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1. 发明申请

US20080218735A1 Laser Processing Method And Device 有权
标题翻译：激光加工方法与装置
公开(公告)号：US20080218735A1
公开(公告)日：2008-09-11
申请号：US10585343
申请日：2004-12-13
申请人： Kazuhiro Atsumi , Koji Kuno , Masayoshi Kusunoki , Tatsuya Suzuki , Kenshi Fukumitsu , Fumitsugu Fukuyo
发明人： Kazuhiro Atsumi , Koji Kuno , Masayoshi Kusunoki , Tatsuya Suzuki , Kenshi Fukumitsu , Fumitsugu Fukuyo
IPC分类号： G01N21/00 , G02B27/02
CPC分类号： B23K26/048 , B23K26/046 , B23K26/0648 , B23K26/38 , B23K26/40 , B23K26/53 , B23K2101/40 , B23K2103/50 , B23K2103/56 , B28D5/0011 , H01L21/67092 , H01L21/78
摘要： A laser processing method which can efficiently perform laser processing while minimizing the deviation of the converging point of a laser beam in end parts of an object to be processed is provided.This laser processing method comprises a preparatory step of holding a lens at an initial position set such that a converging point is located at a predetermined position within the object; a first processing step (S11 and S12) of emitting a first laser beam for processing while holding the lens at the initial position, and moving the lens and the object relative to each other along a main surface so as to form a modified region in one end part of a line to cut; and a second processing step (S13 and S14) of releasing the lens from being held at the initial position after forming the modified region in the one end part of the line to cut, and then moving the lens and the object relative to each other along the main surface while adjusting the gap between the lens and the main surface after the release, so as to form the modified region.
摘要翻译：提供了一种可以有效地执行激光加工同时最小化激光束在待处理物体的端部中的会聚点的偏差的激光加工方法。该激光加工方法包括：准备步骤，将透镜保持在初始位置，使得会聚点位于物体内的预定位置; 在将透镜保持在初始位置的同时发射用于处理的第一激光束并沿着主表面相对于彼此移动透镜和物体的第一处理步骤（S11和S12），以形成修改区域在一端切割一条线; 以及在要切割的线的一个端部中形成修改区域之后将透镜释放保持在初始位置的第二处理步骤（S13和S14），然后相对于每个移动透镜和物体另外沿着主表面，同时在释放之后调整透镜和主表面之间的间隙，从而形成改质区域。

2. 发明授权

US08624153B2 Laser processing method and device 有权
标题翻译：激光加工方法及装置
公开(公告)号：US08624153B2
公开(公告)日：2014-01-07
申请号：US10585343
申请日：2004-12-13
申请人： Kazuhiro Atsumi , Koji Kuno , Masayoshi Kusunoki , Tatsuya Suzuki , Kenshi Fukumitsu , Fumitsugu Fukuyo
发明人： Kazuhiro Atsumi , Koji Kuno , Masayoshi Kusunoki , Tatsuya Suzuki , Kenshi Fukumitsu , Fumitsugu Fukuyo
IPC分类号： B23K26/14
CPC分类号： B23K26/048 , B23K26/046 , B23K26/0648 , B23K26/38 , B23K26/40 , B23K26/53 , B23K2101/40 , B23K2103/50 , B23K2103/56 , B28D5/0011 , H01L21/67092 , H01L21/78
摘要： A laser processing method which can efficiently perform laser processing while minimizing the deviation of the converging point of a laser beam in end parts of an object to be processed is provided.This laser processing method comprises a preparatory step of holding a lens at an initial position set such that a converging point is located at a predetermined position within the object; a first processing step (S11 and S12) of emitting a first laser beam for processing while holding the lens at the initial position, and moving the lens and the object relative to each other along a main surface so as to form a modified region in one end part of a line to cut; and a second processing step (S13 and S14) of releasing the lens from being held at the initial position after forming the modified region in the one end part of the line to cut, and then moving the lens and the object relative to each other along the main surface while adjusting the gap between the lens and the main surface after the release, so as to form the modified region.
摘要翻译：提供了一种可以有效地执行激光加工同时最小化激光束在待处理物体的端部中的会聚点的偏差的激光加工方法。该激光加工方法包括：准备步骤，将透镜保持在初始位置，使得会聚点位于物体内的预定位置; 第一处理步骤（S11和S12），其在将透镜保持在初始位置的同时发射用于处理的第一激光束，并且沿着主表面相对于彼此移动透镜和物体，以在一个主表面上形成改质区域一段线切断; 以及第二处理步骤（S13和S14），其在形成要切割的线的一个端部中的改质区域之后，将透镜保持在初始位置，然后沿着彼此移动透镜和物体主表面同时调整透镜与主表面之间的间隙释放后，形成改质区域。

3. 发明授权

US07547613B2 Laser processing method and laser processing apparatus 有权
公开(公告)号：US07547613B2
公开(公告)日：2009-06-16
申请号：US11106657
申请日：2005-04-15
申请人： Fumitsugu Fukuyo , Kenshi Fukumitsu , Naoki Uchiyama , Toshimitsu Wakuda , Kazuhiro Atsumi , Kenichi Muramatsu
发明人： Fumitsugu Fukuyo , Kenshi Fukumitsu , Naoki Uchiyama , Toshimitsu Wakuda , Kazuhiro Atsumi , Kenichi Muramatsu
IPC分类号： H01L21/66 , B23K26/06
CPC分类号： H01L21/78 , B23K20/023 , B23K20/16 , B23K20/233 , B23K20/26 , B23K26/03 , B23K26/032 , B23K26/034 , B23K26/046 , B23K26/0624 , B23K26/066 , B23K26/073 , B23K26/0853 , B23K26/16 , B23K26/364 , B23K26/40 , B23K26/53 , B23K2101/40 , B23K2103/50 , B28D5/0011 , B65G2249/04 , C03B33/023 , C03B33/082 , C03B33/102 , C03C23/0025 , G02F1/1368 , H01L21/6836 , H01L2221/68327 , Y02P40/57 , Y10T29/49144 , Y10T83/0341
摘要： A laser beam machining method and a laser beam machining device capable of cutting a work without producing a fusing and a cracking out of a predetermined cutting line on the surface of the work, wherein a pulse laser beam is radiated on the predetermined cut line on the surface of the work under the conditions causing a multiple photon absorption and with a condensed point aligned to the inside of the work, and a modified area is formed inside the work along the predetermined determined cut line by moving the condensed point along the predetermined cut line, whereby the work can be cut with a rather small force by cracking the work along the predetermined cut line starting from the modified area and, because the pulse laser beam radiated is not almost absorbed onto the surface of the work, the surface is not fused even if the modified area is formed.

4. 发明申请

US20050173387A1 Laser processing method and laser processing apparatus 有权
公开(公告)号：US20050173387A1
公开(公告)日：2005-08-11
申请号：US11101543
申请日：2005-04-08
申请人： Fumitsugu Fukuyo , Kenshi Fukumitsu , Naoki Uchiyama , Toshimitsu Wakuda , Kazuhiro Atsumi , Kenichi Muramatsu
发明人： Fumitsugu Fukuyo , Kenshi Fukumitsu , Naoki Uchiyama , Toshimitsu Wakuda , Kazuhiro Atsumi , Kenichi Muramatsu
IPC分类号： B28D5/00 , B23K26/073 , B23K26/38 , B23K101/40 , C03B33/023 , C03B33/08 , C03B33/10 , C03C23/00 , G02F1/1368 , H01L21/301 , B23K26/14 , B23K26/16 , G01B9/02
CPC分类号： H01L21/78 , B23K20/023 , B23K20/16 , B23K20/233 , B23K20/26 , B23K26/03 , B23K26/032 , B23K26/034 , B23K26/046 , B23K26/0624 , B23K26/066 , B23K26/073 , B23K26/0853 , B23K26/16 , B23K26/364 , B23K26/40 , B23K26/53 , B23K2101/40 , B23K2103/50 , B28D5/0011 , B65G2249/04 , C03B33/023 , C03B33/082 , C03B33/102 , C03C23/0025 , G02F1/1368 , H01L21/6836 , H01L2221/68327 , Y02P40/57 , Y10T29/49144 , Y10T83/0341
摘要： A laser beam machining method and a laser beam machining device capable of cutting a work without producing a fusing and a cracking out of a predetermined cutting line on the surface of the work, wherein a pulse laser beam is radiated on the predetermined cut line on the surface of the work under the conditions causing a multiple photon absorption and with a condensed point aligned to the inside of the work, and a modified area is formed inside the work along the predetermined determined cut line by moving the condensed point along the predetermined cut line, whereby the work can be cut with a rather small force by cracking the work along the predetermined cut line starting from the modified area and, because the pulse laser beam radiated is not almost absorbed onto the surface of the work, the surface is not fused even if the modified area is formed.

5. 发明授权

US08890027B2 Laser processing method and laser processing system 有权
标题翻译：激光加工方法和激光加工系统
公开(公告)号：US08890027B2
公开(公告)日：2014-11-18
申请号：US12282698
申请日：2007-03-06
申请人： Fumitsugu Fukuyo , Etsuji Ohmura , Kenshi Fukumitsu , Masayoshi Kumagai , Kazuhiro Atsumi , Naoki Uchiyama
发明人： Fumitsugu Fukuyo , Etsuji Ohmura , Kenshi Fukumitsu , Masayoshi Kumagai , Kazuhiro Atsumi , Naoki Uchiyama
IPC分类号： B23K26/38 , B23K26/00 , B23K26/06 , B23K26/36
CPC分类号： B23K26/53 , B23K26/0622 , B23K26/0853 , B23K26/364 , B23K26/40 , B23K2101/40 , B23K2103/50 , C03B33/0222 , C03B33/037 , H01L21/78
摘要： An object to be processed 1 is irradiated with laser light L with a standard pulse waveform, so as to form a molten processed region 131, which has a larger size in the thickness direction of the object 1 and is easy to generate a fracture 24 in the thickness direction of the object 1, within a silicon wafer 111, and with laser light L with a retarded pulse waveform, so as to form a molten processed region 132, which has a smaller size in the thickness direction of the object 1 and is hard to generate the fracture 24 in the thickness direction of the object 1, within a silicon wafer 112.
摘要翻译：用标准脉冲波形的激光L对被处理物体1进行照射，形成在物体1的厚度方向上具有较大尺寸的熔融处理区域131，容易产生骨折24 物体1的厚度方向，硅晶片111内，以及具有延迟脉冲波形的激光L，形成在物体1的厚度方向上具有较小尺寸的熔融处理区域132，并且为在硅晶片112内难以在物体1的厚度方向上产生裂缝24。

6. 发明申请

US20100176100A1 LASER PROCESSING METHOD AND LASER PROCESSING APPARATUS 有权
标题翻译：激光加工方法和激光加工设备
公开(公告)号：US20100176100A1
公开(公告)日：2010-07-15
申请号：US12686039
申请日：2010-01-12
申请人： Fumitsugu Fukuyo , Kenshi Fukumitsu , Naoki Uchiyama , Toshimitsu Wakuda , Kazuhiro Atsumi , Kenichi Muramatsu
发明人： Fumitsugu Fukuyo , Kenshi Fukumitsu , Naoki Uchiyama , Toshimitsu Wakuda , Kazuhiro Atsumi , Kenichi Muramatsu
IPC分类号： B23K26/04 , B23K26/073 , B23K26/38
CPC分类号： H01L21/78 , B23K20/023 , B23K20/16 , B23K20/233 , B23K20/26 , B23K26/03 , B23K26/032 , B23K26/034 , B23K26/046 , B23K26/0624 , B23K26/066 , B23K26/073 , B23K26/0853 , B23K26/16 , B23K26/364 , B23K26/40 , B23K26/53 , B23K2101/40 , B23K2103/50 , B28D5/0011 , B65G2249/04 , C03B33/023 , C03B33/082 , C03B33/102 , C03C23/0025 , G02F1/1368 , H01L21/6836 , H01L2221/68327 , Y02P40/57 , Y10T29/49144 , Y10T83/0341
摘要： A laser beam machining method and a laser beam machining device capable of cutting a work without producing a fusing and a cracking out of a predetermined cutting line on the surface of the work, wherein a pulse laser beam is radiated on the predetermined cut line on the surface of the work under the conditions causing a multiple photon absorption and with a condensed point aligned to the inside of the work, and a modified area is formed inside the work along the predetermined determined cut line by moving the condensed point along the predetermined cut line, whereby the work can be cut with a rather small force by cracking the work along the predetermined cut line starting from the modified area and, because the pulse laser beam radiated is not almost absorbed onto the surface of the work, the surface is not fused even if the modified area is formed.
摘要翻译：一种激光束加工方法和激光束加工装置，其能够切割工件而不产生在工件表面上的预定切割线的定影和裂纹，其中脉冲激光束照射在工件的预定切割线上在导致多光子吸收的条件下并且具有与工件内部对准的凝聚点的工作表面，并且沿着预定的切割线沿着预定的切割线沿着预定的切割线移动凝聚点而在工件内部形成改质区域由此，可以用相当小的力通过从修改区域开始沿着预定切割线的工作而切割工件，并且因为辐射的脉冲激光束几乎不被吸收到工件的表面上，所以表面不熔合即使形成了修改区域。

7. 发明申请

US20050189330A1 Laser processing method and laser processing apparatus 有权
公开(公告)号：US20050189330A1
公开(公告)日：2005-09-01
申请号：US11106644
申请日：2005-04-15
申请人： Fumitsugu Fukuyo , Kenshi Fukumitsu , Naoki Uchiyama , Toshimitsu Wakuda , Kazuhiro Atsumi , Kenichi Muramatsu
发明人： Fumitsugu Fukuyo , Kenshi Fukumitsu , Naoki Uchiyama , Toshimitsu Wakuda , Kazuhiro Atsumi , Kenichi Muramatsu
IPC分类号： B28D5/00 , B23K26/073 , B23K26/38 , B23K101/40 , C03B33/023 , C03B33/08 , C03B33/10 , C03C23/00 , G02F1/1368 , H01L21/301 , B23K26/40
CPC分类号： H01L21/78 , B23K20/023 , B23K20/16 , B23K20/233 , B23K20/26 , B23K26/03 , B23K26/032 , B23K26/034 , B23K26/046 , B23K26/0624 , B23K26/066 , B23K26/073 , B23K26/0853 , B23K26/16 , B23K26/364 , B23K26/40 , B23K26/53 , B23K2101/40 , B23K2103/50 , B28D5/0011 , B65G2249/04 , C03B33/023 , C03B33/082 , C03B33/102 , C03C23/0025 , G02F1/1368 , H01L21/6836 , H01L2221/68327 , Y02P40/57 , Y10T29/49144 , Y10T83/0341
摘要： A laser beam machining method and a laser beam machining device capable of cutting a work without producing a fusing and a cracking out of a predetermined cutting line on the surface of the work, wherein a pulse laser beam is radiated on the predetermined cut line on the surface of the work under the conditions causing a multiple photon absorption and with a condensed point aligned to the inside of the work, and a modified area is formed inside the work along the predetermined determined cut line by moving the condensed point along the predetermined cut line, whereby the work can be cut with a rather small force by cracking the work along the predetermined cut line starting from the modified area and, because the pulse laser beam radiated is not almost absorbed onto the surface of the work, the surface is not fused even if the modified area is formed.

8. 发明申请

US20050181581A1 Laser processing method and laser processing apparatus 有权
公开(公告)号：US20050181581A1
公开(公告)日：2005-08-18
申请号：US11106643
申请日：2005-04-15
申请人： Fumitsugu Fukuyo , Kenshi Fukumitsu , Naoki Uchiyama , Toshimitsu Wakuda , Kazuhiro Atsumi , Kenichi Muramatsu
发明人： Fumitsugu Fukuyo , Kenshi Fukumitsu , Naoki Uchiyama , Toshimitsu Wakuda , Kazuhiro Atsumi , Kenichi Muramatsu
IPC分类号： B28D5/00 , B23K26/073 , B23K26/38 , B23K101/40 , C03B33/023 , C03B33/08 , C03B33/10 , C03C23/00 , G02F1/1368 , H01L21/301 , H01L21/78 , H01L21/46 , G01B9/02
CPC分类号： H01L21/78 , B23K20/023 , B23K20/16 , B23K20/233 , B23K20/26 , B23K26/03 , B23K26/032 , B23K26/034 , B23K26/046 , B23K26/0624 , B23K26/066 , B23K26/073 , B23K26/0853 , B23K26/16 , B23K26/364 , B23K26/40 , B23K26/53 , B23K2101/40 , B23K2103/50 , B28D5/0011 , B65G2249/04 , C03B33/023 , C03B33/082 , C03B33/102 , C03C23/0025 , G02F1/1368 , H01L21/6836 , H01L2221/68327 , Y02P40/57 , Y10T29/49144 , Y10T83/0341
摘要： A laser beam machining method and a laser beam machining device capable of cutting a work without producing a fusing and a cracking out of a predetermined cutting line on the surface of the work, wherein a pulse laser beam is radiated on the predetermined cut line on the surface of the work under the conditions causing a multiple photon absorption and with a condensed point aligned to the inside of the work, and a modified area is formed inside the work along the predetermined determined cut line by moving the condensed point along the predetermined cut line, whereby the work can be cut with a rather small force by cracking the work along the predetermined cut line starting from the modified area and, because the pulse laser beam radiated is not almost absorbed onto the surface of the work, the surface is not fused even if the modified area is formed.

9. 发明申请

US20090236324A1 LASER PROCESSING METHOD AND LASER PROCESSING SYSTEM 有权
标题翻译：激光加工方法和激光加工系统
公开(公告)号：US20090236324A1
公开(公告)日：2009-09-24
申请号：US12282698
申请日：2007-03-06
申请人： Fumitsugu Fukuyo , Etsuji Ohmura , Kenshi Fukumitsu , Masayoshi Kumagai , Kazuhiro Atsumi , Naoki Uchiyama
发明人： Fumitsugu Fukuyo , Etsuji Ohmura , Kenshi Fukumitsu , Masayoshi Kumagai , Kazuhiro Atsumi , Naoki Uchiyama
IPC分类号： B23K26/38
CPC分类号： B23K26/53 , B23K26/0622 , B23K26/0853 , B23K26/364 , B23K26/40 , B23K2101/40 , B23K2103/50 , C03B33/0222 , C03B33/037 , H01L21/78
摘要： An object to be processed 1 is irradiated with laser light L with a standard pulse waveform, so as to form a molten processed region 131, which has a larger size in the thickness direction of the object 1 and is easy to generate a fracture 24 in the thickness direction of the object 1, within a silicon wafer 111, and with laser light L with a retarded pulse waveform, so as to form a molten processed region 132, which has a smaller size in the thickness direction of the object 1 and is hard to generate the fracture 24 in the thickness direction of the object 1, within a silicon wafer 112.
摘要翻译：用标准脉冲波形的激光L对被处理物体1进行照射，形成在物体1的厚度方向上具有较大尺寸的熔融处理区域131，容易产生骨折24 物体1的厚度方向，硅晶片111内，以及具有延迟脉冲波形的激光L，形成在物体1的厚度方向上具有较小尺寸的熔融处理区域132，并且为在硅晶片112内难以在物体1的厚度方向上产生裂缝24。

10. 发明授权

US07592238B2 Laser processing method and laser processing apparatus 有权
公开(公告)号：US07592238B2
公开(公告)日：2009-09-22
申请号：US11106648
申请日：2005-04-15
申请人： Fumitsugu Fukuyo , Kenshi Fukumitsu , Naoki Uchiyama , Toshimitsu Wakuda , Kazuhiro Atsumi , Kenichi Muramatsu
发明人： Fumitsugu Fukuyo , Kenshi Fukumitsu , Naoki Uchiyama , Toshimitsu Wakuda , Kazuhiro Atsumi , Kenichi Muramatsu
IPC分类号： H01L21/78 , H01L21/82
CPC分类号： H01L21/78 , B23K20/023 , B23K20/16 , B23K20/233 , B23K20/26 , B23K26/03 , B23K26/032 , B23K26/034 , B23K26/046 , B23K26/0624 , B23K26/066 , B23K26/073 , B23K26/0853 , B23K26/16 , B23K26/364 , B23K26/40 , B23K26/53 , B23K2101/40 , B23K2103/50 , B28D5/0011 , B65G2249/04 , C03B33/023 , C03B33/082 , C03B33/102 , C03C23/0025 , G02F1/1368 , H01L21/6836 , H01L2221/68327 , Y02P40/57 , Y10T29/49144 , Y10T83/0341
摘要： A laser beam machining method and a laser beam machining device capable of cutting a work without producing a fusing and a cracking out of a predetermined cutting line on the surface of the work, wherein a pulse laser beam is radiated on the predetermined cut line on the surface of the work under the conditions causing a multiple photon absorption and with a condensed point aligned to the inside of the work, and a modified area is formed inside the work along the predetermined determined cut line by moving the condensed point along the predetermined cut line, whereby the work can be cut with a rather small force by cracking the work along the predetermined cut line starting from the modified area and, because the pulse laser beam radiated is not almost absorbed onto the surface of the work, the surface is not fused even if the modified area is formed.

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