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1. 发明申请

US20110169791A1 DISPLAY DEVICE 审中-公开
标题翻译：显示设备
公开(公告)号：US20110169791A1
公开(公告)日：2011-07-14
申请号：US13119966
申请日：2009-06-19
申请人： Yasuhiro Hida , Gen Nagaoka , Ichiro Umekawa , Motoji Shiota , Yukio Shimizu
发明人： Yasuhiro Hida , Gen Nagaoka , Ichiro Umekawa , Motoji Shiota , Yukio Shimizu
IPC分类号： G06F3/038 , G09G3/36
CPC分类号： G02F1/13452 , G02F1/1345 , H05K1/147
摘要： In a liquid crystal display device (10), stabilizing capacitors (61), bypass capacitors (62) and boosting capacitors (63), which would conventionally be mounted on an FPC board (50), are disposed along long and short input sides of an LSI chip (40) mounted on a projection (20a) of a glass substrate (20) and the capacitors are connected to their respective input terminals of the LSI chip (40) via capacitor traces (71). This makes it possible to narrow the FPC board (50) connected to the liquid crystal display device (10), thereby achieving size reduction of the liquid crystal display device (10) while achieving reduction in manufacturing cost, including processing and material cost of the FPC board (50).
摘要翻译：在液晶显示装置（10）中，通常安装在FPC基板（50）上的稳定电容器（61），旁路电容器（62）和升压电容器（63）安装在玻璃基板（20）的突起（20a）上的LSI芯片（40）和电容器经由电容器迹线（71）与LSI芯片（40）的各自的输入端子连接。由此，能够使与液晶显示装置（10）连接的FPC基板（50）变窄，从而实现液晶显示装置（10）的小型化，同时实现制造成本的降低，包括处理和材料成本 FPC板（50）。

2. 发明授权

US08450753B2 Board module and method of manufacturing same 有权
标题翻译：板模块及其制造方法
公开(公告)号：US08450753B2
公开(公告)日：2013-05-28
申请号：US13063983
申请日：2009-06-02
申请人： Motoji Shiota , Gen Nagaoka , Ichiro Umekawa , Yasuhiro Hida , Yukio Shimizu
发明人： Motoji Shiota , Gen Nagaoka , Ichiro Umekawa , Yasuhiro Hida , Yukio Shimizu
IPC分类号： H01L29/18
CPC分类号： H05K3/323 , G02F1/13452 , H01L2224/73204 , H01L2924/07811 , H05K1/0231 , H05K3/284 , H05K3/361 , H05K2201/0379 , H05K2201/10636 , H05K2201/10674 , Y02P70/611 , H01L2924/00
摘要： A liquid crystal display device (100) includes a glass substrate (110) having an LSI chip (130) and an FPC board (140) mounted thereon. A component ACF (150a) made of a single sheet is used to further mount discrete electronic components such as stabilizing capacitors (150) on the glass substrate (110). The component ACF (150a) has a size that covers not only a region where the discrete electronic components are to be mounted, but also the top surfaces of the LSI chip (130) and the FPC board (140) which are mounted first. By thus using the large component ACF (150a), a positional constraint upon adhering the component ACF (150a) to the glass substrate (110) is eliminated, reducing the area of a region where the discrete electronic components are mounted. By this, a board module miniaturized by reducing the area of a region where discrete electronic components are mounted is provided.
摘要翻译：液晶显示装置（100）具有安装有LSI芯片（130）的玻璃基板（110）和FPC基板（140）。使用由单片制成的部件ACF（150a），以进一步将诸如稳定电容器（150）的分立电子部件安装在玻璃基板（110）上。部件ACF（150a）的尺寸不仅覆盖要安装分立电子部件的区域，而且覆盖首先安装的LSI芯片（130）和FPC基板（140）的顶表面。通过这样使用大分量ACF（150a），消除了将部件ACF（150a）粘附到玻璃基板（110）上的位置约束，减小了安装分立电子部件的区域的面积。由此，提供了通过减小安装有分立电子部件的区域的面积而小型化的板模块。

3. 发明申请

US20110169022A1 BOARD MODULE AND METHOD OF MANUFACTURING SAME 有权
标题翻译：板模块及其制造方法
公开(公告)号：US20110169022A1
公开(公告)日：2011-07-14
申请号：US13063983
申请日：2009-06-02
申请人： Motoji Shiota , Gen Nagaoka , Ichiro Umekawa , Yasuhiro Hida , Yukio Shimizu
发明人： Motoji Shiota , Gen Nagaoka , Ichiro Umekawa , Yasuhiro Hida , Yukio Shimizu
IPC分类号： H01L23/488 , H01L33/62 , H01L21/60
CPC分类号： H05K3/323 , G02F1/13452 , H01L2224/73204 , H01L2924/07811 , H05K1/0231 , H05K3/284 , H05K3/361 , H05K2201/0379 , H05K2201/10636 , H05K2201/10674 , Y02P70/611 , H01L2924/00
摘要： A liquid crystal display device (100) includes a glass substrate (110) having an LSI chip (130) and an FPC board (140) mounted thereon. A component ACF (150a) made of a single sheet is used to further mount discrete electronic components such as stabilizing capacitors (150) on the glass substrate (110). The component ACF (150a) has a size that covers not only a region where the discrete electronic components are to be mounted, but also the top surfaces of the LSI chip (130) and the FPC board (140) which are mounted first. By thus using the large component ACF (150a), a positional constraint upon adhering the component ACF (150a) to the glass substrate (110) is eliminated, reducing the area of a region where the discrete electronic components are mounted. By this, a board module miniaturized by reducing the area of a region where discrete electronic components are mounted is provided.
摘要翻译：液晶显示装置（100）具有安装有LSI芯片（130）的玻璃基板（110）和FPC基板（140）。使用由单片制成的部件ACF（150a），以进一步将诸如稳定电容器（150）的分立电子部件安装在玻璃基板（110）上。部件ACF（150a）的尺寸不仅覆盖要安装分立电子部件的区域，而且覆盖首先安装的LSI芯片（130）和FPC基板（140）的顶表面。通过这样使用大分量ACF（150a），消除了将部件ACF（150a）粘附到玻璃基板（110）上的位置约束，减小了安装分立电子部件的区域的面积。由此，提供了通过减小安装有分立电子部件的区域的面积而小型化的板模块。

4. 发明申请

US20110169792A1 DISPLAY PANEL 审中-公开
标题翻译：显示面板
公开(公告)号：US20110169792A1
公开(公告)日：2011-07-14
申请号：US13119967
申请日：2009-06-15
申请人： Yukio Shimizu , Gen Nagaoka , Ichiro Umekawa , Motoji Shiota , Yasuhiro Hida
发明人： Yukio Shimizu , Gen Nagaoka , Ichiro Umekawa , Motoji Shiota , Yasuhiro Hida
IPC分类号： G06F3/038 , G09G3/36
CPC分类号： G02F1/1345 , G02F1/1309 , G09G3/006 , G09G3/3611 , G09G2300/0426 , G09G2330/06 , H05K1/0215 , H05K1/0268 , H05K1/147 , H05K2201/10363 , H05K2201/10636 , Y02P70/611
摘要： The present invention provides a display panel in which, without providing connection terminals, the number of which corresponds to the number of test terminals of a liquid crystal panel, on a circuit board such as an FPC board, miniaturization is obtained while reducing costs such as the mounting cost and material cost of the circuit board, and stable operation is performed. A liquid crystal panel (10) has a configuration in which jumper resistors (60a) to (60f) are provided in an overhanging portion (20a) of a glass substrate (20) to ground test terminals, which eliminates the need to ground the test terminals on an FPC board (50). Thus, wiring lines and connection terminals which are connected to the test terminals, respectively, and the numbers of which are equal to the number of the test terminals do not need to be provided on the FPC board (50), reducing the width of the FPC board (50). Thus, the material cost of the FPC board (50) is reduced, and a process performed when mounting the FPC board (50) on the glass substrate (20) is simplified, reducing mounting cost.
摘要翻译：本发明提供一种显示面板，其中，在不设置与液晶面板的测试端子的数量相对应的连接端子的情况下，在诸如FPC基板的电路板上获得小型化，同时降低诸如执行电路板的安装成本和材料成本，并且执行稳定的操作。液晶面板（10）具有将玻璃基板（20）的突出部（20a）中的跳线电阻（60a〜60f）设置为接地试验端子的结构，无需将测试 FPC基板（50）上的端子。因此，不需要在FPC基板（50）上设置与测试端子分别连接的数量等于测试端子的数量的布线和连接端子，从而减小 FPC板（50）。因此，FPC板（50）的材料成本降低，并且将FPC基板（50）安装在玻璃基板（20）上时的处理简化，降低了安装成本。

5. 发明授权

US09207477B2 Display module and display device 有权
标题翻译：显示模块和显示设备
公开(公告)号：US09207477B2
公开(公告)日：2015-12-08
申请号：US14113886
申请日：2012-04-23
申请人： Hiroki Miyazaki , Motoji Shiota , Takatoshi Kira , Gen Nagaoka , Seiji Muraoka , Makoto Tamaki , Keiji Aota , Yukio Shimizu , Takashi Matsui , Hiroki Nakahama , Hiroki Makino , Minoru Horino
发明人： Hiroki Miyazaki , Motoji Shiota , Takatoshi Kira , Gen Nagaoka , Seiji Muraoka , Makoto Tamaki , Keiji Aota , Yukio Shimizu , Takashi Matsui , Hiroki Nakahama , Hiroki Makino , Minoru Horino
IPC分类号： G02F1/1333 , G02F1/1345 , F21V8/00
CPC分类号： G02F1/133308 , G02B6/0001 , G02F1/1333 , G02F1/13336 , G02F1/13452
摘要： A display module 1 of the present invention includes a first board 3, a second board 4, a base film 5, and a circuit member 2. The first board 3 and the second board 4 are bonded together to face with each other. The base film 5 is provided between the first board 3 and the second board 4 and extends outwardly from an end of the first board 3. The base film 5 has an insulating property and the extended portion is bent to an outer surface side of one of the first board 3 and the second board 4. The circuit member 2 is formed on the base film 5.
摘要翻译：本发明的显示模块1包括第一板3，第二板4，基膜5和电路构件2.第一板3和第二板4彼此接合在一起。基膜5设置在第一基板3和第二基板4之间，并且从第一基板3的端部向外延伸。基膜5具有绝缘性，延伸部弯曲到第一板3和第二板4.电路构件2形成在基膜5上。

6. 发明申请

US20140092338A1 DISPLAY MODULE AND DISPLAY DEVICE 有权
标题翻译：显示模块和显示设备
公开(公告)号：US20140092338A1
公开(公告)日：2014-04-03
申请号：US14113886
申请日：2012-04-23
申请人： Hiroki Miyazaki , Motoji Shiota , Takatoshi Kira , Gen Nagaoka , Seiji Muraoka , Makoto Tamaki , Keiji Aota , Yukio Shimizu , Takashi Matsui , Hiroki Nakahama , Hiroki Makino , Minoru Horino
发明人： Hiroki Miyazaki , Motoji Shiota , Takatoshi Kira , Gen Nagaoka , Seiji Muraoka , Makoto Tamaki , Keiji Aota , Yukio Shimizu , Takashi Matsui , Hiroki Nakahama , Hiroki Makino , Minoru Horino
IPC分类号： G02F1/1333 , F21V8/00
CPC分类号： G02F1/133308 , G02B6/0001 , G02F1/1333 , G02F1/13336 , G02F1/13452
摘要： A display module 1 of the present invention includes a first board 3, a second board 4, a base film 5, and a circuit member 2. The first board 3 and the second board 4 are bonded together to face with each other. The base film 5 is provided between the first board 3 and the second board 4 and extends outwardly from an end of the first board 3. The base film 5 has an insulating property and the extended portion is bent to an outer surface side of one of the first board 3 and the second board 4. The circuit member 2 is formed on the base film 5.
摘要翻译：本发明的显示模块1包括第一板3，第二板4，基膜5和电路构件2.第一板3和第二板4彼此接合在一起。基膜5设置在第一基板3和第二基板4之间，并且从第一基板3的端部向外延伸。基膜5具有绝缘性，延伸部弯曲到第一板3和第二板4.电路构件2形成在基膜5上。

7. 发明申请

US20120133876A1 LIQUID CRYSTAL PANEL 审中-公开
标题翻译：液晶面板
公开(公告)号：US20120133876A1
公开(公告)日：2012-05-31
申请号：US13262216
申请日：2010-01-15
申请人： Hiroki Nakahama , Keigo Aoki , Gen Nagaoka , Kiyoshi Inada , Motoji Shiota
发明人： Hiroki Nakahama , Keigo Aoki , Gen Nagaoka , Kiyoshi Inada , Motoji Shiota
IPC分类号： G02F1/1343
CPC分类号： G02F1/133528
摘要： A region for mounting components such as an IC chip is sufficiently ensured on a glass substrate with which a liquid crystal panel is configured, without reducing the number of panel pieces to be taken from a large panel. A liquid crystal panel is composed of a first glass substrate (10) and a second glass substrate (20) which face each other with a liquid crystal therebetween. The first glass substrate (10) and the second glass substrate (20) are formed in substantially the same size in plan view and bonded together in a state in which these substrates are shifted from each other by a predetermined distance in the direction of the longer side or in the direction of the shorter side. Regions to become a frame (frame regions) are provided on both the first glass substrate (10) and the second glass substrate (20), and pads (60) are provided on both of these frame regions.
摘要翻译：在配置有液晶面板的玻璃基板上充分确保了用于安装诸如IC芯片的部件的区域，而不会减少从大面板取出的面板件的数量。液晶面板由第一玻璃基板（10）和第二玻璃基板（20）构成，第一玻璃基板（10）和第二玻璃基板（20）之间具有液晶。第一玻璃基板（10）和第二玻璃基板（20）在平面图中形成为大致相同的尺寸，并且在这些基板沿较长的方向彼此偏移预定距离的状态下接合在一起侧或在短边方向。在第一玻璃基板（10）和第二玻璃基板（20）两者上设置成为框架（框架区域）的区域，并且在这两个框架区域上设置焊盘（60）。

8. 发明授权

US08421979B2 Display panel and display device including the same 有权
标题翻译：显示面板和显示设备包括相同
公开(公告)号：US08421979B2
公开(公告)日：2013-04-16
申请号：US13003790
申请日：2009-05-21
申请人： Yukio Shimizu , Takashi Matsui , Motoji Shiota , Keigo Aoki , Hiroki Nakahama
发明人： Yukio Shimizu , Takashi Matsui , Motoji Shiota , Keigo Aoki , Hiroki Nakahama
IPC分类号： G02F1/1345
CPC分类号： G02F1/13452
摘要： A drive IC chip (21) including a circuit for driving a display region (41) is mounted on a panel substrate (11). An anisotropic conductive film (31) is interposed between the panel substrate (11) and the drive IC chip (21) and electrically connects the bump electrodes (22) of the drive IC chip (21) and the electrode pads (27) of the panel substrate (11). The anisotropic conductive film (31) is arranged to extend beyond all side surfaces (21b to 21d) other than one specific side surface (21a) of the drive IC chip (21).
摘要翻译：包括用于驱动显示区域（41）的电路的驱动IC芯片（21）安装在面板基板（11）上。在面板基板（11）和驱动IC芯片（21）之间插入各向异性导电膜（31），并将驱动IC芯片（21）的凸块电极（22）与电极焊盘（27）电连接面板基板（11）。各向异性导电膜（31）被布置成延伸超过驱动IC芯片（21）的一个特定侧表面（21a）以外的所有侧表面（21b至21d）。

9. 发明申请

US20110122337A1 DISPLAY PANEL AND DISPLAY DEVICE INCLUDING THE SAME 有权
标题翻译：显示面板和显示装置，包括它们
公开(公告)号：US20110122337A1
公开(公告)日：2011-05-26
申请号：US13003790
申请日：2009-05-21
申请人： Yukio Shimizu , Takashi Matsui , Motoji Shiota , Keigo Aoki , Hiroki Nakahama
发明人： Yukio Shimizu , Takashi Matsui , Motoji Shiota , Keigo Aoki , Hiroki Nakahama
IPC分类号： G02F1/1335 , G02F1/1345
CPC分类号： G02F1/13452
摘要： A drive IC chip (21) including a circuit for driving a display region (41) is mounted on a panel substrate (11). An anisotropic conductive film (31) is interposed between the panel substrate (11) and the drive IC chip (21) and electrically connects the bump electrodes (22) of the drive IC chip (21) and the electrode pads (27) of the panel substrate (11). The anisotropic conductive film (31) is arranged to extend beyond all side surfaces (21b to 21d) other than one specific side surface (21a) of the drive IC chip (21).
摘要翻译：包括用于驱动显示区域（41）的电路的驱动IC芯片（21）安装在面板基板（11）上。在面板基板（11）和驱动IC芯片（21）之间插入各向异性导电膜（31），并将驱动IC芯片（21）的凸块电极（22）与电极焊盘（27）电连接面板基板（11）。各向异性导电膜（31）被布置成延伸超过驱动IC芯片（21）的一个特定侧表面（21a）以外的所有侧表面（21b至21d）。

10. 发明申请

US20130335940A1 ELECTRONIC CIRCUIT SUBSTRATE, DISPLAY DEVICE, AND WIRING SUBSTRATE 有权
标题翻译：电子电路基板，显示装置和布线基板
公开(公告)号：US20130335940A1
公开(公告)日：2013-12-19
申请号：US14002346
申请日：2012-03-01
申请人： Takashi Matsui , Motoji Shiota , Hiroki Nakahama
发明人： Takashi Matsui , Motoji Shiota , Hiroki Nakahama
IPC分类号： H05K1/18
CPC分类号： H05K1/18 , G02F1/13454 , H01L23/49811 , H01L23/49838 , H01L24/13 , H01L24/16 , H01L24/81 , H01L24/83 , H01L24/92 , H01L2224/10165 , H01L2224/13013 , H01L2224/13144 , H01L2224/14132 , H01L2224/14133 , H01L2224/16237 , H01L2224/2929 , H01L2224/293 , H01L2224/32225 , H01L2224/73204 , H01L2224/8114 , H01L2224/81191 , H01L2224/81385 , H01L2224/81903 , H01L2224/83851 , H01L2224/9211 , H01L2924/07802 , H01L2924/15788 , H01L2924/351 , H05K1/111 , H05K2201/09436 , H05K2201/09709 , H05K2201/09745 , H05K2201/09909 , H05K2201/10674 , Y02P70/611 , H01L2924/00014 , H01L2224/81 , H01L2224/83 , H01L2924/00
摘要： A wiring substrate (11) includes: a substrate; and, formed upon the substrate, a plurality of wiring lines, a plurality of circuit elements, and a plurality of connecting terminals (51) connected via the plurality of wiring lines. Each of the plurality of connecting terminals (51) includes a pair of protrusion parts (50), forming a depression part (60) between the pair of protrusion parts (50), and a depression electrode (52) that is disposed in the depression part (60) and that at least partially covers each protrusion of the pair of protrusion parts (50).
摘要翻译：布线基板（11）包括：基板; 并且在所述基板上形成有多条布线，多个电路元件以及经由所述多根布线连接的多个连接端子（51）。多个连接端子（51）中的每一个包括在一对突出部（50）之间形成有凹部（60）的一对突出部（50），设置在该凹部部分（60）并且至少部分地覆盖所述一对突出部分（50）中的每个突起。

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