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    • 1. 发明授权
    • Exposure mask and method and apparatus for manufacturing the same
    • 曝光掩模及其制造方法和装置
    • US5629115A
    • 1997-05-13
    • US583857
    • 1996-01-11
    • Kenji KawanoShinichi ItoIwao HigashikawaMasamitsu ItohTakashi KamoHiroaki HazamaTakayuki Iwamatsu
    • Kenji KawanoShinichi ItoIwao HigashikawaMasamitsu ItohTakashi KamoHiroaki HazamaTakayuki Iwamatsu
    • G03F1/32G03F1/68G03F9/00
    • G03F1/32G03F1/68
    • This invention provides an exposure mask including a translucent film formed on a light-transmitting substrate and having a mask pattern, and a stabilized region formed in the boundary between the light-transmitting substrate and the translucent film or on at least the surface of the translucent film to prevent variations in physical properties of the translucent film. In addition, this invention provides a method of manufacturing an exposure mask, including the steps of forming a translucent film on a light-transmitting substrate, forming a photosensitive resin film on the translucent film, forming a photosensitive resin pattern by exposing the photosensitive resin film to a radiation or a charged particle beam, removing an exposed portion of the translucent film by using the photosensitive resin pattern as a mask, removing the photosensitive resin pattern, and forming a stabilized region in the boundary between the light-transmitting substrate and the translucent film or on at least the surface of the translucent film before the step of forming the photosensitive resin film or after the step of forming the photosensitive resin pattern. Also, this invention provides an apparatus for manufacturing an exposure mask, including a light source for radiating light containing at least an exposure wavelength onto a translucent film formed on a light-transmitting substrate, a photodetecting unit for detecting light emitted from the light source and transmitted through or reflected by the translucent film, and a measuring unit for measuring the characteristic of the translucent film from the light detected by the photodetecting unit.
    • 本发明提供一种曝光掩模,其包括形成在透光基板上并具有掩模图案的半透明膜,以及形成在透光基板和半透膜之间的边界中的至少半透明的表面的稳定区域 膜以防止半透明膜的物理性质的变化。 此外,本发明提供一种制造曝光掩模的方法,包括以下步骤:在透光性基板上形成半透膜,在半透膜上形成感光性树脂膜,通过使感光性树脂膜曝光,形成感光性树脂图案 通过使用感光性树脂图案作为掩模去除透光性膜的露出部分,除去感光性树脂图案,在透光性基板与透光性的界面之间形成稳定区域 或在形成感光性树脂膜的步骤之前或在形成感光性树脂图案的步骤之后,至少在半透明膜的表面上。 另外,本发明提供了一种用于制造曝光掩模的装置,包括用于将至少包含曝光波长的光发射到形成在透光基板上的半透明膜上的光源,用于检测从光源发射的光的光电检测单元和 通过透光膜透射或反射,以及测量单元,用于根据由光检测单元检测到的光来测量半透膜的特性。
    • 2. 发明授权
    • Exposure mask and method and apparatus for manufacturing the same
    • 曝光掩模及其制造方法和装置
    • US5907393A
    • 1999-05-25
    • US729592
    • 1996-10-11
    • Kenji KawanoShinichi ItoIwao HigashikawaMasamitsu ItohTakashi KamoHiroaki HazamaTakayuki Iwamatsu
    • Kenji KawanoShinichi ItoIwao HigashikawaMasamitsu ItohTakashi KamoHiroaki HazamaTakayuki Iwamatsu
    • G03F1/32G03F1/68G01N21/00
    • G03F1/32G03F1/68
    • This invention provides an exposure mask including a translucent film formed on a light-transmitting substrate and having a mask pattern, and a stabilized region formed in the boundary between the light-transmitting substrate and the translucent film or on at least the surface of the translucent film to prevent variations in physical properties of the translucent film. In addition, this invention provides a method of manufacturing an exposure mask, including the steps of forming a translucent film on a light-transmitting substrate, forming a photosensitive resin film on the translucent film, forming a photosensitive resin pattern by exposing the photosensitive resin film to a radiation or a charged particle beam, removing an exposed portion of the translucent film by using the photosensitive resin pattern as a mask, removing the photosensitive resin pattern, and forming a stabilized region in the boundary between the light-transmitting substrate and the translucent film or on at least the surface of the translucent film before the step of forming the photosensitive resin film or after the step of forming the photosensitive resin pattern. Also, this invention provides an apparatus for manufacturing an exposure mask, including a light source for radiating light containing at least an exposure wavelength onto a translucent film formed on a light-transmitting substrate, a photodetecting unit for detecting light emitted from the light source and transmitted through or reflected by the translucent film, and a measuring unit for measuring the characteristic of the translucent film from the light detected by the photodetecting unit.
    • 本发明提供一种曝光掩模,其包括形成在透光基板上并具有掩模图案的半透明膜,以及形成在透光基板和半透膜之间的边界中的至少半透明的表面的稳定区域 膜以防止半透明膜的物理性质的变化。 此外,本发明提供一种制造曝光掩模的方法,包括以下步骤:在透光性基板上形成半透膜,在半透膜上形成感光性树脂膜,通过使感光性树脂膜曝光,形成感光性树脂图案 通过使用感光性树脂图案作为掩模去除透光性膜的露出部分,除去感光性树脂图案,在透光性基板与透光性的界面之间形成稳定区域 或在形成感光性树脂膜的步骤之前或在形成感光性树脂图案的步骤之后,至少在半透明膜的表面上。 另外,本发明提供了一种用于制造曝光掩模的装置,包括用于将至少包含曝光波长的光发射到形成在透光基板上的半透明膜上的光源,用于检测从光源发射的光的光电检测单元和 通过透光膜透射或反射,以及测量单元,用于根据由光检测单元检测到的光来测量半透膜的特性。
    • 3. 发明授权
    • Exposure mask and method and apparatus for manufacturing the same
    • 曝光掩模及其制造方法和装置
    • US5728494A
    • 1998-03-17
    • US730017
    • 1996-10-11
    • Kenji KawanoShinichi ItoIwao HigashikawaMasamitsu ItohTakashi KamoHiroaki HazamaTakayuki Iwamatsu
    • Kenji KawanoShinichi ItoIwao HigashikawaMasamitsu ItohTakashi KamoHiroaki HazamaTakayuki Iwamatsu
    • G03F1/32G03F1/68G03F9/00
    • G03F1/32G03F1/68
    • This invention provides an exposure mask including a translucent film formed on a light-transmitting substrate and having a mask pattern, and a stabilized region formed in the boundary between the light-transmitting substrate and the translucent film or on at least the surface of the translucent film to prevent variations in physical properties of the translucent film. In addition, this invention provides a method of manufacturing an exposure mask, including the steps of forming a translucent film on a light-transmitting substrate, forming a photosensitive resin film on the translucent film, forming a photosensitive resin pattern by exposing the photosensitive resin film to a radiation or a charged particle beam, removing an exposed portion of the translucent film by using the photosensitive resin pattern as a mask, removing the photosensitive resin pattern, and forming a stabilized region in the boundary between the light-transmitting substrate and the translucent film or on at least the surface of the translucent film before the step of forming the photo-sensitive resin film or after the step of forming the photosensitive resin pattern. Also, this invention provides an apparatus for manufacturing an exposure mask.
    • 本发明提供一种曝光掩模,其包括形成在透光基板上并具有掩模图案的半透明膜,以及形成在透光基板和半透膜之间的边界中的至少半透明的表面的稳定区域 膜以防止半透明膜的物理性质的变化。 此外,本发明提供一种制造曝光掩模的方法,包括以下步骤:在透光性基板上形成半透膜,在半透膜上形成感光性树脂膜,通过使感光性树脂膜曝光,形成感光性树脂图案 通过使用感光性树脂图案作为掩模去除透光性膜的露出部分,除去感光性树脂图案,在透光性基板与透光性的界面之间形成稳定区域 或在形成感光树脂膜的步骤之前或在形成感光性树脂图案的步骤之后,至少在半透明膜的表面上。 此外,本发明提供了一种用于制造曝光掩模的装置。
    • 9. 发明授权
    • Pattern forming method and pattern forming apparatus
    • 图案形成方法和图案形成装置
    • US06806941B2
    • 2004-10-19
    • US10006133
    • 2001-12-10
    • Soichi InoueIwao HigashikawaYoji OgawaShigehiro HaraKazuko Yamamoto
    • Soichi InoueIwao HigashikawaYoji OgawaShigehiro HaraKazuko Yamamoto
    • G03B2742
    • G03F7/70425
    • A method of forming a pattern for a semiconductor device comprises the steps of forming a photosensitive film on a substrate and radiating the photosensitive film on the substrate with a beam of a predetermined shape consisting of one of a charged particle beam and an electromagnetic beam, thereby forming an exposed region of a desired shape, the latter step including the step of exposing each of unit regions by a single shot of the beam of the predetermined shape for a predetermined period of time, repeating the exposure a plurality of times, and butt-joining the exposed unit regions to thereby form the exposed region of the desired shape, wherein, in the step of forming the exposed region of the desired shape, butting portions of the unit regions are situated in a first area of a layer to be formed other than a second area in the layer in which predetermined characteristics of a function of the semiconductor device are determined by a pattern width of the exposed region in association with another pattern formed in another layer.
    • 一种形成半导体器件的图案的方法包括以下步骤:在基片上形成感光膜,并用由带电粒子束和电磁束之一构成的预定形状的光束将光敏膜照射在基片上,由此 形成期望形状的曝光区域,后一步骤包括通过预定时间段的光束的单次曝光曝光每个单元区域的步骤,重复曝光多次, 接合曝光的单元区域,从而形成所需形状的曝光区域,其中在形成所需形状的曝光区域的步骤中,单元区域的对接部分位于待形成的层的第一区域中 比在半导体器件的功能的预定特性由相关联中的暴露区域的图案宽度确定的层中的第二区域 n在另一层中形成另一图案。
    • 10. 发明授权
    • Exposure method utilizing partial exposure stitch area
    • 曝光方法采用部分曝光针迹区域
    • US06333138B1
    • 2001-12-25
    • US09520631
    • 2000-03-07
    • Iwao HigashikawaTakayuki Abe
    • Iwao HigashikawaTakayuki Abe
    • G03C500
    • B82Y10/00B82Y40/00G03F7/70441G03F7/70475H01J37/3174H01J2237/31764Y10S430/143
    • An exposure method of sequential beam, contributing to the improvement of alignment accuracy at connecting portion at the end part of an exposure region, as well as pattern dimension accuracy is provided. The method comprises the steps of dividing an area to be exposed into a plurality of fields each being determined by the deflection width of the main deflector, dividing each field into a plurality of sub-fields each being determined by the deflection width of the sub-deflector, applying a sequential exposure process to each field by using a variable shaped electron beam, and applying a multiple exposure process to an area where adjacent fields overlap each other, wherein the multiple exposure process is conducted in the area in units of sub-field, the exposure dose at each of exposure unit is determined such that the total exposure dosage in the area subject to the multiple exposure process is set equal to an exposure dosage used when single exposure process is applied, the exposure dosage in the area subject to multiple exposure process is decreased in steps, in the direction perpendicular to the longitudinal direction of the boundary portion from the outer edge of the field towards the outside of the field, an exposure dosage in the area subject to the multiple exposure process is determined using the minimum exposure dosage available in the exposure apparatus as the lower limit.
    • 提供顺序光束的曝光方法,有助于提高曝光区域的端部的连接部分的对准精度以及图案尺寸精度。 该方法包括以下步骤:将要暴露的区域划分为多个场,每个场由主偏转器的偏转宽度确定,将每个场分成多个子场,每个子场由子场的偏转宽度确定, 偏转器,通过使用可变形的电子束对每个场施加顺序曝光处理,以及对相邻场相互重叠的区域施加多次曝光处理,其中在该区域中以子场为单位进行多次曝光处理 确定每个曝光单元的曝光剂量,使得经受多次曝光处理的区域中的总曝光剂量设定为等于施加单次曝光处理时使用的曝光剂量,在多个区域内的曝光剂量 曝光过程在从场的外边缘朝向与边界部分的纵向方向垂直的方向上逐步减小 使用曝光装置中可获得的最小曝光剂量作为下限来确定在多次曝光处理区域内的曝光剂量。