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1. 发明授权

US5841291A Exchangeable membrane probe testing of circuits 失效
标题翻译：电路可交换膜探针测试
公开(公告)号：US5841291A
公开(公告)日：1998-11-24
申请号：US764511
申请日：1996-12-12
申请人： Ken Kuang-Fu Liu , Byoung-Youl Min , Robert John Moti , Syed A. Husain
发明人： Ken Kuang-Fu Liu , Byoung-Youl Min , Robert John Moti , Syed A. Husain
IPC分类号： G01R1/073 , H01L21/66 , G01R31/02
CPC分类号： G01R1/0735
摘要： First and second bumps electrically connected at first and second positions along a conductive run borne by a flexible substrate are respectively oriented for contact with a pad of a die under test and a pad of a tester structure. Second and third conductive regions are electrically connected respectively to the power and ground terminals of a power source and an electrical device. The second and third regions are spaced from a first conductive region to filter high-frequency noise components from power and ground potentials provided by the power source.
摘要翻译：沿着沿着由柔性基板传导的导电的第一和第二位置电连接的第一和第二凸起分别被定向成与被测试的模具的焊盘和测试器结构的焊盘接触。第二和第三导电区域分别电连接到电源和电气设备的电源和接地端子。第二和第三区域与第一导电区域间隔开，以将高频噪声分量与由电源提供的功率和地电位进行滤波。

2. 发明授权

US5847571A Membrane probing of circuits 失效
标题翻译：电路膜探测
公开(公告)号：US5847571A
公开(公告)日：1998-12-08
申请号：US675416
申请日：1996-07-03
申请人： Ken Kuang-Fu Liu , Byoung-Youl Min , Kunio Sano , Takashi Sato
发明人： Ken Kuang-Fu Liu , Byoung-Youl Min , Kunio Sano , Takashi Sato
IPC分类号： G01R1/073 , H01L21/66
CPC分类号： G01R1/0735
摘要： First and second bumps electrically connected at first and second positions along a conductive run borne by a flexible substrate are respectively oriented for contact with a pad of a die under test and a pad of a tester. A probe frame is bonded to the substrate between connector frames bonded at opposite ends of the substrate. Alternatively, a pair of bumps exposed on the same surface of a flexible substrate are electrically connected at different positions along a conductive run. One of the bumps is oriented for contact with a pad of a die under test, and the other is in contact with a pad on a surface of a printed circuit board directed away from the die. The pad of the printed circuit board is provided for electrical connection to a tester.
摘要翻译：沿着沿着由柔性基板传导的导体的第一和第二位置电连接的第一和第二凸起分别被定向成与被测试模具的焊盘和测试仪的焊盘接触。探针架结合在衬底的相对两端的连接器框架之间的基片上。或者，暴露在柔性基板的相同表面上的一对凸块在导电性行程的不同位置电连接。凸块中的一个被定向成与待测试的模具的焊盘接触，另一个与印刷电路板的远离模具的表面上的焊盘接触。印刷电路板的焊盘被提供用于电连接到测试仪。

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