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    • 4. 发明授权
    • Method for low pressure rinsing and drying in a process chamber
    • 在处理室中低压冲洗和干燥的方法
    • US5273589A
    • 1993-12-28
    • US911408
    • 1992-07-10
    • Bradley L. GriswoldSyed A. Husain
    • Bradley L. GriswoldSyed A. Husain
    • B08B3/10F26B3/00F26B5/04H01L21/00H01L21/306B08B3/00
    • H01L21/02043B08B3/10F26B3/00F26B5/04H01L21/67028Y10S134/902
    • An embodiment of the present invention is a system for rinsing and drying items comprising a process chamber for receiving the items; a rinse condenser; a first heater; a vaporizer for vaporizing water and including a second heater; a vacuum system for reducing the pressure within the process chamber; and a valving apparatus for independently coupling the process chamber to the vaporizer and the process chamber to the vacuum system. A controller sequences the first and second heaters and the valving apparatus such that the pressure within the process chamber is substantially reduced below atmospheric pressure, the rinse condenser is turned on, water is introduced to the vaporizer which is turned to water vapor by turning the second heater on, the water vapor is circulated to the process chamber, the water vapor is condensed on the items and the rinse condenser, the condensate water is allowed to rain on the items, the water condensate is returned from the process chamber to the vaporizer, the process chamber is isolated from the vaporizer, the rinse condenser is turned off, the first heater is turned on, the vacuum system operates to remove water vapor from the process chamber, and atmospheric pressure is restored to the process chamber when the items are dry of water.
    • 本发明的一个实施例是一种用于冲洗和干燥物品的系统,包括用于接收物品的处理室; 冲洗冷凝器; 第一个加热器 用于蒸发水并包括第二加热器的蒸发器; 用于减小处理室内的压力的真空系统; 以及用于将处理室独立地连接到蒸发器和处理室到真空系统的阀装置。 控制器对第一和第二加热器和阀装置进行排序,使得处理室内的压力基本上降低到大气压以下,冲洗冷凝器打开,水通过转动第二个 加热器上,水蒸汽循环到处理室,水蒸汽在物品和冲洗冷凝器上冷凝,冷凝水被允许在物品上下雨,水冷凝物从处理室返回到蒸发器, 处理室与蒸发器隔离,冲洗冷凝器关闭,第一加热器打开,真空系统操作以从处理室中除去水蒸汽,当物品干燥时大气压力恢复到处理室 的水。
    • 5. 发明授权
    • Dry contact electroplating apparatus
    • 干式电镀设备
    • US5227041A
    • 1993-07-13
    • US898038
    • 1992-06-12
    • Bruce N. BrogdenLeon P. BrownSyed A. Husain
    • Bruce N. BrogdenLeon P. BrownSyed A. Husain
    • C25D7/12H01L21/00H01L21/687
    • H01L21/67126C25D17/001C25D7/12H01L21/68785
    • A dry contact electroplating structure is disclosed. The structure includes a base member for immersion within an electroplating solution. The base member has a central aperture defined by an aperture perimeter formed within the base member. A sealing ring is positioned adjacent to the aperture perimeter. The sealing ring forms a sealing connection with an object to be electroplated. A number of electrical contacts are positioned adjacent to the sealing ring. The electrical contacts form an electrical connection with one side of the object to be electroplated. A lid is positioned on the base member over one side of the central aperture. Thus, the lid protects the electrical contacts and one side of the object to be electroplated, while the other side of the object is exposed to the electroplating solution.
    • 公开了一种干接触电镀结构。 该结构包括用于浸入电镀溶液中的基底构件。 基部构件具有由形成在基部构件内的孔周边限定的中心孔。 密封环邻近孔周边定位。 密封环与要电镀的物体形成密封连接。 多个电触点位于密封环附近。 电触点与要电镀的物体的一侧形成电连接。 盖子位于中心孔的一侧上的基座构件上。 因此,盖子保护电触头和要被电镀的物体的一侧,而物体的另一侧暴露于电镀溶液。