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1. 发明授权

US5608559A Display board having wiring with three-layered structure and a display device including the display board 失效
标题翻译：具有三层结构的显示板和包括显示板的显示装置
公开(公告)号：US5608559A
公开(公告)日：1997-03-04
申请号：US350406
申请日：1994-12-06
申请人： Kiyoshi Inada , Motoji Shiota , Hirokazu Yoshida , Yasunobu Tagusa
发明人： Kiyoshi Inada , Motoji Shiota , Hirokazu Yoshida , Yasunobu Tagusa
IPC分类号： G02F1/13 , H01L23/498 , H05K1/09 , H05K3/36 , G02F1/1343
CPC分类号： G02F1/13452 , H01L23/49866 , H01L2224/73204 , H05K1/09 , H05K3/361
摘要： A display board has wirings on a surface thereof for transmitting a signal received from outside at a peripheral portion of the display board to a display area of the display board. Each wiring has a first conductive film formed of a first material and disposed on the surface of the display board, a second conductive film which is formed of a second material satisfying a condition that a surface of the second conductive film is less prone to oxidation than a surface of the first conductive film and which is disposed on a part of the first conductive film, and a transparent conductive film which is an oxide film and which is disposed on at least the second conductive film. Those first conductive film, second conductive film and transparent film constitute a three-layered structure portion of the wiring.
摘要翻译：显示板在其表面上具有布线，用于将从显示板的周边部分的外部接收的信号发送到显示板的显示区域。每个布线具有由第一材料形成并设置在显示板的表面上的第一导电膜，第二导电膜由第二材料形成，第二导电膜满足第二导电膜的表面不易氧化的条件，所述第一导电膜的表面设置在所述第一导电膜的一部分上，以及透明导电膜，所述透明导电膜为氧化膜，并且设置在至少所述第二导电膜上。第一导电膜，第二导电膜和透明膜构成布线的三层结构部分。

2. 发明授权

US6111628A Liquid crystal display device including plural bump electrodes 失效
标题翻译：液晶显示装置包括多个凸起电极
公开(公告)号：US6111628A
公开(公告)日：2000-08-29
申请号：US035063
申请日：1998-03-05
申请人： Motoji Shiota , Kiyoshi Inada , Hirokazu Yoshida
发明人： Motoji Shiota , Kiyoshi Inada , Hirokazu Yoshida
IPC分类号： G02F1/1345 , G02F1/13 , H01L21/60 , H05K1/11 , H05K3/32
CPC分类号： H01L24/83 , G02F1/13452 , H01L24/12 , H01L24/16 , H01L24/28 , H01L24/81 , H05K3/323 , H01L2224/13099 , H01L2224/16225 , H01L2224/2919 , H01L2224/32225 , H01L2224/73204 , H01L2224/81801 , H01L2224/8319 , H01L2224/838 , H01L2224/83851 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01033 , H01L2924/01078 , H01L2924/01079 , H01L2924/014 , H01L2924/0665 , H01L2924/07802 , H01L2924/0781 , H01L2924/07811 , H01L2924/12042 , H01L2924/14 , H05K1/111 , H05K2201/0367 , H05K2201/09709 , H05K2201/10674
摘要： A liquid crystal display device according to the present invention includes a substrate provided with a line pattern, and a circuit element electrically connected to the line pattern via a conductive layer. The line pattern has at least one bonding pad. The circuit element has at least one electrode pad. The at least one electrode pad has a plurality of bump electrodes provided thereon. The at least one electrode pad is electrically connected to the at least one bonding pad via the conductive layer which is provided between the plurality of bump electrodes and the bonding pad facing the plurality of bump electrodes, where the conductive layer is an insulative material having conductive particles dispersed throughout.
摘要翻译：根据本发明的液晶显示装置包括具有线图案的基板和经由导电层电连接到线图案的电路元件。线图案具有至少一个接合垫。电路元件具有至少一个电极焊盘。所述至少一个电极焊盘具有设置在其上的多个凸起电极。所述至少一个电极焊盘经由所述导电层电连接到所述至少一个焊盘，所述导电层设置在所述多个凸起电极和所述焊盘之间，所述焊盘面对所述多个凸块电极，其中所述导电层是具有导电性的绝缘材料颗粒分散在整个

3. 发明申请

US20120133876A1 LIQUID CRYSTAL PANEL 审中-公开
标题翻译：液晶面板
公开(公告)号：US20120133876A1
公开(公告)日：2012-05-31
申请号：US13262216
申请日：2010-01-15
申请人： Hiroki Nakahama , Keigo Aoki , Gen Nagaoka , Kiyoshi Inada , Motoji Shiota
发明人： Hiroki Nakahama , Keigo Aoki , Gen Nagaoka , Kiyoshi Inada , Motoji Shiota
IPC分类号： G02F1/1343
CPC分类号： G02F1/133528
摘要： A region for mounting components such as an IC chip is sufficiently ensured on a glass substrate with which a liquid crystal panel is configured, without reducing the number of panel pieces to be taken from a large panel. A liquid crystal panel is composed of a first glass substrate (10) and a second glass substrate (20) which face each other with a liquid crystal therebetween. The first glass substrate (10) and the second glass substrate (20) are formed in substantially the same size in plan view and bonded together in a state in which these substrates are shifted from each other by a predetermined distance in the direction of the longer side or in the direction of the shorter side. Regions to become a frame (frame regions) are provided on both the first glass substrate (10) and the second glass substrate (20), and pads (60) are provided on both of these frame regions.
摘要翻译：在配置有液晶面板的玻璃基板上充分确保了用于安装诸如IC芯片的部件的区域，而不会减少从大面板取出的面板件的数量。液晶面板由第一玻璃基板（10）和第二玻璃基板（20）构成，第一玻璃基板（10）和第二玻璃基板（20）之间具有液晶。第一玻璃基板（10）和第二玻璃基板（20）在平面图中形成为大致相同的尺寸，并且在这些基板沿较长的方向彼此偏移预定距离的状态下接合在一起侧或在短边方向。在第一玻璃基板（10）和第二玻璃基板（20）两者上设置成为框架（框架区域）的区域，并且在这两个框架区域上设置焊盘（60）。

4. 发明授权

US06169593A Reflection-type liquid crystal display device, method for producing the same, and method for producing circuit board 有权
标题翻译：反射式液晶显示装置及其制造方法以及电路基板的制造方法
公开(公告)号：US06169593A
公开(公告)日：2001-01-02
申请号：US09209492
申请日：1998-12-11
申请人： Takayuki Kanaya , Motoji Shiota , Toshiaki Fujihara , Kiyoshi Inada
发明人： Takayuki Kanaya , Motoji Shiota , Toshiaki Fujihara , Kiyoshi Inada
IPC分类号： G02F113
CPC分类号： G02F1/13458 , G02F1/133553 , G02F1/1345
摘要： A method for producing a reflection-type liquid crystal display device includes the steps of forming an ITO layer in the first substrate; patterning the ITO layer to form the top layer in the at least one of the terminal sections; forming a first protective layer so as to cover the top layer; forming a metal layer mainly formed of aluminum so as to cover the first protective layer; and at least partially removing the metal layer and the first protective layer to form a reflective section from the metal layer and expose only the flat area of the top surface of the top layer in the at least one of the terminal sections. Before the step of forming the first protective layer, only the flat area of the top surface of the layer is exposed in at least one of the terminal sections so as to allow the first protective layer to contact the top layer along only the flat area.
摘要翻译：一种反射型液晶显示装置的制造方法，其特征在于，包括：在所述第一基板中形成ITO层的工序; 图案化ITO层以在所述至少一个端子部分中形成顶层; 形成第一保护层以覆盖顶层; 形成主要由铝形成的金属层以覆盖第一保护层; 并且至少部分地去除所述金属层和所述第一保护层，以从所述金属层形成反射部分，并且仅露出所述至少一个所述端子部分中的顶层顶表面的平坦区域。在形成第一保护层的步骤之前，只有层的顶表面的平坦区域暴露在至少一个端子部分中，以便允许第一保护层沿着平坦区域接触顶层。

5. 发明授权

US06885426B2 Liquid crystal display device and the manufacturing method thereof with an anisotropic conductive adhesive 有权
标题翻译：液晶显示装置及其各向异性导电粘合剂的制造方法
公开(公告)号：US06885426B2
公开(公告)日：2005-04-26
申请号：US10376335
申请日：2003-03-03
申请人： Takashi Matsui , Motoji Shiota , Kiyoshi Inada
发明人： Takashi Matsui , Motoji Shiota , Kiyoshi Inada
IPC分类号： G02F1/1345 , G02F1/13 , H01L21/60 , H05K3/32
CPC分类号： H01L24/83 , G02F1/13452 , H01L24/29 , H01L2224/16225 , H01L2224/2919 , H01L2224/32225 , H01L2224/73204 , H01L2224/83192 , H01L2224/838 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01019 , H01L2924/01027 , H01L2924/01033 , H01L2924/0105 , H01L2924/01068 , H01L2924/01078 , H01L2924/01079 , H01L2924/014 , H01L2924/0665 , H01L2924/07802 , H01L2924/0781 , H01L2924/07811 , H01L2924/14 , H01L2924/3011 , H01L2924/3025 , H01L2924/3511 , H05K3/323 , H01L2924/00
摘要： In the manufacturing step of performing thermal compression bonding with respect to a driving integrated circuit and a glass substrate included in a liquid crystal panel so as to connect an electrode of the driving integrated circuit and an electrode of the glass substrate by using an anisotropic conductive adhesive in which conductive particles are diffused in an insulative adhesive, the anisotropic conductive adhesive includes conductive particles, a resin a whose average molecular weight is in a range of from 10000 to 100000, a resin b whose average molecular weight is of not more than 1000, a stress relaxation resin, and a curing agent; and a Young's modulus of the anisotropic conductive adhesive after curing is in a range of from 1.4 Gpa to 1.6 Gpa.
摘要翻译：在对包括在液晶面板中的驱动集成电路和玻璃基板进行热压接的制造步骤中，通过使用各向异性导电粘合剂连接驱动集成电路的电极和玻璃基板的电极其中导电颗粒在绝缘粘合剂中扩散，各向异性导电粘合剂包括导电颗粒，平均分子量在10000至100000范围内的树脂a，平均分子量不大于1000的树脂b，应力松弛树脂和固化剂; 固化后各向异性导电粘合剂的杨氏模量在1.4Gpa至1.6Gpa的范围内。

6. 发明授权

US06933607B2 Semiconductor device with bumps on electrode pads oriented in given direction 有权
标题翻译：具有在给定方向上取向的电极焊盘上的凸起的半导体器件
公开(公告)号：US06933607B2
公开(公告)日：2005-08-23
申请号：US10282054
申请日：2002-10-29
申请人： Atsushi Ono , Yasunori Chikawa , Makoto Kanda , Norimitsu Nie , Satoru Tone , Motoji Shiota , Akio Inohara , Hirokazu Yoshida
发明人： Atsushi Ono , Yasunori Chikawa , Makoto Kanda , Norimitsu Nie , Satoru Tone , Motoji Shiota , Akio Inohara , Hirokazu Yoshida
IPC分类号： H01L21/60 , H01L23/485 , H01L23/48 , H01L23/52 , H01L29/40
CPC分类号： H01L24/10 , H01L24/13 , H01L2224/05001 , H01L2224/05022 , H01L2224/05572 , H01L2224/13 , H01L2224/13099 , H01L2224/1411 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01015 , H01L2924/01022 , H01L2924/01024 , H01L2924/01033 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01322 , H01L2924/014 , H01L2924/14 , H01L2924/15787 , H01L2924/351 , H01L2924/00 , H01L2224/05541 , H01L2224/05005
摘要： A semiconductor device includes a semiconductor substrate, a plurality of electrode pads aligned on the semiconductor substrate, and a plurality of bump electrodes placed on each electrode pad, wherein the plurality of bump electrodes on the electrode pad are aligned in a direction orthogonal to a direction where the electrode pads are aligned. A manufacturing method of the semiconductor device includes the steps of patterning a photoresist which serves as a bump electrode forming use mask on the semiconductor substrate having formed thereon the electrode pads and forming a bump electrode in a perpendicular straight wall shape to be thinner than the photoresist by plating the bump electrode forming use metal to the electrode pad.
摘要翻译：半导体器件包括半导体衬底，在半导体衬底上排列的多个电极焊盘和放置在每个电极焊盘上的多个凸起电极，其中电极焊盘上的多个凸起电极在与方向正交的方向上排列其中电极焊盘对齐。半导体器件的制造方法包括以下步骤：在其上形成有电极焊盘的半导体衬底上形成用作形成用途掩模的凸块电极的光致抗蚀剂，并且形成具有比光致抗蚀剂更薄的垂直直壁形状的凸块电极通过将形成使用金属的凸块电极电镀到电极焊盘。

7. 发明授权

US07005741B2 Liquid crystal display device and/or circuit substrate including bump electrodes and electrode pads 失效
标题翻译：液晶显示装置和/或包括凸起电极和电极垫的电路基板
公开(公告)号：US07005741B2
公开(公告)日：2006-02-28
申请号：US10283212
申请日：2002-10-30
申请人： Atsushi Ono , Yasunori Chikawa , Makoto Kanda , Norimitsu Nie , Satoru Tone , Motoji Shiota , Akio Inohara , Hirokazu Yoshida
发明人： Atsushi Ono , Yasunori Chikawa , Makoto Kanda , Norimitsu Nie , Satoru Tone , Motoji Shiota , Akio Inohara , Hirokazu Yoshida
IPC分类号： H01L23/48 , H01L23/52 , H01L29/40
CPC分类号： H01L24/10 , H01L24/13 , H01L2224/05001 , H01L2224/05022 , H01L2224/05572 , H01L2224/13 , H01L2224/13099 , H01L2224/1411 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01015 , H01L2924/01022 , H01L2924/01024 , H01L2924/01033 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01322 , H01L2924/014 , H01L2924/14 , H01L2924/15787 , H01L2924/351 , H01L2924/00 , H01L2224/05541 , H01L2224/05005
摘要： A semiconductor device includes a semiconductor substrate, a plurality of electrode pads aligned on the semiconductor substrate, and a plurality of bump electrodes placed on each electrode pad, wherein the plurality of bump electrodes on the electrode pad are aligned in a direction orthogonal to a direction where the electrode pads are aligned. A manufacturing method of the semiconductor device includes the steps of patterning a photoresist which serves as a bump electrode forming use mask on the semiconductor substrate having formed thereon the electrode pads and forming a bump electrode in a perpendicular straight wall shape to be thinner than the photoresist by plating the bump electrode forming use metal to the electrode pad.
摘要翻译：半导体器件包括半导体衬底，在半导体衬底上排列的多个电极焊盘和放置在每个电极焊盘上的多个凸起电极，其中电极焊盘上的多个凸起电极在与方向正交的方向上排列其中电极焊盘对齐。半导体器件的制造方法包括以下步骤：在其上形成有电极焊盘的半导体衬底上形成用作形成用途掩模的凸块电极的光致抗蚀剂，并且形成具有比光致抗蚀剂更薄的垂直直壁形状的凸块电极通过将形成使用金属的凸块电极电镀到电极焊盘。

8. 发明授权

US06525422B1 Semiconductor device including bump electrodes 失效
标题翻译：包括凸起电极的半导体器件
公开(公告)号：US06525422B1
公开(公告)日：2003-02-25
申请号：US08989328
申请日：1997-12-11
申请人： Atsushi Ono , Yasunori Chikawa , Makoto Kanda , Norimitsu Nie , Satoru Tone , Motoji Shiota , Akio Inohara , Hirokazu Yoshida
发明人： Atsushi Ono , Yasunori Chikawa , Makoto Kanda , Norimitsu Nie , Satoru Tone , Motoji Shiota , Akio Inohara , Hirokazu Yoshida
IPC分类号： H01L2348
CPC分类号： H01L24/10 , H01L24/13 , H01L2224/05001 , H01L2224/05022 , H01L2224/05572 , H01L2224/13 , H01L2224/13099 , H01L2224/1411 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01015 , H01L2924/01022 , H01L2924/01024 , H01L2924/01033 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01322 , H01L2924/014 , H01L2924/14 , H01L2924/15787 , H01L2924/351 , H01L2924/00 , H01L2224/05541 , H01L2224/05005
摘要： A semiconductor device includes a semiconductor substrate, a plurality of electrode pads aligned on the semiconductor substrate, and a plurality of bump electrodes placed on each electrode pad, wherein the plurality of bump electrodes on the electrode pad are aligned in a direction orthogonal to a direction where the electrode pads are aligned. A manufacturing method of the semiconductor device includes the steps of patterning a photoresist which serves as a bump electrode forming use mask on the semiconductor substrate having formed thereon the electrode pads and forming a bump electrode in a perpendicular straight wall shape to be thinner than the photoresist by plating the bump electrode forming use metal to the electrode pad.
摘要翻译：半导体器件包括半导体衬底，在半导体衬底上排列的多个电极焊盘和放置在每个电极焊盘上的多个凸起电极，其中电极焊盘上的多个凸起电极在与方向正交的方向上排列其中电极焊盘对齐。半导体器件的制造方法包括以下步骤：在其上形成有电极焊盘的半导体衬底上形成用作形成用途掩模的凸块电极的光致抗蚀剂，并且形成具有比光致抗蚀剂更薄的垂直直壁形状的凸块电极通过将形成使用金属的凸块电极电镀到电极焊盘。

9. 发明申请

US20130335940A1 ELECTRONIC CIRCUIT SUBSTRATE, DISPLAY DEVICE, AND WIRING SUBSTRATE 有权
标题翻译：电子电路基板，显示装置和布线基板
公开(公告)号：US20130335940A1
公开(公告)日：2013-12-19
申请号：US14002346
申请日：2012-03-01
申请人： Takashi Matsui , Motoji Shiota , Hiroki Nakahama
发明人： Takashi Matsui , Motoji Shiota , Hiroki Nakahama
IPC分类号： H05K1/18
CPC分类号： H05K1/18 , G02F1/13454 , H01L23/49811 , H01L23/49838 , H01L24/13 , H01L24/16 , H01L24/81 , H01L24/83 , H01L24/92 , H01L2224/10165 , H01L2224/13013 , H01L2224/13144 , H01L2224/14132 , H01L2224/14133 , H01L2224/16237 , H01L2224/2929 , H01L2224/293 , H01L2224/32225 , H01L2224/73204 , H01L2224/8114 , H01L2224/81191 , H01L2224/81385 , H01L2224/81903 , H01L2224/83851 , H01L2224/9211 , H01L2924/07802 , H01L2924/15788 , H01L2924/351 , H05K1/111 , H05K2201/09436 , H05K2201/09709 , H05K2201/09745 , H05K2201/09909 , H05K2201/10674 , Y02P70/611 , H01L2924/00014 , H01L2224/81 , H01L2224/83 , H01L2924/00
摘要： A wiring substrate (11) includes: a substrate; and, formed upon the substrate, a plurality of wiring lines, a plurality of circuit elements, and a plurality of connecting terminals (51) connected via the plurality of wiring lines. Each of the plurality of connecting terminals (51) includes a pair of protrusion parts (50), forming a depression part (60) between the pair of protrusion parts (50), and a depression electrode (52) that is disposed in the depression part (60) and that at least partially covers each protrusion of the pair of protrusion parts (50).
摘要翻译：布线基板（11）包括：基板; 并且在所述基板上形成有多条布线，多个电路元件以及经由所述多根布线连接的多个连接端子（51）。多个连接端子（51）中的每一个包括在一对突出部（50）之间形成有凹部（60）的一对突出部（50），设置在该凹部部分（60）并且至少部分地覆盖所述一对突出部分（50）中的每个突起。

10. 发明授权

US08450753B2 Board module and method of manufacturing same 有权
标题翻译：板模块及其制造方法
公开(公告)号：US08450753B2
公开(公告)日：2013-05-28
申请号：US13063983
申请日：2009-06-02
申请人： Motoji Shiota , Gen Nagaoka , Ichiro Umekawa , Yasuhiro Hida , Yukio Shimizu
发明人： Motoji Shiota , Gen Nagaoka , Ichiro Umekawa , Yasuhiro Hida , Yukio Shimizu
IPC分类号： H01L29/18
CPC分类号： H05K3/323 , G02F1/13452 , H01L2224/73204 , H01L2924/07811 , H05K1/0231 , H05K3/284 , H05K3/361 , H05K2201/0379 , H05K2201/10636 , H05K2201/10674 , Y02P70/611 , H01L2924/00
摘要： A liquid crystal display device (100) includes a glass substrate (110) having an LSI chip (130) and an FPC board (140) mounted thereon. A component ACF (150a) made of a single sheet is used to further mount discrete electronic components such as stabilizing capacitors (150) on the glass substrate (110). The component ACF (150a) has a size that covers not only a region where the discrete electronic components are to be mounted, but also the top surfaces of the LSI chip (130) and the FPC board (140) which are mounted first. By thus using the large component ACF (150a), a positional constraint upon adhering the component ACF (150a) to the glass substrate (110) is eliminated, reducing the area of a region where the discrete electronic components are mounted. By this, a board module miniaturized by reducing the area of a region where discrete electronic components are mounted is provided.
摘要翻译：液晶显示装置（100）具有安装有LSI芯片（130）的玻璃基板（110）和FPC基板（140）。使用由单片制成的部件ACF（150a），以进一步将诸如稳定电容器（150）的分立电子部件安装在玻璃基板（110）上。部件ACF（150a）的尺寸不仅覆盖要安装分立电子部件的区域，而且覆盖首先安装的LSI芯片（130）和FPC基板（140）的顶表面。通过这样使用大分量ACF（150a），消除了将部件ACF（150a）粘附到玻璃基板（110）上的位置约束，减小了安装分立电子部件的区域的面积。由此，提供了通过减小安装有分立电子部件的区域的面积而小型化的板模块。

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