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    • 8. 发明申请
    • THIN FILM TRANSISTOR AND METHOD OF FABRICATING SAME
    • 薄膜晶体管及其制造方法
    • US20120001190A1
    • 2012-01-05
    • US13259154
    • 2010-02-09
    • Tohru OkabeTakeshi YanedaTetsuya AitaTsuyoshi InoueYoshiyuki Harumoto
    • Tohru OkabeTakeshi YanedaTetsuya AitaTsuyoshi InoueYoshiyuki Harumoto
    • H01L29/786H01L21/336
    • H01L21/02532H01L21/02678H01L27/1285H01L29/4908H01L29/66765H01L29/78696
    • The invention provides a thin film transistor that can improve its operating speed by improving crystallinity near a bottom surface of a channel layer. Of laser light irradiated onto an amorphous silicon layer, light transmitted through the amorphous silicon layer is absorbed by a gate electrode 130 and thereby produces heat. Since the gate electrode 130 is made of a titanium layer 102 with a low thermal conductivity, the produced heat is less likely to be transmitted through a gate wiring line 110 and dissipated and thus increases the temperature of the gate electrode 130. Radiant heat from the gate electrode 130 is provided to a bottom surface of the amorphous silicon layer and thus the amorphous silicon layer is also heated from its bottom surface. As a result, an amorphous silicon layer 106a melts not only from its top surface but also from its bottom surface and is solidified, whereby crystallization proceeds, and thus, the amorphous silicon layer 106a turns into a polycrystalline silicon layer 106b. Hence, the mobility near a bottom surface of the polycrystalline silicon layer 106b also increases, improving the operating speed of a thin film transistor 100.
    • 本发明提供一种薄膜晶体管,其可以通过改善沟道层底表面附近的结晶度来提高其工作速度。 照射到非晶硅层上的激光,透过非晶硅层的光被栅电极130吸收,从而产生热量。 由于栅电极130由具有低热导率的钛层102制成,所产生的热不太可能通过栅极布线110透射并消散,因此增加了栅电极130的温度。来自 栅电极130被提供到非晶硅层的底表面,因此非晶硅层也从其底表面加热。 结果,非晶硅层106a不仅从其顶表面而且从其底表面熔化并且固化,从而进行结晶,因此非晶硅层106a变成多晶硅层106b。 因此,多晶硅层106b的底表面附近的迁移率也增加,提高了薄膜晶体管100的工作速度。
    • 10. 发明授权
    • Semiconductor device and method for producing same
    • 半导体装置及其制造方法
    • US08685803B2
    • 2014-04-01
    • US13514081
    • 2010-12-03
    • Yoshimasa ChikamaHirohiko NishikiYoshifumi OhtaTakeshi HaraTetsuya AitaMasahiko SuzukiMichiko TakeiOkifumi NakagawaYoshiyuki HarumotoHinae Mizuno
    • Yoshimasa ChikamaHirohiko NishikiYoshifumi OhtaYuuji MizunoTakeshi HaraTetsuya AitaMasahiko SuzukiMichiko TakeiOkifumi NakagawaYoshiyuki Harumoto
    • H01L21/00
    • H01L27/1225G02F1/13458G02F1/136213H01L27/124H01L27/1244H01L27/1248
    • A semiconductor device includes: a thin film transistor having a gate line (3a), a first insulating film (5), an island-shaped oxide semiconductor layer (7a), a second insulating film (9), a source line (13as), a drain electrode (13ad), and a passivation film; and a terminal portion having a first connecting portion (3c) made of the same conductive film as the gate line, a second connecting portion (13c) made of the same conductive film as the source line and the drain electrode, and a third connecting portion (19c) formed on the second connecting portion. The second connecting portion is in contact with the first connecting portion within a first opening (11c) provided in the first and second insulating films; the third connecting portion (19c) is in contact with the second connecting portion within a second opening (17c) provided in the passivation film; and the second connecting portion (13c) covers end faces of the first and second insulating films within the first opening (11c), but does not cover an end face of the passivation film (15) within the second opening (17c). As a result, the taper shape of a contact hole of the terminal portion can be controlled with a high precision.
    • 半导体器件包括:具有栅极线(3a),第一绝缘膜(5),岛状氧化物半导体层(7a),第二绝缘膜(9),源极线(13as))的薄膜晶体管, ,漏电极(13ad)和钝化膜; 以及具有由与栅极线相同的导电膜制成的第一连接部分(3c)的端子部分,由与源极线和漏极电极相同的导电膜制成的第二连接部分(13c)和第三连接部分 (19c)形成在第二连接部分上。 第二连接部分在设置在第一和第二绝缘膜中的第一开口(11c)内与第一连接部分接触; 所述第三连接部分(19c)在设置在所述钝化膜中的第二开口(17c)内与所述第二连接部分接触; 并且所述第二连接部分(13c)覆盖所述第一开口(11c)内的所述第一绝缘膜和所述第二绝缘膜的端面,但不覆盖所述第二开口(17c)内的所述钝化膜(15)的端面。 结果,可以高精度地控制端子部分的接触孔的锥形形状。