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    • 8. 发明授权
    • Circuit pattern inspection apparatus
    • 电路图形检查装置
    • US07696487B2
    • 2010-04-13
    • US11594985
    • 2006-11-09
    • Koichi HayakawaJiro InoueMasaaki Nojiri
    • Koichi HayakawaJiro InoueMasaaki Nojiri
    • G01K1/08H01J3/14
    • G01N23/2251
    • The via chain conduction failure due to non-conduction caused by insufficient etching in a contact plug/via plug forming process can be detected precisely in a short time. For its achievement, a defect is detected at high speed by taking advantage of characteristics of a potential contrast method using a via chain defect inspection structure and an electron beam defect detection apparatus which can perform continuous inspection while changing an inspection direction without rotating a wafer. Accordingly, the capturing efficiency of a critical electric defect and search efficiency of a defect point can be improved.
    • 可以在短时间内精确地检测由于在接触插塞/通孔插塞形成过程中不足蚀刻而导致的非导通的通路链导通故障。 为了实现这一点,通过利用使用通孔链缺陷检查结构和电子束缺陷检测装置的电位对比方法的特性,可以高速检测缺陷,该电子束缺陷检测装置可以在不转动晶片的同时改变检查方向的同时进行连续检查。 因此,可以提高关键电气缺陷的捕获效率和缺陷点的搜索效率。