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1. 发明申请

US20050136703A1 Flexible cable interconnect assembly 有权
公开(公告)号：US20050136703A1
公开(公告)日：2005-06-23
申请号：US10742501
申请日：2003-12-19
申请人： Koenraad Van Schuylenbergh , Armin Volkel , Thomas DiStefano , Michel Rosa , David Fork , Eugene Chow , Meng Lean
发明人： Koenraad Van Schuylenbergh , Armin Volkel , Thomas DiStefano , Michel Rosa , David Fork , Eugene Chow , Meng Lean
IPC分类号： H05K1/14 , H01B11/00 , H01R12/00 , H01R12/04 , H05K3/32 , H05K3/36
CPC分类号： H01R12/78 , H05K1/147 , H05K3/323 , H05K3/361 , H05K3/365 , H05K2201/044 , H05K2201/09845
摘要： A data transmission interconnect assembly (e.g., a router) capable of transmission speeds in excess of 40 Gbps in which a line-card is detachably coupled to a backplane using flexible flat cables that are bent to provide a continuous, smooth curve between the connected boards, and connected by a connection apparatus that employs cable-to-cable interface members that are transparent to the transmitted signal waves. Microspring contact structures are formed on the cables, or on a contact structure pressed against the cables, to provide interface arrangements that are smaller than a wavelength of the transmitted signal. A connector apparatus uses a cam mechanism to align the cables, and then to press a contact structure, having micro spring interface members formed thereon, against the cables. An alterative contact structure uses anisotropic conductive film.

2. 发明申请

US20060009051A1 Flexible cable interconnect assembly 有权
公开(公告)号：US20060009051A1
公开(公告)日：2006-01-12
申请号：US11226186
申请日：2005-09-13
申请人： Koenraad Schuylenbergh , Armin Volkel , Thomas DiStefano , Michel Rosa , David Fork , Eugene Chow , Meng Lean
发明人： Koenraad Schuylenbergh , Armin Volkel , Thomas DiStefano , Michel Rosa , David Fork , Eugene Chow , Meng Lean
IPC分类号： H01R12/00
CPC分类号： H01R12/78 , H05K1/147 , H05K3/323 , H05K3/361 , H05K3/365 , H05K2201/044 , H05K2201/09845
摘要： A data transmission interconnect assembly capable of transmission speeds in excess of 40 Gbps in which, for example, a line-card is detachably coupled to a backplane using flexible flat cables that are bent to provide a continuous, smooth curve between the connected boards, and connected by a connection apparatus that employs cable-to-cable interface members that are transparent to the transmitted signal waves. Microspring interface members are formed on the contact structure pressed against the cables to provide interface arrangements that are smaller than a wavelength of the transmitted signal. A connector apparatus uses a cam mechanism to align the cables, and then to press the contact structure, having the microspring interface members formed thereon, against the cables. An alterative contact structure uses anisotropic conductive film.

3. 发明申请

US20050006829A1 High force metal plated spring structure 有权
标题翻译：高强度金属电镀弹簧结构
公开(公告)号：US20050006829A1
公开(公告)日：2005-01-13
申请号：US10615653
申请日：2003-07-08
申请人： Eugene Chow , David Fork , Thomas Hantschel , Koenraad Van Schuylenbergh , Christopher Chua
发明人： Eugene Chow , David Fork , Thomas Hantschel , Koenraad Van Schuylenbergh , Christopher Chua
IPC分类号： F16F1/02 , H01L27/148 , F16F1/00 , F16F9/00 , H01L29/768
CPC分类号： F16F1/027
摘要： Lithographically defined and etched spring structures are produced by various methods such that they avoid the formation of a plated metal wedge on an underside of the spring structure after release. A post is utilized to offset the spring from an underlying substrate by a distance greater than the thickness of the plated metal. A trench is etched into the substrate below the spring to provide clearance during deflection of the spring. Another spring includes a knee (bend) that provides the necessary clearance during deflection. A plating process is limited to the upper side of another spring. A released spring is used as a shadow mask for patterning resist that prevents wedge formation during plating. Various tip arrangements are disclosed that can be utilized with each spring structure
摘要翻译：通过各种方法制造光刻定义和蚀刻的弹簧结构，使得它们在释放之后避免在弹簧结构的下侧上形成电镀金属楔。使用柱子将弹簧从下面的衬底偏移大于电镀金属的厚度的距离。在弹簧下方的衬底中蚀刻沟槽，以在弹簧偏转期间提供间隙。另一个弹簧包括在偏转期间提供必要的间隙的膝盖（弯头）。电镀工艺限于另一弹簧的上侧。释放的弹簧用作用于图案化抗蚀剂的荫罩，其防止电镀期间的楔形成。公开了可以与每个弹簧结构一起使用的各种尖端装置

4. 发明申请

US20060030179A1 Transmission-line spring structure 审中-公开
标题翻译：传动线弹簧结构
公开(公告)号：US20060030179A1
公开(公告)日：2006-02-09
申请号：US10913904
申请日：2004-08-05
申请人： Koenraad Van Schuylenbergh , Christopher Chua , David Fork
发明人： Koenraad Van Schuylenbergh , Christopher Chua , David Fork
IPC分类号： H01R12/00
CPC分类号： H01L24/72 , G01R1/06716 , G01R1/06727 , G01R1/06761 , G01R1/06772 , H01L2924/01005 , H01L2924/01006 , H01L2924/01024 , H01L2924/01029 , H01L2924/01033 , H01L2924/0104 , H01L2924/01042 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01327 , H01L2924/14 , H01L2924/19041 , H01L2924/30107 , H01L2924/3011 , H01L2924/3025 , H01P3/081 , H01P3/085 , H01R12/718 , H01R13/24 , H01R13/6461 , H01R13/6477 , H05K1/0218 , H05K3/4092
摘要： A curved transmission-line spring structure formed by self-bending materials (e.g., stress-engineered materials, intermetallic compounds and/or bimorphs) that are layered to form a stripline or microstrip transmission line. A dielectric layer is sandwiched between two conductive layers, which form the signal and ground lines of the structure. The various layers are etched to form an elongated spring structure, and then one end of the spring structure is released from the underlying substrate, causing the tip of the released end to bend away from the substrate for contact with a second device. One or both of the conductive layers is fabricated using self-bending spring metals to facilitate the bending process, and plated metal is utilized for conductivity. Alternatively, or in addition, the dielectric layer is formed using a stress-engineered dielectric material. Two-tip and three-tip structures are used to facilitate connection of both the ground and signal lines.
摘要翻译：通过层叠以形成带状线或微带传输线的自弯曲材料（例如，应力工程材料，金属间化合物和/或双压电晶片）形成的弯曲传输线弹簧结构。介电层夹在两个导电层之间，形成结构的信号和接地线。蚀刻各种层以形成细长的弹簧结构，然后弹簧结构的一端从下面的基底释放，使得释放端的尖端远离基板弯曲以与第二装置接触。使用自弯曲弹簧金属制造一个或两个导电层以促进弯曲过程，并且将电镀金属用于导电性。或者或另外，使用应力工程介电材料形成电介质层。两端和三端结构用于促进接地和信号线的连接。

5. 发明申请

US20050130462A1 Stressed metal contact with enhanced lateral compliance 有权
标题翻译：强化金属接触，增强侧向顺应性
公开(公告)号：US20050130462A1
公开(公告)日：2005-06-16
申请号：US10737272
申请日：2003-12-15
申请人： Koenraad Van Schuylenbergh , Christopher Chua , David Fork
发明人： Koenraad Van Schuylenbergh , Christopher Chua , David Fork
IPC分类号： H01R12/00
CPC分类号： H01R13/2407
摘要： An electrical interconnect structure that includes a spring portion that extends out of a plane. The electrical interconnect including curved regions to improve the lateral compliance of the interconnect. The curved region may be incorporated into a release region of the spring. The release region may include either or both an uplifted region and a planar region. The curves in the release region are arranged to improve the spring contact with a mating surface and also improve lateral compliance compared to prior art spring designs.
摘要翻译：一种电互连结构，其包括从平面延伸的弹簧部分。电互连包括弯曲区域，以改善互连的横向顺应性。弯曲区域可以结合到弹簧的释放区域中。释放区域可以包括隆起区域和平坦区域中的一个或两个。释放区域中的曲线布置成改进与配合表面的弹簧接触，并且与现有技术的弹簧设计相比，还改善了侧向顺从性。

6. 发明申请

US20060057031A1 Capillary-channel probes for liquid pickup, transportation and dispense using stressy metal 有权
标题翻译：用于采用压力金属的液体拾取，运输和分配的毛细管通道探头
公开(公告)号：US20060057031A1
公开(公告)日：2006-03-16
申请号：US11267762
申请日：2005-11-03
申请人： Thomas Hantschel , David Fork , Eugene Chow , Dirk De Bruyker , Michel Rosa
发明人： Thomas Hantschel , David Fork , Eugene Chow , Dirk De Bruyker , Michel Rosa
IPC分类号： B01L3/00 , G01N33/00
CPC分类号： G01N35/1074 , B01J2219/00387 , B01L3/0244 , B01L3/0255 , B01L3/502715 , B01L2300/0819 , B01L2400/025 , B01L2400/0406 , B41J2/14314 , B41J2/16 , B41J2/1628 , B41J2/1629 , B41J2/1631 , B41J2/1632 , B41J2/1639 , B41J2/1643 , C40B60/14 , G01N35/1009 , G01N2035/00237 , G01N2035/1037 , G03F7/0002 , Y10T436/2575
摘要： Fluidic conduits, which can be used in microarraying systems, dip pen nanolithography systems, fluidic circuits, and microfluidic systems, are disclosed that use channel spring probes that include at least one capillary channel. Formed from spring beams (e.g., stressy metal beams) that curve away from the substrate when released, channels can either be integrated into the spring beams or formed on the spring beams. Capillary forces produced by the narrow channels allow liquid to be gathered, held, and dispensed by the channel spring probes. Because the channel spring beams can be produced using conventional semiconductor processes, significant design flexibility and cost efficiencies can be achieved.
摘要翻译：公开了可用于微阵列系统，浸笔纳米光刻系统，流体回路和微流体系统的流体导管，其使用包括至少一个毛细通道的通道弹簧探针。由释放时从基板弯曲的弹簧梁（例如，应力金属梁）形成，通道可以集成到弹簧梁中或形成在弹簧梁上。由窄通道产生的毛细管力允许液体被通道弹簧探针收集，保持和分配。由于可以使用传统的半导体工艺制造通道弹簧梁，所以可以实现显着的设计灵活性和成本效率。

7. 发明申请

US20070139899A1 Chip on a board 有权
标题翻译：芯片在板上
公开(公告)号：US20070139899A1
公开(公告)日：2007-06-21
申请号：US11314827
申请日：2005-12-21
申请人： Koenraad Van Schuylenbergh , Eric Peeters , David Fork , Thomas Hantschel
发明人： Koenraad Van Schuylenbergh , Eric Peeters , David Fork , Thomas Hantschel
IPC分类号： H05K7/00
CPC分类号： H01L23/36 , H01L23/22 , H01L23/295 , H01L23/315 , H01L23/3185 , H01L23/32 , H01L23/3675 , H01L23/4006 , H01L23/42 , H01L23/49833 , H01L23/552 , H01L23/562 , H01L24/13 , H01L24/16 , H01L24/32 , H01L24/72 , H01L24/81 , H01L2023/4043 , H01L2224/10135 , H01L2224/13109 , H01L2224/16 , H01L2224/17517 , H01L2224/29109 , H01L2224/2919 , H01L2224/73203 , H01L2224/73251 , H01L2224/73253 , H01L2224/81136 , H01L2224/81139 , H01L2224/81192 , H01L2224/8121 , H01L2224/81815 , H01L2224/81901 , H01L2224/83951 , H01L2924/01013 , H01L2924/01018 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/01049 , H01L2924/0105 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/09701 , H01L2924/10253 , H01L2924/14 , H01L2924/15153 , H01L2924/15165 , H01L2924/1517 , H01L2924/157 , H01L2924/15787 , H01L2924/15788 , H01L2924/1579 , H01L2924/16152 , H01L2924/16195 , H01L2924/19043 , H01L2924/3025 , Y10T29/49147 , H01L2924/0132 , H01L2924/00014 , H01L2924/00 , H01L2924/00012 , H01L2224/72
摘要： An integrated circuit (IC) die/substrate assembly includes an IC die and a substrate that are electrically coupled through an interconnect formed on the IC die. The IC die/substrate assembly further includes at least one coupling that facilitates maintaining an IC die/substrate gap definition between the IC die and the substrate.
摘要翻译：集成电路（IC）管芯/衬底组件包括通过形成在IC管芯上的互连电耦合的IC管芯和衬底。 IC芯片/基板组件还包括至少一个耦合，其有助于保持IC管芯和衬底之间的IC管芯/衬底间隙限定。

8. 发明申请

US20070126536A1 Electromechanical switch 失效
标题翻译：机电开关
公开(公告)号：US20070126536A1
公开(公告)日：2007-06-07
申请号：US11292421
申请日：2005-12-02
申请人： David Fork , Thomas Hantschel , Koenraad Van Schuylenbergh , Jeng Lu
发明人： David Fork , Thomas Hantschel , Koenraad Van Schuylenbergh , Jeng Lu
IPC分类号： H01H51/22
CPC分类号： H01H59/0009 , H01H2059/0081
摘要： In one aspect, an electromechanical switching device is illustrated. The electromechanical switching device includes a relay with at least one first conductive portion, at least one second conductive portion, and at least one actuation component that moves the at least one first conductive portion and the at least one second conductive portion into and out of conductive contact. The at least one first conductive portion includes a conductive stationary end coupled to a substrate and a conductive free-floating end. The at least one actuation component includes an actuation stationary end coupled to the substrate and an actuation free-floating end. The actuation free floating end, when the at least one actuation component is not energized, curls, which curls the conductive free floating end into or out of conductive contact with the at least one second conductive portion.
摘要翻译：在一个方面，示出了机电开关装置。机电开关装置包括具有至少一个第一导电部分，至少一个第二导电部分和至少一个致动部件的继电器，所述至少一个致动部件将至少一个第一导电部分和至少一个第二导电部分移入和移出导电部分联系。所述至少一个第一导电部分包括耦合到衬底的导电固定端和导电自由浮动端。所述至少一个致动部件包括联接到所述基板的致动固定端和致动自由浮动端。当所述至少一个致动部件未通电时，所述致动自由浮动端部卷曲，所述自由浮动端部将所述导电自由浮动端部与所述至少一个第二导电部分导电接触或者脱离所述至少一个第二导电部分的导电接触。

9. 发明申请

US20070202310A1 Out-of plane spring structures on a substrate 有权
标题翻译：基片上的平面外弹簧结构
公开(公告)号：US20070202310A1
公开(公告)日：2007-08-30
申请号：US11364111
申请日：2006-02-27
申请人： Christopher Chua , Thomas Hantschel , David Fork , Koenraad Van Schuylenbergh , Yan Yang
发明人： Christopher Chua , Thomas Hantschel , David Fork , Koenraad Van Schuylenbergh , Yan Yang
IPC分类号： B32B7/02
CPC分类号： C23C30/00 , B81B2203/0118 , B81B2203/019 , B81C1/00007 , B81C1/0019 , C23C28/00 , C23C28/021 , C23C28/023 , C25D1/003 , C25D1/20 , C25D5/022 , C25D5/10 , C25D5/50 , H01F17/0006 , H01L27/08 , Y10T428/24942
摘要： A structure has at least one structure component formed of a first material residing on a substrate, such that the structure is out of a plane of the substrate. A first coating of a second material then coats the structure. A second coating of a non-oxidizing material coats the structure at a thickness less than a thickness of the second material.
摘要翻译：结构具有由驻留在基板上的第一材料形成的至少一个结构部件，使得该结构在基板的平面之外。然后第二材料的第一涂层然后涂覆该结构。非氧化材料的第二涂层以小于第二材料厚度的厚度涂覆结构。

10. 发明申请

US20050270135A1 Method of making photolithographically-patterned out-of-plane coil structures 有权
标题翻译：制造光刻图案的平面外线圈结构的方法
公开(公告)号：US20050270135A1
公开(公告)日：2005-12-08
申请号：US11197675
申请日：2005-08-04
申请人： Christopher Chua , Francesco Lemmi , Koenraad Van Schuylenbergh , Jeng Lu , David Fork , Eric Peeters , Decai Sun , Donald Smith , Linda Romano
发明人： Christopher Chua , Francesco Lemmi , Koenraad Van Schuylenbergh , Jeng Lu , David Fork , Eric Peeters , Decai Sun , Donald Smith , Linda Romano
IPC分类号： H01F41/04 , G01R1/067 , G01R3/00 , G03C5/00 , H01F17/00 , H01F17/02 , H01F27/29 , H01L21/02 , H01L21/60 , H01L21/768 , H01L23/485 , H01L23/49 , H01L23/498 , H01L23/522 , H01R9/03 , H05K7/02
CPC分类号： H01L24/13 , G01R1/06727 , G01R3/00 , H01F17/0033 , H01F17/02 , H01F41/041 , H01L21/76838 , H01L21/7688 , H01L23/498 , H01L23/49811 , H01L23/5227 , H01L24/11 , H01L24/16 , H01L24/48 , H01L28/10 , H01L2224/05568 , H01L2224/05573 , H01L2224/05624 , H01L2224/13099 , H01L2224/4847 , H01L2224/8592 , H01L2924/0001 , H01L2924/00014 , H01L2924/00015 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01018 , H01L2924/01019 , H01L2924/01022 , H01L2924/01023 , H01L2924/01024 , H01L2924/01027 , H01L2924/01033 , H01L2924/01039 , H01L2924/0104 , H01L2924/01042 , H01L2924/01047 , H01L2924/01057 , H01L2924/01058 , H01L2924/01061 , H01L2924/01068 , H01L2924/01072 , H01L2924/01074 , H01L2924/01075 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01084 , H01L2924/014 , H01L2924/10253 , H01L2924/10329 , H01L2924/12034 , H01L2924/14 , H01L2924/181 , H01L2924/19041 , H01L2924/19042 , H01L2924/19043 , H01L2924/30105 , H01L2924/30107 , H01L2924/3011 , Y10T29/4902 , Y10T29/49071 , Y10T29/49147 , Y10T29/49204 , Y10T29/49208 , Y10T29/4921 , Y10T29/49218 , H01L2924/00 , H01L2224/05599 , H01L2224/85399 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： An out-of-plane micro-structure which can be used for on-chip integration of high-Q inductors and transformers places the magnetic field direction parallel to the substrate plane without requiring high aspect ratio processing. The photolithographically patterned coil structure includes an elastic member having an intrinsic stress profile. The intrinsic stress profile biases a free portion away from the substrate forming a loop winding. An anchor portion remains fixed to the substrate. The free portion end becomes a second anchor portion which may be connected to the substrate via soldering or plating. A series of individual coil structures can be joined via their anchor portions to form inductors and transformers.
摘要翻译：可以用于高Q电感和变压器的片上集成的平面外微结构使得磁场方向平行于衬底平面而不需要高纵横比处理。光刻图案的线圈结构包括具有固有应力分布的弹性构件。固有的应力分布使形成环绕的基板远离基板偏移。锚固部分保持固定到基底上。自由部分端部成为可以通过焊接或电镀而连接到基板的第二锚固部分。一系列单独的线圈结构可以通过它们的锚定部分接合以形成电感器和变压器。

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