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    • 5. 发明授权
    • Substrate holder for MOCVD
    • MOCVD基板支架
    • US5782979A
    • 1998-07-21
    • US489773
    • 1995-06-13
    • Nobuaki KanenoHirotaka KizukiMasayoshi TakemiKenzo Mori
    • Nobuaki KanenoHirotaka KizukiMasayoshi TakemiKenzo Mori
    • H01L21/205C23C16/30C23C16/458C30B25/02C30B25/12H01L21/683H01S5/00C23C16/00
    • C30B25/02C23C16/301C23C16/4581C30B25/12C30B29/40
    • A substrate holder employed for MOCVD and supporting a wafer on which crystal growth proceeds includes a molybdenum holder body, a GaAs polycrystalline film with a flat surface grown on a part of the surface of the molybdenum holder body where the wafer is absent, and an InP polycrystalline film grown on the GaAs polycrystalline film. Each of the polycrystalline films is grown to a thickness of 0.3 .mu.m or more at a temperature higher than the epitaxial growth temperature of 575.degree. C. During the MOCVD process, the emissivity of the molybdenum substrate holder is stable at a value near the emissivity of the wafer on the substrate holder and, therefore, the decomposition ratio of PH.sub.3 gas on the substrate holder is stable at a value near the decomposition ratio on the wafer, whereby any variation of the incorporation ratio of P atoms in the grown InGaAsP, i.e., a variation of the composition of the InGaAsP, is reduced and run-to-run variations of the composition of the grown crystal are reduced.
    • 用于MOCVD并支撑晶体生长所进行的晶片的衬底保持器包括钼保持器主体,在不存在晶片的钼保持器主体的表面的一部分上生长的具有平坦表面的GaAs多晶膜,以及InP 在GaAs多晶膜上生长的多晶膜。 在比575℃的外延生长温度高的温度下,将多晶膜生长至0.3μm以上的厚度。在MOCVD工艺中,钼基板保持器的发射率在发射率附近稳定 因此衬底保持器上的PH3气体的分解比例在晶片分解比附近稳定,因此生长的InGaAsP中P原子的掺入比例,即 ,InGaAsP的组成的变化减小,并且生长晶体的组成的运行变化减小。
    • 6. 发明授权
    • Semiconductor laser
    • 半导体激光器
    • US5173913A
    • 1992-12-22
    • US719036
    • 1991-06-21
    • Nobuaki Kaneno
    • Nobuaki Kaneno
    • H01S5/00H01S5/223H01S5/24
    • H01S5/2232H01S5/2234H01S5/2237H01S5/24
    • A semiconductor laser having a double heterojunction structure includes a first semiconductor cladding layer having a stripe-shaped groove, a semiconductor active layer disposed on the cladding layer and having an energy band gap narrower than that of the cladding layer, and a second semiconductor cladding layer disposed on the active layer and having an energy band gap wider than that of the active layer. The thickness of the active layer in the groove is larger than the thickness of the active layer outside the groove and the shape of the active layer has the shape of the groove. The thickness of the active layer is largest in the bottom of the groove and gradually becomes smaller toward the edges of the groove. The semiconductor laser can output a laser beam having nearly a circular cross-section at a low threshold current and is easily fabricated.
    • 具有双异质结结构的半导体激光器包括具有条形槽的第一半导体包覆层,设置在包层上的半导体有源层,具有比包层更窄的能带隙,以及第二半导体包覆层 设置在有源层上并且具有比有源层宽的能带隙。 沟槽中有源层的厚度大于沟槽外的有源层的厚度,有源层的形状具有沟槽的形状。 有源层的厚度在槽的底部最大,并且朝向槽的边缘逐渐变小。 半导体激光器可以以低阈值电流输出具有近似圆形横截面的激光束并且容易地制造。
    • 9. 发明授权
    • Method and apparatus for evaporating a liquid organic metal
    • 蒸发液体有机金属的方法和装置
    • US4591464A
    • 1986-05-27
    • US671987
    • 1984-11-15
    • Nobuaki KanenoKazuhisa Takahashi
    • Nobuaki KanenoKazuhisa Takahashi
    • B01D1/14B01J7/02C23C16/448H01L21/205B01F3/04
    • B01D1/14C23C16/4482
    • A bubbling evaporator comprises: a vessel (11); a partition plate (11a) for dividing the vessel (11) into an upper chamber (11b) for temporarily storing carrier gas and a lower chamber (11c) for containing liquid (2); an inlet pipe (12 or 14) for making the carrier gas blow from the upper chamber (11b) into the liquid (2) in the lower chamber (11c) through the partition plate (11a) to bubble and evaporate the liquid (2); and an outlet pipe (13) for leading the evaporated vapor together with the carrier gas to the exterior of the vessel (11). Thus, backflow of the liquid (2) to the exterior of the vessel (11) can be prevented and stable pressure of the evaporated vapor can be obtained. A method of evaporating a liquid organic metal to be used in a vapor deposition process for manufacturing semiconductor devices and the like is also disclosed.
    • 鼓泡蒸发器包括:容器(11); 用于将容器(11)分成用于临时储存载气的上室(11b)和用于容纳液体(2)的下室(11c))的隔板(11a) 用于使载气从上室(11b)通过分隔板(11a)吹入下室(11c)中的液体(2)中的入口管(12或14)气泡并蒸发液体(2) ; 以及用于将蒸发的蒸气与载气一起引导到容器(11)的外部的出口管(13)。 因此,可以防止液体(2)回流到容器(11)的外部,并且可以获得稳定的蒸发蒸汽的压力。 还公开了一种蒸发用于制造半导体器件等的气相沉积工艺中的液体有机金属的方法。
    • 10. 发明授权
    • Method for producing a semiconductor laser device
    • 半导体激光装置的制造方法
    • US5192711A
    • 1993-03-09
    • US822662
    • 1992-01-21
    • Takashi MurakamiNobuaki Kaneno
    • Takashi MurakamiNobuaki Kaneno
    • H01S5/042H01S5/223H01S5/32H01S5/323
    • H01S5/0421H01S5/2231H01S5/321H01S5/32325Y10S438/936
    • A visible light semiconductor laser device has a double heterojunction structure comprising AlGaInP series semiconductors which is produced on a substrate having an electrode on its rear surface. A a p type GaInP buffer layer is provided between a p type GaAs contact layer and a p type AlGaInP cladding layer. The buffer layer has a constant composition ratio and the energy band gap is smaller at the side of the p type GaAs contact layer than at the p type AlGaInP cladding layer. Thus, an energy band discontinuity between the p type GaAs contact layer and the p type AlGaInP cladding layer are relaxed for operation of the laser at low voltage. The laser is produced by varying the growth conditions, such as temperature or V/III ratio during growth, of the buffer layer to vary the energy band gap within the buffer layer.
    • 可见光半导体激光器件具有包含AlGaInP系列半导体的双异质结结构,其在其后表面上具有电极的基板上制造。 在p型GaAs接触层和p型AlGaInP包层之间设置p型GaInP缓冲层。 缓冲层具有恒定的组成比,并且p型GaAs接触层侧的能带隙比在p型AlGaInP包覆层处的能带隙更小。 因此,p型GaAs接触层和p型AlGaInP包层之间的能带不连续性被放宽,以在低电压下操作激光器。 通过改变缓冲层中的生长条件,例如生长期间的温度或V / III比,来产生激光,以改变缓冲层内的能带隙。