G02B6/4298
摘要： A light emitting end face side front end part of an optical fiber bundle 16 is covered by a sleeve member 13 and an emitting part outer cover 14. A glass rod holding member 42, which holds a glass rod 40, is mounted to emitting part outer cover 14. Glass rod 40 is fixed to glass rod holding member 42 by means of positioning pins 44 and a light incidence end face 40i thereof opposes a light emitting end face 16o of optical fiber bundle 16. A light emitting end face 40o of glass rod 40 has a rectangular shape. The light emitting from light emitting end face 40o is made uniform in illuminance across the entirety of its cross section and the cross section thereof is shaped to a rectangular shape in the process of being propagated while being totally reflected at the boundary surface of glass rod 40.
摘要翻译：光纤束16的发光端面侧前端部被套筒部件13和发射部分外罩14覆盖。保持玻璃棒40的玻璃棒保持构件42安装到发射部分外盖14。玻璃棒40通过定位销44固定在玻璃棒保持构件42上，其光入射端面40i与光纤束16的发光端面16o相对。玻璃棒40的发光端面40o具有矩形形状。从发光端面40o发出的光在其整个横截面上的照度均匀，并且其横截面在被传播的过程中被成形为矩形形状，同时在玻璃棒的边界面处被完全反射 40。

7. 发明授权

US08610028B2 Laser processing device 有权
标题翻译：激光加工装置
公开(公告)号：US08610028B2
公开(公告)日：2013-12-17
申请号：US12443045
申请日：2007-09-26
申请人： Koji Kuno , Tatsuya Suzuki , Norio Kurita , Tetsuya Osajima
发明人： Koji Kuno , Tatsuya Suzuki , Norio Kurita , Tetsuya Osajima
IPC分类号： B23K26/14 , B23K26/16 , B23K26/06
CPC分类号： B23K26/38 , B23K26/048 , B23K26/0624 , B23K26/0676 , B23K26/0853 , B23K26/0869 , B23K26/40 , B23K26/53 , B23K2101/40 , B23K2103/50
摘要： An apparatus comprises a table, a source emitting polarized laser light, a source emitting laser light, a plate changing the polarization direction of the laser light, a plate splitting the laser light into a laser light having polarization in an X direction and a laser light component having polarization in a Y direction, a plate orienting the polarization direction of the laser light to the X direction, a lens converging the laser light components, a lens arranged in parallel with the lens along the X direction and converges the laser light component, a control section controlling a device such that a converging point of the laser light component is located at a predetermined position with reference to a front face by detecting a reflected light, and a control section moving the table along a line while making the X direction substantially coincide with the line.
摘要翻译：一种装置，包括台，源极发射激光，源发射激光，改变激光的偏振方向的板，将激光分解为具有在X方向上具有偏振的激光的激光和激光在Y方向具有极化的部件，将激光的偏振方向定向为X方向的板，使激光成分会聚的透镜，沿着X方向平行配置的透镜，使激光成分会聚，控制部，其通过检测反射光来控制所述激光成分的会聚点相对于前面位于预定位置;以及控制部，其使所述台沿着一条线移动，同时使X方向基本上符合线条。

8. 发明授权

US07626746B2 Shutter unit and laser processing device using same 有权
标题翻译：快门单元和激光加工设备使用相同
公开(公告)号：US07626746B2
公开(公告)日：2009-12-01
申请号：US10577550
申请日：2004-11-04
申请人： Norio Kurita , Tetsuya Osajima , Masayoshi Kusunoki , Tatsuya Suzuki , Toshimitsu Wakuda
发明人： Norio Kurita , Tetsuya Osajima , Masayoshi Kusunoki , Tatsuya Suzuki , Toshimitsu Wakuda
IPC分类号： G02B26/08
CPC分类号： G02B5/005
摘要： A shutter unit capable of preventing the scattering of the laser beam upon closing the optical path of the laser beam and capable of being miniaturized, and a laser processing device employing such a shutter unit. In a shutter unit 1, when the optical path of the laser beam L is opened, a rotating member 57 is rotated around an axis line γ, and an opening 61 is positioned on an optical axis α so as to pass the laser beam L therethrough. Meanwhile, when the optical path of the laser beam L is closed, the rotating member 57 is rotated and a reflective surface 62 is positioned on the optical axis α so as to reflect the laser beam L. Here, since the reflected laser beam L is absorbed by an optical absorption member 63, it is possible to prevent the scattering of the laser beam L when the optical path of the laser beam L is closed. In addition, since the opening 61 and reflective surface 62 are both formed on the rotating member 57 which rotates around the axis line γ that is substantially orthogonal to the optical axis α, it is possible to reduce the size of the shutter unit 1.
摘要翻译：一种快门单元，其能够防止在关闭激光束的光路并能够小型化时激光束的散射，以及采用这种快门单元的激光加工装置。在快门单元1中，当激光束L的光路打开时，旋转部件57围绕轴线γ转动，并且开口61位于光轴α上，以使激光束L穿过其中。同时，当激光束L的光路闭合时，旋转部件57旋转，反射面62位于光轴α上，以反射激光束L.这里，由于反射激光束L为通过光吸收构件63吸收，可以防止激光束L的光路闭合时的激光L的散射。此外，由于开口61和反射表面62都形成在围绕基本上与光轴α1正交的轴线gamma旋转的旋转部件57上，所以可以减小快门单元1的尺寸。

9. 发明申请

US20090261083A1 LASER PROCESSING METHOD AND LASER PROCESSING DEVICE 有权
标题翻译：激光加工方法和激光加工装置
公开(公告)号：US20090261083A1
公开(公告)日：2009-10-22
申请号：US12064275
申请日：2006-09-13
申请人： Tetsuya Osajima , Ryuji Sugiura , Kazuhiro Atsumi
发明人： Tetsuya Osajima , Ryuji Sugiura , Kazuhiro Atsumi
IPC分类号： B23K26/38
CPC分类号： B28D5/00 , B23K26/066 , B23K26/073 , B23K26/40 , B23K26/53 , B23K2101/40 , B23K2103/50 , H01L21/78
摘要： In the laser processing method, the cross-sectional form of laser light L at a converging point P is such that the maximum length in a direction perpendicular to a line to cut 5 is shorter than the maximum length in a direction parallel to the line to cut 5. Therefore, when seen from the incident direction of the laser light L, a modified region 7 formed within a silicon wafer 11 has such a shape that the maximum length in the direction perpendicular to the line to cut 5 is shorter than the maximum length in the direction parallel to the line to cut 5. Forming the modified region 7 having such a shape within the object 1 can restrain twist hackles from occurring on cut surfaces when cutting the object 1 from the modified region 7 acting as a cutting start point, thereby making it possible to improve the flatness of the cut surfaces.
摘要翻译：在激光加工方法中，会聚点P处的激光L的截面形状使得与切割线5垂直的方向上的最大长度比平行于线对的方向上的最大长度短因此，从激光L的入射方向观察时，形成在硅晶片11内的改质区7具有与切断线5垂直的方向的最大长度比最大长度在与待切割线平行的方向上的长度5.当从作为切割起始点的改质区域7切割物体1时，在物体1内形成具有这种形状的改质区域7可以抑制在切割面上发生扭曲从而可以提高切割面的平坦度。

10. 发明授权

US07595895B2 Laser beam machining system 有权
标题翻译：激光束加工系统
公开(公告)号：US07595895B2
公开(公告)日：2009-09-29
申请号：US10585825
申请日：2004-12-13
申请人： Norio Kurita , Tetsuya Osajima
发明人： Norio Kurita , Tetsuya Osajima
IPC分类号： G01B11/14
CPC分类号： B23K26/046 , B23K26/048 , B23K26/40 , B23K26/53 , B23K26/702 , B23K2103/50
摘要： To provide a laser processing apparatus which can converge a laser beam for processing an object to be processed at a position as close as possible to a predetermined position.This laser processing apparatus is one for irradiating an object to be processed with a processing laser beam while positioning a converging point within the object so as to form a modified region caused by multiphoton absorption within the object along a line along which, the object should be cut in the object, and comprises an objective lens unit 5 including a processing objective lens 42 which converges the processing laser beam and a rangefinding laser beam for measuring a displacement of a main surface of the object on an identical axis, a light-receiving part 45 which receives a reflected light beam of the rangefinding laser beam on the main surface, and an actuator 43 which holds the processing objective lens 42 according to the received reflected light beam such that the lens 42 is capable of freely advancing and retracting with respect to the main surface; and a housing 21 to which a laser unit for emitting the processing laser beam is attached. The objective lens unit 5 is detachably attached to the housing 21.
摘要翻译：提供一种激光加工装置，其能够会聚用于尽可能靠近预定位置的位置处理待处理物体的激光束。该激光加工装置是将处理用激光束照射在被处理物上的装置，同时将物镜上的会聚点定位在物体内，形成由物体内的多光子吸收引起的改质区域，切割物体，并且包括物镜单元5，其包括会聚处理激光束的处理物镜42和用于测量物体在同一轴上的位移的测距激光束，光接收部分 45，其在主表面上接收测距激光束的反射光束;以及致动器43，其根据接收的反射光束保持处理物镜42，使得透镜42能够相对于透镜42自由地前进和后退主面; 以及安装有用于发射处理激光束的激光单元的壳体21。物镜单元5可拆卸地附接到壳体21。

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