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    • 1. 发明授权
    • Laser material processing system
    • 激光材料加工系统
    • US08563893B2
    • 2013-10-22
    • US12096940
    • 2006-12-12
    • Koji KunoKenichi MuramatsuKazuhiro AtsumiTetsuya Osajima
    • Koji KunoKenichi MuramatsuKazuhiro AtsumiTetsuya Osajima
    • H01L21/78H01S3/13B23K26/00B23K26/06
    • B23K26/048B23K26/046B23K26/0617B23K26/40B23K26/53B23K2101/40B23K2103/50
    • A laser processing apparatus comprises a converging lens 31 for converging processing laser light and rangefinding laser light L2 toward a wafer 1, an actuator for actuating the lens 31, a shaping optical system 49 for adding astigmatism to reflected light L3 of the rangefinding laser light, a quadrant photodiode 42 for receiving the reflected light L3 and outputting voltage values corresponding to its light quantities, and a controller for regulating the actuator, and positions a converging point P2 of the rangefinding laser light L2 between a focal point P0 of the lens and the lens 31, so as to make it possible to form a modified region at a position deeper from the front face 3, thereby suppressing adverse effects due to the reflected light L3. The control is based on an arithmetic value subjected to a division by a sum of the voltage values, so as to prevent the arithmetic value from being changed by the quantity of reflected light.
    • 激光加工装置包括用于会聚处理激光的聚光透镜31和朝向晶片1的测距激光L2,用于致动透镜31的致动器,用于对测距激光的反射光L3增加散光的整形光学系统49, 用于接收反射光L3并输出与其光量相对应的电压值的象限光电二极管42,以及用于调节致动器的控制器,并将测距激光L2的会聚点P2定位在透镜的焦点P0和 透镜31,从而能够在比正面3更深的位置形成改质区域,由此抑制由反射光L3引起的不利影响。 控制基于经过除以电压值之和的算术值,以防止算术值被反射光量改变。
    • 2. 发明申请
    • Laser Material Processing System
    • 激光材料加工系统
    • US20090166342A1
    • 2009-07-02
    • US12096940
    • 2006-12-12
    • Koji KunoKenichi MuramatsuKazuhiro AtsumiTetsuya Osajima
    • Koji KunoKenichi MuramatsuKazuhiro AtsumiTetsuya Osajima
    • B23K26/38
    • B23K26/048B23K26/046B23K26/0617B23K26/40B23K26/53B23K2101/40B23K2103/50
    • A laser processing apparatus comprises a converging lens 31 for converging processing laser light and rangefinding laser light L2 toward a wafer 1, an actuator for actuating the lens 31, a shaping optical system 49 for adding astigmatism to reflected light L3 of the rangefinding laser light, a quadrant photodiode 42 for receiving the reflected light L3 and outputting voltage values corresponding to its light quantities, and a controller for regulating the actuator, and positions a converging point P2 of the rangefinding laser light L2 between a focal point P0 of the lens and the lens 31, so as to make it possible to form a modified region at a position deeper from the front face 3, thereby suppressing adverse effects due to the reflected light L3. The control is based on an arithmetic value subjected to a division by a sum of the voltage values, so as to prevent the arithmetic value from being changed by the quantity of reflected light.
    • 激光加工装置包括用于会聚处理激光的聚光透镜31和朝向晶片1的测距激光L2,用于致动透镜31的致动器,用于对测距激光的反射光L3增加散光的整形光学系统49, 用于接收反射光L3并输出与其光量相对应的电压值的象限光电二极管42,以及用于调节致动器的控制器,并将测距激光L2的会聚点P2定位在透镜的焦点P0和 透镜31,从而能够在比正面3更深的位置形成改质区域,由此抑制由反射光L3引起的不利影响。 控制基于经过除以电压值之和的算术值,以防止算术值被反射光量改变。
    • 4. 发明申请
    • LASER PROCESSING DEVICE
    • 激光加工设备
    • US20100025386A1
    • 2010-02-04
    • US12443045
    • 2007-09-26
    • Koji KunoTatsuya SuzukiNorio KuritaTetsuya Osajima
    • Koji KunoTatsuya SuzukiNorio KuritaTetsuya Osajima
    • B23K26/06B23K26/38
    • B23K26/38B23K26/048B23K26/0624B23K26/0676B23K26/0853B23K26/0869B23K26/40B23K26/53B23K2101/40B23K2103/50
    • The time required for forming a modified region within an object to be processed is shortened. An apparatus 100 comprises a mount table 107, a light source 101 for emitting linearly polarized laser light L, a light source 41 for emitting laser light L3, a wave plate 51 for changing the polarization direction of the laser light L, a polarizing plate 52 for splitting the laser light L into a laser light component L1 having a polarization direction in an X direction and a laser light component L2 having a polarization direction in a Y direction, a wave plate 55 for orienting the polarization direction of the split laser light component L2 to the X direction, a lens 31 for converging the laser light components L1, L3, a lens 32 which is arranged in parallel with the lens 31 along the X direction and converges the laser light component L2 having the polarization direction oriented to the X direction, a control section 105 for controlling a device 29 such that a converging point of the laser light component L2 is located at a predetermined position with reference to a front face 3 by detecting a reflected light component L4, and a control section 115 for moving the mount table 107 along a line 5 while making the X direction substantially coincide with the line 5.
    • 在待处理物体内形成改质区域所需的时间缩短。 装置100包括安装台107,用于发射线偏振激光L的光源101,用于发射激光L3的光源41,用于改变激光L的偏振方向的波片51,偏振片52 为了将激光L分割成具有X方向的偏振方向的激光成分L1和Y方向的偏光方向的激光成分L2,将分割的激光成分的偏振方向定向的波片55 L2到X方向,用于使激光成分L1,L3聚光的透镜31,与透镜31平行配置的透镜32沿X方向会聚,具有偏振方向的激光成分L2朝向X 方向,控制部分105,用于控制装置29,使得激光部件L2的会聚点相对于前表面3位于预定位置,通过 检测反射光分量L4;以及控制部分115,用于沿着线5移动安装台107,同时使X方向基本上与线5重合。
    • 10. 发明授权
    • Laser processing method and device
    • 激光加工方法及装置
    • US08624153B2
    • 2014-01-07
    • US10585343
    • 2004-12-13
    • Kazuhiro AtsumiKoji KunoMasayoshi KusunokiTatsuya SuzukiKenshi FukumitsuFumitsugu Fukuyo
    • Kazuhiro AtsumiKoji KunoMasayoshi KusunokiTatsuya SuzukiKenshi FukumitsuFumitsugu Fukuyo
    • B23K26/14
    • B23K26/048B23K26/046B23K26/0648B23K26/38B23K26/40B23K26/53B23K2101/40B23K2103/50B23K2103/56B28D5/0011H01L21/67092H01L21/78
    • A laser processing method which can efficiently perform laser processing while minimizing the deviation of the converging point of a laser beam in end parts of an object to be processed is provided.This laser processing method comprises a preparatory step of holding a lens at an initial position set such that a converging point is located at a predetermined position within the object; a first processing step (S11 and S12) of emitting a first laser beam for processing while holding the lens at the initial position, and moving the lens and the object relative to each other along a main surface so as to form a modified region in one end part of a line to cut; and a second processing step (S13 and S14) of releasing the lens from being held at the initial position after forming the modified region in the one end part of the line to cut, and then moving the lens and the object relative to each other along the main surface while adjusting the gap between the lens and the main surface after the release, so as to form the modified region.
    • 提供了一种可以有效地执行激光加工同时最小化激光束在待处理物体的端部中的会聚点的偏差的激光加工方法。 该激光加工方法包括:准备步骤,将透镜保持在初始位置,使得会聚点位于物体内的预定位置; 第一处理步骤(S11和S12),其在将透镜保持在初始位置的同时发射用于处理的第一激光束,并且沿着主表面相对于彼此移动透镜和物体,以在一个主表面上形成改质区域 一段线切断; 以及第二处理步骤(S13和S14),其在形成要切割的线的一个端部中的改质区域之后,将透镜保持在初始位置,然后沿着彼此移动透镜和物体 主表面同时调整透镜与主表面之间的间隙释放后,形成改质区域。