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1. 发明申请

US20070288219A1 METHODS AND SYSTEMS FOR UTILIZING DESIGN DATA IN COMBINATION WITH INSPECTION DATA 有权
标题翻译：与检验数据组合使用设计数据的方法和系统
公开(公告)号：US20070288219A1
公开(公告)日：2007-12-13
申请号：US11561659
申请日：2006-11-20
申请人： Khurram Zafar , Sagar Kekare , Ellis Chang , Allen Park , Peter Rose
发明人： Khurram Zafar , Sagar Kekare , Ellis Chang , Allen Park , Peter Rose
IPC分类号： G06F17/50
CPC分类号： G06T7/0006 , G03F1/84 , G06F17/5081 , G06T7/0008 , G06T2207/20076 , G06T2207/30148
摘要： Various methods and systems for utilizing design data in combination with inspection data are provided. One computer-implemented method for binning defects detected on a wafer includes comparing portions of design data proximate positions of the defects in design data space. The method also includes determining if the design data in the portions is at least similar based on results of the comparing step. In addition, the method includes binning the defects in groups such that the portions of the design data proximate the positions of the defects in each of the groups are at least similar. The method further includes storing results of the binning step in a storage medium.
摘要翻译：提供了与检测数据结合使用设计数据的各种方法和系统。用于对在晶片上检测到的缺陷进行合并的计算机实现的方法包括将设计数据的部分靠近设计数据空间中的缺陷的位置进行比较。该方法还包括基于比较步骤的结果确定部分中的设计数据是否至少相似。此外，该方法包括将组中的缺陷合并成使得设计数据中靠近每个组中的缺陷的位置的部分至少相似。该方法还包括将合并步骤的结果存储在存储介质中。

2. 发明授权

US08923600B2 Methods and systems for utilizing design data in combination with inspection data 有权
标题翻译：利用设计数据结合检验数据的方法和系统
公开(公告)号：US08923600B2
公开(公告)日：2014-12-30
申请号：US12534547
申请日：2009-08-03
申请人： Khurram Zafar , Sagar Kekare , Ellis Chang , Allen Park , Peter Rose
发明人： Khurram Zafar , Sagar Kekare , Ellis Chang , Allen Park , Peter Rose
IPC分类号： G06K9/00 , G06F17/50 , G03F1/84
CPC分类号： G06T7/0006 , G03F1/84 , G06F17/5081 , G06T7/0008 , G06T2207/20076 , G06T2207/30148
摘要： Various methods and systems for utilizing design data in combination with inspection data are provided. One computer-implemented method for binning defects detected on a wafer includes comparing portions of design data proximate positions of the defects in design data space. The method also includes determining if the design data in the portions is at least similar based on results of the comparing step. In addition, the method includes binning the defects in groups such that the portions of the design data proximate the positions of the defects in each of the groups are at least similar. The method further includes storing results of the binning step in a storage medium.
摘要翻译：提供了与检测数据结合使用设计数据的各种方法和系统。用于对在晶片上检测到的缺陷进行合并的计算机实现的方法包括将设计数据的部分靠近设计数据空间中的缺陷的位置进行比较。该方法还包括基于比较步骤的结果确定部分中的设计数据是否至少相似。此外，该方法包括将组中的缺陷合并成使得设计数据中靠近每个组中的缺陷的位置的部分至少相似。该方法还包括将合并步骤的结果存储在存储介质中。

3. 发明申请

US20090297019A1 METHODS AND SYSTEMS FOR UTILIZING DESIGN DATA IN COMBINATION WITH INSPECTION DATA 有权
标题翻译：与检验数据组合使用设计数据的方法和系统
公开(公告)号：US20090297019A1
公开(公告)日：2009-12-03
申请号：US12534547
申请日：2009-08-03
申请人： Khurram Zafar , Sagar Kekare , Ellis Chang , Allen Park , Peter Rose
发明人： Khurram Zafar , Sagar Kekare , Ellis Chang , Allen Park , Peter Rose
IPC分类号： G06K9/00
CPC分类号： G06T7/0006 , G03F1/84 , G06F17/5081 , G06T7/0008 , G06T2207/20076 , G06T2207/30148
摘要： Various methods and systems for utilizing design data in combination with inspection data are provided. One computer-implemented method for binning defects detected on a wafer includes comparing portions of design data proximate positions of the defects in design data space. The method also includes determining if the design data in the portions is at least similar based on results of the comparing step. In addition, the method includes binning the defects in groups such that the portions of the design data proximate the positions of the defects in each of the groups are at least similar. The method further includes storing results of the binning step in a storage medium.
摘要翻译：提供了与检测数据结合使用设计数据的各种方法和系统。用于对在晶片上检测到的缺陷进行合并的计算机实现的方法包括将设计数据的部分靠近设计数据空间中的缺陷的位置进行比较。该方法还包括基于比较步骤的结果确定部分中的设计数据是否至少相似。此外，该方法包括将组中的缺陷合并成使得设计数据中靠近每个组中的缺陷的位置的部分至少相似。该方法还包括将合并步骤的结果存储在存储介质中。

4. 发明授权

US07570796B2 Methods and systems for utilizing design data in combination with inspection data 有权
标题翻译：利用设计数据结合检验数据的方法和系统
公开(公告)号：US07570796B2
公开(公告)日：2009-08-04
申请号：US11561659
申请日：2006-11-20
申请人： Khurram Zafar , Sagar Kekare , Ellis Chang , Allen Park , Peter Rose
发明人： Khurram Zafar , Sagar Kekare , Ellis Chang , Allen Park , Peter Rose
IPC分类号： G06K9/00
CPC分类号： G06T7/0006 , G03F1/84 , G06F17/5081 , G06T7/0008 , G06T2207/20076 , G06T2207/30148
摘要： Various methods and systems for utilizing design data in combination with inspection data are provided. One computer-implemented method for binning defects detected on a wafer includes comparing portions of design data proximate positions of the defects in design data space. The method also includes determining if the design data in the portions is at least similar based on results of the comparing step. In addition, the method includes binning the defects in groups such that the portions of the design data proximate the positions of the defects in each of the groups are at least similar. The method further includes storing results of the binning step in a storage medium.
摘要翻译：提供了与检测数据结合使用设计数据的各种方法和系统。用于对在晶片上检测到的缺陷进行合并的计算机实现的方法包括将设计数据的部分靠近设计数据空间中的缺陷的位置进行比较。该方法还包括基于比较步骤的结果确定部分中的设计数据是否至少相似。此外，该方法包括将组中的缺陷合并成使得设计数据中靠近每个组中的缺陷的位置的部分至少相似。该方法还包括将合并步骤的结果存储在存储介质中。

5. 发明申请

US20080081385A1 METHODS AND SYSTEMS FOR INSPECTION OF WAFERS AND RETICLES USING DESIGNER INTENT DATA 审中-公开
标题翻译：使用设计者信息数据检查波形和反射的方法和系统
公开(公告)号：US20080081385A1
公开(公告)日：2008-04-03
申请号：US11939983
申请日：2007-11-14
申请人： Paul Marella , Sharon McCauley , Ellis Chang , William Volk , James Wiley , Sterling Watson , Sagar Kekare , Carl Hess
发明人： Paul Marella , Sharon McCauley , Ellis Chang , William Volk , James Wiley , Sterling Watson , Sagar Kekare , Carl Hess
IPC分类号： H01L21/66
CPC分类号： G06T7/0006 , G01N21/9501 , G01N21/956 , G01N2021/95676 , G03F1/84 , G03F7/7065 , G06T7/0008 , G06T2207/30148
摘要： Methods and systems for inspection of wafers and reticles using designer intent data are provided. One computer-implemented method includes identifying nuisance defects on a wafer based on inspection data produced by inspection of a reticle, which is used to form a pattern on the wafer prior to inspection of the wafer. Another computer-implemented method includes detecting defects on a wafer by analyzing data generated by inspection of the wafer in combination with data representative of a reticle, which includes designations identifying different types of portions of the reticle. An additional computer-implemented method includes determining a property of a manufacturing process used to process a wafer based on defects that alter a characteristic of a device formed on the wafer. Further computer-implemented methods include altering or simulating one or more characteristics of a design of an integrated circuit based on data generated by inspection of a wafer.
摘要翻译：提供了使用设计人员意图数据检查晶圆和标线的方法和系统。一种计算机实现的方法包括基于通过检查光罩产生的检查数据来识别晶片上的有害缺陷，其用于在晶片检查之前在晶片上形成图案。另一种计算机实现的方法包括通过分析通过检查晶片产生的数据来结合表示标线的数据来检测晶片上的缺陷，该数据包括标识掩模版的不同类型的部分的标记。附加的计算机实现的方法包括基于改变晶片上形成的器件的特性的缺陷来确定用于处理晶片的制造工艺的特性。进一步的计算机实现的方法包括基于通过检查晶片产生的数据来改变或模拟集成电路的设计的一个或多个特性。

6. 发明申请

US20050004774A1 Methods and systems for inspection of wafers and reticles using designer intent data 有权
标题翻译：使用设计人员意图数据检查晶圆和标线片的方法和系统
公开(公告)号：US20050004774A1
公开(公告)日：2005-01-06
申请号：US10883372
申请日：2004-07-01
申请人： William Volk , James Wiley , Sterling Watson , Sagar Kekare , Carl Hess , Paul Marella , Sharon McCauley , Ellis Chang
发明人： William Volk , James Wiley , Sterling Watson , Sagar Kekare , Carl Hess , Paul Marella , Sharon McCauley , Ellis Chang
IPC分类号： G01N21/95 , G03F1/44 , G03F7/20 , G01N21/00
CPC分类号： G06T7/0006 , G01N21/9501 , G01N21/956 , G01N2021/95676 , G03F1/84 , G03F7/7065 , G06T7/0008 , G06T2207/30148
摘要： Methods and systems for inspection of wafers and reticles using designer intent data are provided. One computer-implemented method includes identifying nuisance defects on a wafer based on inspection data produced by inspection of a reticle, which is used to form a pattern on the wafer prior to inspection of the wafer. Another computer-implemented method includes detecting defects on a wafer by analyzing data generated by inspection of the wafer in combination with data representative of a reticle, which includes designations identifying different types of portions of the reticle. An additional computer-implemented method includes determining a property of a manufacturing process used to process a wafer based on defects that alter a characteristic of a device formed on the wafer. Further computer-implemented methods include altering or simulating one or more characteristics of a design of an integrated circuit based on data generated by inspection of a wafer.
摘要翻译：提供了使用设计人员意图数据检查晶圆和标线的方法和系统。一种计算机实现的方法包括基于通过检查光罩产生的检查数据来识别晶片上的有害缺陷，其用于在晶片检查之前在晶片上形成图案。另一种计算机实现的方法包括通过分析通过检查晶片产生的数据来结合表示标线的数据来检测晶片上的缺陷，该数据包括标识掩模版的不同类型的部分的标记。附加的计算机实现的方法包括基于改变晶片上形成的器件的特性的缺陷来确定用于处理晶片的制造工艺的特性。进一步的计算机实现的方法包括基于通过检查晶片产生的数据来改变或模拟集成电路的设计的一个或多个特性。

7. 发明授权

US08549445B2 Targeted production control using multivariate analysis of design marginalities 有权
标题翻译：使用多变量分析设计边际的目标生产控制
公开(公告)号：US08549445B2
公开(公告)日：2013-10-01
申请号：US13023049
申请日：2011-02-08
申请人： Sagar Kekare
发明人： Sagar Kekare
IPC分类号： G06F17/50
CPC分类号： H01L22/20 , G01R31/2894 , G06F2217/12 , G06F2217/14 , Y02P90/265
摘要： Targeted production control using multivariate analysis of design marginalities. A list of a plurality of metrology operations is accessed during production of an integrated circuit device. The list is generated from operations performed in the design of the integrated circuit device. At least one of the plurality of metrology operations is performed on the integrated circuit device. A manufacturing process of the integrated circuit device may be adjusted responsive to results of the performing.
摘要翻译：使用多变量分析设计边际的目标生产控制。在生产集成电路设备期间访问多个度量操作的列表。该列表是从在集成电路设备的设计中执行的操作产生的。多个测量操作中的至少一个在集成电路器件上执行。可以根据执行结果来调整集成电路装置的制造过程。

8. 发明申请

US20120131527A1 TARGETED PRODUCTION CONTROL USING MULTIVARIATE ANALYSIS OF DESIGN MARGINALITIES 有权
标题翻译：使用设计市场的多元分析进行有针对性的生产控制
公开(公告)号：US20120131527A1
公开(公告)日：2012-05-24
申请号：US13023049
申请日：2011-02-08
申请人： Sagar Kekare
发明人： Sagar Kekare
IPC分类号： G06F17/50
CPC分类号： H01L22/20 , G01R31/2894 , G06F2217/12 , G06F2217/14 , Y02P90/265
摘要： Targeted production control using multivariate analysis of design marginalities. A list of a plurality of metrology operations is accessed during production of an integrated circuit device. The list is generated from operations performed in the design of the integrated circuit device. At least one of the plurality of metrology operations is performed on the integrated circuit device. A manufacturing process of the integrated circuit device may be adjusted responsive to results of the performing.
摘要翻译：使用多变量分析设计边际的目标生产控制。在生产集成电路设备期间访问多个度量操作的列表。该列表是从在集成电路设备的设计中执行的操作产生的。多个测量操作中的至少一个在集成电路器件上执行。可以根据执行结果来调整集成电路装置的制造过程。

9. 发明申请

US20070035728A1 Methods and systems for detecting defects in a reticle design pattern 有权
标题翻译：用于检测标线设计图案中的缺陷的方法和系统
公开(公告)号：US20070035728A1
公开(公告)日：2007-02-15
申请号：US11314813
申请日：2005-12-20
申请人： Sagar Kekare , Ingrid Peterson , Moshe Preil
发明人： Sagar Kekare , Ingrid Peterson , Moshe Preil
IPC分类号： G01N21/88
CPC分类号： G01N21/95607 , G03F1/84
摘要： Computer-implemented methods and systems for detecting defects in a reticle design pattern are provided. One computer-implemented method includes acquiring images of a field in the reticle design pattern. The images illustrate how the field will be printed on a wafer at different values of one or more parameters of a wafer printing process. The field includes a first die and a second die. The method also includes detecting defects in the field based on a comparison of two or more of the images corresponding to two or more of the different values. In addition, the method includes determining if individual defects located in the first die have substantially the same within die position as individual defects located in the second die.
摘要翻译：提供了用于检测标线设计图案中的缺陷的计算机实现的方法和系统。一种计算机实现的方法包括获取标线设计图案中的场的图像。这些图像示出了如何以晶片印刷过程的一个或多个参数的不同值将晶片印刷在晶片上。该领域包括第一模具和第二模具。该方法还包括基于对应于两个或多个不同值的两个或更多个图像的比较来检测场中的缺陷。另外，该方法包括确定位于第一管芯中的各个缺陷是否位于与位于第二管芯内的各个缺陷的管芯位置内基本相同的位置。

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