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    • 1. 发明授权
    • Gate array semiconductor device
    • 门阵列半导体器件
    • US6084255A
    • 2000-07-04
    • US126092
    • 1998-07-30
    • Kimio UedaTakanori HirotaYoshiki WadaKoichiro Mashiko
    • Kimio UedaTakanori HirotaYoshiki WadaKoichiro Mashiko
    • H01L21/82H01L27/02H01L27/118H01L27/12H01L27/10
    • H01L27/0207H01L27/11807H01L27/1203
    • In each of basic cells (BC) arranged in array in an SOI layer, PMOS and NMOS transistors are symmetrically formed. Body regions (11) and (12) are formed to divide source/drain layers (1) and (2), respectively, and gate electrodes (3) and (4) are formed on the body regions (11) and (12) respectively to sandwich gate insulating films therebetween. The gate electrodes (3) and (4) are connected at their both ends to gate contact regions (5) to (8), respectively, and the body regions (11) and (12) are connected at their one ends to body contact regions (9) and (10), respectively. The body contact regions (9) and (10) are so arranged as to sandwich the gate contact regions (5) and (7) together with the gate electrodes (3) and (4), respectively. Being of a SOI type, the device achieves high-speed operation and low power consumption. Further, with positional relation between the body contact regions (9), (10) and the gate contact regions (5), (7), the device is capable of freely setting the transistors to be of either a gate control type or a gate fixed type. As a result, the gate array type semiconductor device achieves high-speed operation and low power consumption.
    • 在以SOI阵列排列的每个基本单元(BC)中,对称地形成PMOS和NMOS晶体管。 主体区域(11)和(12)分别形成为分隔源极/漏极层(1)和(2),并且在主体区域(11)和(12)上形成栅电极(3)和(4) 分别在其间夹着栅极绝缘膜。 栅电极(3)和(4)的两端分别连接到栅极接触区域(5)至(8),并且主体区域(11)和(12)在其一端连接到主体接触 区域(9)和(10)。 主体接触区域(9)和(10)被布置成分别将栅极接触区域(5)和(7)与栅极电极(3)和(4)夹在一起。 作为SOI型,该器件实现了高速操作和低功耗。 此外,通过体接触区域(9),(10)和栅极接触区域(5),(7)之间的位置关系,该器件能够自由地将晶体管设置为栅极控制型或栅极 固定式。 结果,门阵列型半导体器件实现了高速操作和低功耗。
    • 4. 发明授权
    • Silicon-on-insulator circuit having series connected PMOS transistors each having connected body and gate
    • 具有串联连接的PMOS晶体管的绝缘体上硅电路,每个具有连接体和栅极
    • US06177826B1
    • 2001-01-23
    • US09053700
    • 1998-04-02
    • Koichiro MashikoKimio UedaYoshiki Wada
    • Koichiro MashikoKimio UedaYoshiki Wada
    • H03K190948
    • H03K19/0027H03K19/01707H03K2217/0018
    • A Silicon-On-Insulator (SOI) CMOS circuit comprises a plurality of PMOS transistors connected in series to each other, each of the plurality of PMOS transistors having its body and gate connected to each other, and at least an NMOS transistor connected to one of the plurality of PMOS transistors, the NMOS transistor having its body connected to a low reference potential having a value of ground. The SOI CMOS circuit can further comprise a plurality of potential limiting circuits each connected between the body and gate of each of the plurality of PMOS transistors, for setting a lower limit of the potential of the body of each of the plurality of PMOS transistors to a voltage between a high reference potential and a potential obtained by subtracting a built-in potential from the high reference potential.
    • 绝缘体上硅绝缘体(SOI)CMOS电路包括彼此串联连接的多个PMOS晶体管,多个PMOS晶体管中的每一个具有彼此连接的主体和栅极,以及连接到一个的至少一个NMOS晶体管 的NMOS晶体管,其NMOS晶体管的主体连接到具有接地值的低参考电位。 SOI CMOS电路还可以包括多个限制电路,每个电位限制电路连接在多个PMOS晶体管中的每一个的主体和栅极之间,用于将多个PMOS晶体管的每个的主体的电位的下限设置为 通过从高参考电位减去内置电位而获得的高参考电位和电位之间的电压。
    • 7. 发明授权
    • Data holding circuit and buffer circuit
    • 数据保持电路和缓冲电路
    • US5859800A
    • 1999-01-12
    • US949821
    • 1997-10-14
    • Kimio UedaHiroyuki MorinakaKoichiro Mashiko
    • Kimio UedaHiroyuki MorinakaKoichiro Mashiko
    • H03K3/356G11C7/10H03K3/037H03K19/00G11C7/00
    • G11C7/1051G11C7/106G11C7/1078G11C7/1093H03K3/356121H03K3/356173
    • A highly reliable data holding circuit with a reduced circuit area and reduced power consumption is disclosed. Output terminals (DO, DOB) are connected to input terminals (DI, DIB) receiving signals at H and L levels (potentials VDD and GND) in mutually exclusive relation through transistors (MN2, MN1) and inverters (INV1, INV2). Input terminals of the inverters (INV1, INV2) are connected to power supplies (VDD) through transistors (MP2, MP1) having gate electrodes connected to output terminals of the inverters (INV2, INV1), respectively. The transistors (MN2, MN1) cause a voltage drop of the signals to be applied to the inverters (INV1, INV2) by the amount of a threshold voltage (Vthn). One of the transistors (MP1, MP2) which receives a signal at L level at its control terminal provides a potential (VDD) to the input terminal of one of the inverters (INV1, INV2) which is to output a signal at L level, compensating for the voltage drop by the amount of the threshold voltage (Vthn).
    • 公开了一种具有降低的电路面积和降低的功耗的高度可靠的数据保持电路。 输出端子(DO,DOB)通过晶体管(MN2,MN1)和反相器(INV1,INV2)以H和L电平(电位VDD和GND)的互斥关系连接到输入端子(DI,DIB)。 反相器(INV1,INV2)的输入端分别通过连接到反相器(INV2,INV1)的输出端的栅电极的晶体管(MP2,MP1)连接到电源(VDD)。 晶体管(MN2,MN1)使信号的电压降到施加到反相器(INV1,INV2)的量的阈值电压(Vthn)。 在其控制端子处接收到L电平的信号的晶体管(MP1,MP2)中的一个为向L电平输出信号的反相器(INV1,INV2)中的一个的输入端提供电位(VDD) 通过阈值电压(Vthn)的量来补偿电压降。
    • 9. 发明授权
    • Method of fabricating a gate array semiconductor integrated circuit
device
    • 制造栅阵列半导体集成电路器件的方法
    • US5891765A
    • 1999-04-06
    • US782944
    • 1997-01-13
    • Kimio UedaHiroyuki MorinakaKoichiro Mashiko
    • Kimio UedaHiroyuki MorinakaKoichiro Mashiko
    • H01L21/82H01L21/84H01L27/118H01L27/12H01L29/786H01L27/01H01L27/10H01L29/76
    • H01L21/84H01L27/118H01L27/11807H01L27/1203
    • In order to improve a withstand voltage and implement a gate array SOI semiconductor integrated circuit device having a large gate width, a region consisting of end cells (49) is provided on each end of a region formed by repeatedly arranging basic cells (BC) consisting of both transistor regions (32, 33) in a first direction and while symmetrically arranging the same to be folded in a second direction. Both ends of a channel region of a PMOS transistor (42) are drawn out in the second direction to provide a P-type semiconductor layer just under a field shielding gate electrode (FG), and this semiconductor layer is drawn also in the first direction to be connected with a P-type semiconductor layer of the end cell (49). A first source potential is applied to a region (PBD) which is bonded with one of the P-type semiconductor layers. Also as to an NMOS transistor (41) which is adjacent through a field oxide film (FO), on the other hand, an N-type semiconductor layer is similarly provided so that this N-type semiconductor layer is also connected with that of the end cell (49). A second source potential is applied to a region (NBD).
    • 为了提高耐压并实现具有较大栅极宽度的栅阵列SOI半导体集成电路器件,在通过重复布置基本单元(BC)形成的区域的每个端部上设置由端单元(49)组成的区域,所述基本单元(BC) 的两个晶体管区域(32,33)在第一方向上并且同时对称地布置在第二方向上被折叠。 PMOS晶体管(42)的沟道区域的两端在第二方向上被拉出以提供刚好在场屏蔽栅极(FG)下面的P型半导体层,并且该半导体层也沿第一方向 与端电池(49)的P型半导体层连接。 将第一源极电位施加到与一个P型半导体层接合的区域(PBD)。 另一方面,与通过场氧化膜(FO)相邻的NMOS晶体管(41)也类似地设置N型半导体层,使得该N型半导体层也与 端单元(49)。 第二源电位被应用于区域(NBD)。