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1. 发明申请

US20050006829A1 High force metal plated spring structure 有权
标题翻译：高强度金属电镀弹簧结构
公开(公告)号：US20050006829A1
公开(公告)日：2005-01-13
申请号：US10615653
申请日：2003-07-08
申请人： Eugene Chow , David Fork , Thomas Hantschel , Koenraad Van Schuylenbergh , Christopher Chua
发明人： Eugene Chow , David Fork , Thomas Hantschel , Koenraad Van Schuylenbergh , Christopher Chua
IPC分类号： F16F1/02 , H01L27/148 , F16F1/00 , F16F9/00 , H01L29/768
CPC分类号： F16F1/027
摘要： Lithographically defined and etched spring structures are produced by various methods such that they avoid the formation of a plated metal wedge on an underside of the spring structure after release. A post is utilized to offset the spring from an underlying substrate by a distance greater than the thickness of the plated metal. A trench is etched into the substrate below the spring to provide clearance during deflection of the spring. Another spring includes a knee (bend) that provides the necessary clearance during deflection. A plating process is limited to the upper side of another spring. A released spring is used as a shadow mask for patterning resist that prevents wedge formation during plating. Various tip arrangements are disclosed that can be utilized with each spring structure
摘要翻译：通过各种方法制造光刻定义和蚀刻的弹簧结构，使得它们在释放之后避免在弹簧结构的下侧上形成电镀金属楔。使用柱子将弹簧从下面的衬底偏移大于电镀金属的厚度的距离。在弹簧下方的衬底中蚀刻沟槽，以在弹簧偏转期间提供间隙。另一个弹簧包括在偏转期间提供必要的间隙的膝盖（弯头）。电镀工艺限于另一弹簧的上侧。释放的弹簧用作用于图案化抗蚀剂的荫罩，其防止电镀期间的楔形成。公开了可以与每个弹簧结构一起使用的各种尖端装置

2. 发明申请

US20070139150A1 Vapor induced self-assembly and electrode sealing 审中-公开
标题翻译：蒸汽引发自组装和电极密封
公开(公告)号：US20070139150A1
公开(公告)日：2007-06-21
申请号：US11300860
申请日：2005-12-15
申请人： Eugene Chow , Christopher Chua , Koenraad Van Schuylenbergh
发明人： Eugene Chow , Christopher Chua , Koenraad Van Schuylenbergh
IPC分类号： H01F5/00
CPC分类号： H05K3/4092 , H01F17/0006 , H01F17/0033 , H01F17/02 , H01F41/041 , H01F2027/2814 , H05K3/243 , H05K2201/0166 , H05K2201/0317 , H05K2201/0397 , H05K2203/0597 , H05K2203/0783
摘要： A method of reflowing a polymer to form a spring or coil structure is described. A polymer is deposited over stress engineered thin film with an internal stress gradient. The polymer serves as a loading prevent release of the internal stress until a solvent vapor softens and reflows the polymer. As the polymer softens, the internal stress within the thin film is gradually released allowing controlled curling of the thin film out of a substrate plane. In one embodiment, the thin film forms the windings of a coil structure.
摘要翻译：描述了一种回流聚合物以形成弹簧或线圈结构的方法。聚合物沉积在具有内应力梯度的应力工程薄膜上。聚合物用作负载，防止释放内部应力，直到溶剂蒸气软化和回流聚合物。当聚合物软化时，薄膜内的内部应力逐渐释放，从而允许薄膜从基板平面受到控制的卷曲。在一个实施例中，薄膜形成线圈结构的绕组。

3. 发明申请

US20050136703A1 Flexible cable interconnect assembly 有权
公开(公告)号：US20050136703A1
公开(公告)日：2005-06-23
申请号：US10742501
申请日：2003-12-19
申请人： Koenraad Van Schuylenbergh , Armin Volkel , Thomas DiStefano , Michel Rosa , David Fork , Eugene Chow , Meng Lean
发明人： Koenraad Van Schuylenbergh , Armin Volkel , Thomas DiStefano , Michel Rosa , David Fork , Eugene Chow , Meng Lean
IPC分类号： H05K1/14 , H01B11/00 , H01R12/00 , H01R12/04 , H05K3/32 , H05K3/36
CPC分类号： H01R12/78 , H05K1/147 , H05K3/323 , H05K3/361 , H05K3/365 , H05K2201/044 , H05K2201/09845
摘要： A data transmission interconnect assembly (e.g., a router) capable of transmission speeds in excess of 40 Gbps in which a line-card is detachably coupled to a backplane using flexible flat cables that are bent to provide a continuous, smooth curve between the connected boards, and connected by a connection apparatus that employs cable-to-cable interface members that are transparent to the transmitted signal waves. Microspring contact structures are formed on the cables, or on a contact structure pressed against the cables, to provide interface arrangements that are smaller than a wavelength of the transmitted signal. A connector apparatus uses a cam mechanism to align the cables, and then to press a contact structure, having micro spring interface members formed thereon, against the cables. An alterative contact structure uses anisotropic conductive film.

4. 发明申请

US20060057031A1 Capillary-channel probes for liquid pickup, transportation and dispense using stressy metal 有权
标题翻译：用于采用压力金属的液体拾取，运输和分配的毛细管通道探头
公开(公告)号：US20060057031A1
公开(公告)日：2006-03-16
申请号：US11267762
申请日：2005-11-03
申请人： Thomas Hantschel , David Fork , Eugene Chow , Dirk De Bruyker , Michel Rosa
发明人： Thomas Hantschel , David Fork , Eugene Chow , Dirk De Bruyker , Michel Rosa
IPC分类号： B01L3/00 , G01N33/00
CPC分类号： G01N35/1074 , B01J2219/00387 , B01L3/0244 , B01L3/0255 , B01L3/502715 , B01L2300/0819 , B01L2400/025 , B01L2400/0406 , B41J2/14314 , B41J2/16 , B41J2/1628 , B41J2/1629 , B41J2/1631 , B41J2/1632 , B41J2/1639 , B41J2/1643 , C40B60/14 , G01N35/1009 , G01N2035/00237 , G01N2035/1037 , G03F7/0002 , Y10T436/2575
摘要： Fluidic conduits, which can be used in microarraying systems, dip pen nanolithography systems, fluidic circuits, and microfluidic systems, are disclosed that use channel spring probes that include at least one capillary channel. Formed from spring beams (e.g., stressy metal beams) that curve away from the substrate when released, channels can either be integrated into the spring beams or formed on the spring beams. Capillary forces produced by the narrow channels allow liquid to be gathered, held, and dispensed by the channel spring probes. Because the channel spring beams can be produced using conventional semiconductor processes, significant design flexibility and cost efficiencies can be achieved.
摘要翻译：公开了可用于微阵列系统，浸笔纳米光刻系统，流体回路和微流体系统的流体导管，其使用包括至少一个毛细通道的通道弹簧探针。由释放时从基板弯曲的弹簧梁（例如，应力金属梁）形成，通道可以集成到弹簧梁中或形成在弹簧梁上。由窄通道产生的毛细管力允许液体被通道弹簧探针收集，保持和分配。由于可以使用传统的半导体工艺制造通道弹簧梁，所以可以实现显着的设计灵活性和成本效率。

5. 发明申请

US20060076693A1 Self-releasing spring structures and methods 有权
标题翻译：自释弹簧结构及方法
公开(公告)号：US20060076693A1
公开(公告)日：2006-04-13
申请号：US10959180
申请日：2004-10-07
申请人： Thomas Hantschel , Sven Kosgalwies , David Fork , Eugene Chow
发明人： Thomas Hantschel , Sven Kosgalwies , David Fork , Eugene Chow
IPC分类号： H01L23/52
CPC分类号： G01R1/06716 , G01R3/00 , Y10T29/49609
摘要： According to various exemplary embodiments, a spring device that includes a substrate, a self-releasing layer provided over the substrate and a stressed-metal layer provided over the self-releasing layer is disclosed, wherein an amount of stress inside the stressed-metal layer results in a peeling force that is higher than an adhesion force between the self-releasing layer and the stressed-metal layer. Moreover, a method of manufacturing a spring device, according to various exemplary embodiments, includes providing a substrate, providing a self-releasing layer over the substrate and providing a stressed-metal layer over the self-releasing layer wherein an amount of stress inside the stressed-metal layer results in a peeling force that is higher than an adhesion force between the self-releasing layer and the stressed-metal layer is also disclosed in this invention.
摘要翻译：根据各种示例性实施例，公开了一种弹簧装置，其包括基板，设置在基板上的自放电层和设置在自放电层上的应力金属层，其中应力金属层内部的应力量导致剥离力高于自释放层和应力金属层之间的粘附力。此外，根据各种示例性实施例的制造弹簧装置的方法包括提供衬底，在衬底上提供自释放层，并在自释放层上方提供应力金属层，其中，在本发明中也公开了应力金属层导致比自发层和应力金属层之间的粘附力高的剥离力。

6. 发明申请

US20070148895A1 Integrateable capacitors and microcoils and methods of making thereof 有权
标题翻译：可集成电容器和微型线圈及其制造方法
公开(公告)号：US20070148895A1
公开(公告)日：2007-06-28
申请号：US11319075
申请日：2005-12-28
申请人： Koenraad Van Schuylenbergh , Eugene Chow , JengPing Lu
发明人： Koenraad Van Schuylenbergh , Eugene Chow , JengPing Lu
IPC分类号： H01L21/00
CPC分类号： H01G5/18 , H01F17/0006 , H01F17/02 , H01F21/04 , H01F27/40 , H01F41/041 , H01L28/10 , H01L28/40
摘要： Methods for integrally forming high Q tunable capacitors and high Q inductors on a substrate are described. A method for integrally forming a capacitor and a microcoil on a substrate may involve depositing and patterning a dielectric layer on the substrate, depositing and patterning a sacrificial layer on the substrate, depositing and patterning conductive material on the semiconductor substrate, depositing and patterning a polymer layer on the semiconductor substrate, removing an exposed portion of the conductive material exposed by the patterned polymer layer to release a portion of the conductive pattern from the semiconductor substrate to form out-of-plane windings of the microcoil, depositing second conductive material on exposed portions of the conductive material, and removing the sacrificial layer. The patterned conductive material may include a windings portion of the microcoil, an overlapping electrode portion of the capacitor and a support portion for the electrode of the capacitor.
摘要翻译：描述了在衬底上整体形成高Q可调谐电容器和高Q电感器的方法。用于在基板上一体地形成电容器和微线圈的方法可以包括在基板上沉积和图案化电介质层，在衬底上沉积和图案化牺牲层，在半导体衬底上沉积和图案化导电材料，沉积和图案化聚合物去除由所述图案化聚合物层暴露的所述导电材料的暴露部分，以从所述半导体衬底释放所述导电图案的一部分，以形成所述微线圈的面外绕组，将第二导电材料沉积在暴露的部分导电材料，并去除牺牲层。图案化导电材料可以包括微线圈的绕组部分，电容器的重叠电极部分和用于电容器电极的支撑部分。

7. 发明申请

US20060087335A1 Curved spring structure with elongated section located under cantilevered section 有权
标题翻译：弯曲弹簧结构，细长部分位于悬臂部分下方
公开(公告)号：US20060087335A1
公开(公告)日：2006-04-27
申请号：US10971467
申请日：2004-10-21
申请人： Thomas Hantschel , Eugene Chow
发明人： Thomas Hantschel , Eugene Chow
IPC分类号： G01R31/02
CPC分类号： H01G5/18 , G01R1/06738
摘要： A curved spring structure includes a base section extending parallel to the substrate surface, a curved cantilever section bent away from the substrate surface, and an elongated section extending from the base section along the substrate surface under the cantilevered section. The spring structure includes a spring finger formed from a self-bending material film (e.g., stress-engineered metal, bimorph/bimetallic) that is patterned and released. A cladding layer is then electroplated and/or electroless plated onto the spring finger for strength. The elongated section is formed from plating material deposited simultaneously with cladding layers. To promote the formation of the elongated section, a cementation layer is provided under the spring finger to facilitate electroplating, or the substrate surface is pre-treated to facilitate electroless plating.
摘要翻译：弯曲弹簧结构包括平行于基板表面延伸的基部部分，弯曲的远离基板表面的弯曲悬臂部分，以及从基部沿着悬臂部分下方的基板表面延伸的细长部分。弹簧结构包括由图案化和释放的自弯曲材料膜（例如，应力工程金属，双晶型/双金属）形成的弹簧指状物。然后将包覆层电镀和/或无电镀在弹簧手指上用于强度。细长部分由与包覆层同时沉积的电镀材料形成。为了促进细长部分的形成，在弹簧指状物下方设置有胶结层以促进电镀，或者基板表面被预处理以便于化学镀。

8. 发明申请

US20060105122A1 Micro-machined structure production using encapsulation 失效
公开(公告)号：US20060105122A1
公开(公告)日：2006-05-18
申请号：US10986712
申请日：2004-11-12
申请人： Thomas Hantschel , Sven Kosgalwies , Eugene Chow , Gordon Jagerson
发明人： Thomas Hantschel , Sven Kosgalwies , Eugene Chow , Gordon Jagerson
IPC分类号： B31B45/00
CPC分类号： B81C1/00666 , G01R1/06755 , G01R1/07357 , H01L2924/00013 , H01L2924/01006 , H01L2924/01015 , H01L2924/01022 , H01L2924/01024 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/0104 , H01L2924/01042 , H01L2924/01045 , H01L2924/01046 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01327 , H01L2924/14 , H01L2924/19041 , H01L2924/19042 , H05K3/4092 , Y10T29/49146 , Y10T29/49147 , Y10T29/49204 , Y10T428/13 , Y10T428/1317 , Y10T428/24174 , H01L2224/13099 , H01L2224/13599 , H01L2224/05599 , H01L2224/05099 , H01L2224/29099 , H01L2224/29599
摘要： Micro-machined (e.g., stress-engineered spring) structures are produced by forming a release layer, forming a partially or fully encapsulated beam/spring structure, and then releasing the beam/spring structure by etching the release layer. The encapsulation structure protects the beam/spring during release, so both the release layer and the beam/spring can be formed using plating and/or using the same material. The encapsulation structure can be metal, resist, polymer, oxide, or nitride, and may be removed after the release process, or retained as part of the completed micro-machined structure.

9. 发明申请

US20070125486A1 Vertically spaced plural microsprings 有权
标题翻译：垂直间隔的多个微弹簧
公开(公告)号：US20070125486A1
公开(公告)日：2007-06-07
申请号：US11292474
申请日：2005-12-02
申请人： Thomas Hantschel , Eugene Chow
发明人： Thomas Hantschel , Eugene Chow
IPC分类号： B32B37/00
CPC分类号： B81B3/001 , B81B2207/07 , B81C1/00666 , B81C1/00952 , G01R1/06722 , G01R1/06727 , G01R1/06744 , G01R3/00 , H05K3/4092
摘要： A plurality of vertically spaced-apart microsprings are provided to increase microspring contact force, contact area, contact reliability, and contact yield. The microspring material is deposited, either as a single layer or as a composite of multiple sub layers, to have a tailored stress differential along its cross-section. A lower microspring may be made to push up against an upper microspring to provide increased contact force, or push down against a substrate to ensure release during manufacture. The microsprings may be provided with similar stress differentials or opposite stress differentials to obtain desired microspring profiles and functionality. Microsprings may also be physically connected at their distal ends for increased contact force. The microsprings may be formed of electrically conductive material or coated with electrically conductive material for probe card and similar applications.
摘要翻译：提供多个垂直间隔开的微弹簧以增加微弹簧接触力，接触面积，接触可靠性和接触屈服。微珠材料作为单层或作为多个子层的复合材料沉积，沿其横截面具有定制的应力差。可以制备较低的微弹簧以向上推动上部微型弹性体以提供增加的接触力，或者向下推动抵靠基底以确保制造过程中的释放。可以提供类似的应力差异或相反的应力差异以获得所需的微弹体轮廓和功能性。微弹簧也可以在其远端物理连接以增加接触力。微弹簧可以由导电材料形成或涂覆有用于探针卡和类似应用的导电材料。

10. 发明申请

US20070069751A1 Curved spring structure with elongated section located under cantilevered section 有权
标题翻译：弯曲弹簧结构，细长部分位于悬臂部分下方
公开(公告)号：US20070069751A1
公开(公告)日：2007-03-29
申请号：US11549066
申请日：2006-10-12
申请人： Thomas Hantschel , Eugene Chow
发明人： Thomas Hantschel , Eugene Chow
IPC分类号： G01R31/02
CPC分类号： H01G5/18 , G01R1/06738
摘要： A curved spring structure includes a base section extending parallel to the substrate surface, a curved cantilever section bent away from the substrate surface, and an elongated section extending from the base section along the substrate surface under the cantilevered section. The spring structure includes a spring finger formed from a self-bending material film (e.g., stress-engineered metal, bimorph/bimetallic) that is patterned and released. A cladding layer is then electroplated and/or electroless plated onto the spring finger for strength. The elongated section is formed from plating material deposited simultaneously with cladding layers. To promote the formation of the elongated section, a cementation layer is provided under the spring finger to facilitate electroplating, or the substrate surface is pre-treated to facilitate electroless plating.
摘要翻译：弯曲弹簧结构包括平行于基板表面延伸的基部部分，弯曲的远离基板表面的弯曲悬臂部分，以及从基部沿着悬臂部分下方的基板表面延伸的细长部分。弹簧结构包括由图案化和释放的自弯曲材料膜（例如，应力工程金属，双晶型/双金属）形成的弹簧指状物。然后将包覆层电镀和/或无电镀在弹簧手指上用于强度。细长部分由与包覆层同时沉积的电镀材料形成。为了促进细长部分的形成，在弹簧指状物下方设置有胶结层以促进电镀，或者基板表面被预处理以便于化学镀。

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