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    • 8. 发明授权
    • Light receiving element and light receiving device incorporating circuit and optical disk drive
    • 光接收元件和光接收装置并入电路和光盘驱动器
    • US07307326B2
    • 2007-12-11
    • US10499357
    • 2002-12-10
    • Shigeki HayashidaTatsuya MoriokaYoshihiko TaniIsamu OhkuboHideo Wada
    • Shigeki HayashidaTatsuya MoriokaYoshihiko TaniIsamu OhkuboHideo Wada
    • H01L31/00H01L31/0232
    • H01L31/103H01L31/02161
    • A light receiving device includes a silicon substrate, a first P type diffusion layer on the silicon substrate, and a P type semiconductor layer on the P type diffusion layer. On a surface part of the P type semiconductor layer, two N type diffusion layers as light receiving parts, and a second P type diffusion layer between the two N type diffusion layers are provided. On the P type semiconductor layer, an antireflection film structure composed of a first silicon oxide formed by thermal oxidation and a second silicon oxide formed by CVD is provided. A film thickness of the first silicon oxide is set at about 15 nm, thus a defect in a interface between the first silicon oxide and the P type semiconductor layer is prevented. A film thickness of the second silicon oxide is set at about 100 nm, thus a leak current between cathodes is prevented when a power supply voltage is applied for long period of time.
    • 光接收装置包括硅衬底,硅衬底上的第一P型扩散层和P型扩散层上的P型半导体层。 在P型半导体层的表面部分设置有作为光接收部的两个N型扩散层和在两个N型扩散层之间的第二P型扩散层。 在P型半导体层上,提供了由通过热氧化形成的第一氧化硅和通过CVD形成的第二氧化硅构成的抗反射膜结构。 第一氧化硅的膜厚设定为约15nm,因此防止了第一氧化硅与P型半导体层之间的界面的缺陷。 第二氧化硅的膜厚设定为约100nm,因此长时间施加电源电压时,能够防止阴极之间的漏电流。