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    • 3. 发明授权
    • Semiconductor light emitting device with current spreading layer
    • 具有电流扩散层的半导体发光器件
    • US5600158A
    • 1997-02-04
    • US514628
    • 1995-08-14
    • Nobuhiko NotoKeizo AdomiTakao Takenaka
    • Nobuhiko NotoKeizo AdomiTakao Takenaka
    • H01L21/205H01L33/14H01L33/30H01L33/00
    • H01L33/14
    • A semiconductor light emitting device comprising an n-type GaAs substrate, a light emitting layer portion consisting of an AlGaInP double heterojunction structure formed on the substrate, and a p-type current spreading layer formed on the light emitting layer portion, wherein the p-type current spreading layer comprises an undoped current spreading layer and a heavily-doped current spreading layer formed on said undoped current spreading layer. With this construction, it is possible to achieve a stable control of carrier concentration in a p-type cladding layer, to prevent deterioration of the interface between the p-type cladding layer and an active layer and also to prevent crystallinty-deterioration of the active layer with the result that the emission intensity of the device can be increased to a considerable extent.
    • 一种半导体发光器件,包括n型GaAs衬底,由形成在衬底上的AlGaInP双异质结结构构成的发光层部分和形成在发光层部分上的p型电流扩散层, 型电流扩展层包括未掺杂电流扩展层和形成在所述未掺杂电流扩展层上的重掺杂电流扩散层。 通过这种结构,可以实现p型包覆层中的载流子浓度的稳定控制,以防止p型覆层与有源层之间的界面的劣化,并且防止活性物质的结晶劣化 从而可以在相当程度上增加器件的发光强度。
    • 5. 发明授权
    • Algainp light-emitting device
    • 阿根廷发光装置
    • US5739553A
    • 1998-04-14
    • US577961
    • 1995-12-26
    • Nobuhiko NotoKeizo AdomiTakao Takenaka
    • Nobuhiko NotoKeizo AdomiTakao Takenaka
    • H01L33/14H01L33/30H01L33/00
    • H01L33/30H01L33/14
    • The present invention provides an AlGaInP light-emitting device with a longer life and higher reliability. The AlGaInP light-emitting device comprises an n-type (Al.sub.0.7 Ga.sub.0.3).sub.0.51 In.sub.0.49 P cladding layer (about 1 .mu.m in thickness), an (Al.sub.0.15 Ga.sub.0.85).sub.0.51 In.sub.0.49 P active layer (about 0.6 .mu.m in thickness), a p-type (Al.sub.0.7 Ga.sub.0.3).sub.0.51 In.sub.0.49 P cladding layer (about 1 .mu.m in thickness), and a p-type current-spreading layer composed of either a p-type Al.sub.0.7 Ga.sub.0.3 As layer (about 3 .mu.m in thickness) or a p-type Al.sub.0.7 Ga.sub.0.3 As.sub.0.97 P.sub.0.03 layer (about 3 .mu.m in thickness) and a p-type GaAs.sub.0.5 P.sub.0.5 layer (about 7 .mu.m in thickness), in sequence formed on an n-type GaAs substrate, and further an upper surface electrode mounted on the p-type GaAs.sub.0.5 P.sub.0.5 layer and a lower surface electrode mounted on the lower surface of the n-type GaAs substrate.
    • 本发明提供一种具有更长寿命和更高可靠性的AlGaInP发光器件。 AlGaInP发光器件包括n型(Al0.7Ga0.3)0.51In0.49P包层(厚度约1μm),(Al0.15Ga0.85)0.51In0.49P有源层(约0.6 厚度为1μm),p型(Al0.7Ga0.3)0.51In0.49P包层(厚度约1μm)以及由p型Al0构成的p型电流扩展层。 (厚约3μm)或p型Al0.7Ga0.3As0.97P0.03层(约3μm厚)和p型GaAs0.5P0.5层(约7μm) m),依次形成在n型GaAs衬底上,另外安装在p型GaAs0.5P0.5层上的上表面电极和安装在n型GaAs的下表面上的下表面电极 基质。
    • 6. 发明授权
    • AlGaInP light emitting device
    • AlGaInP发光器件
    • US5444269A
    • 1995-08-22
    • US251370
    • 1994-05-31
    • Keizo AdomiNobuhiko NotoTakao Takenaka
    • Keizo AdomiNobuhiko NotoTakao Takenaka
    • H01L33/14H01L33/30H01L33/00
    • H01L33/14
    • An AlGaInP double heterojunction structure or an AlGaInP single heterojunction structure is formed on a first conductivity-type GaAs substrate, and then a layer made of a second conductivity-type Al.sub.w Ga.sub.1-w As.sub.1-v P.sub.v mixed crystal (Al.sub.0.7 Ga.sub.0.3 As.sub.0.97 P.sub.0.03, for example) which has the bandgap energy larger than the energy of photon emitted from the active layer of said light emitting layer portion, and has good lattice-matching with (Al.sub.B Ga.sub.1-B).sub.0.51 In.sub.0.49 P mixed crystal (layer) constituting said light emitting layer portion, is formed as a current spreading layer on top of said light emitting layer portion. Here, w and v are in the range of 0.45.ltoreq.w
    • 在第一导电型GaAs衬底上形成AlGaInP双异质结结构或AlGaInP单异质结结构,然后形成由第二导电型AlwGa1-wAs1-vPv混晶(Al0.7Ga0.3As0.97P0.03 具有比从所述发光层部分的有源层发射的光子能量大的带隙能量,并且与构成所述发光层部分的(AlBGa1-B)0.51In0.49P混晶(层)具有良好的晶格匹配 发光层部分形成为在所述发光层部分的顶部上的电流扩散层。 这里,w和v分别在0.45
    • 9. 发明授权
    • Method of making epitaxial wafers
    • 制造外延片的方法
    • US5362683A
    • 1994-11-08
    • US205558
    • 1994-03-04
    • Takao TakenakaMasahisa EndoMasato Yamada
    • Takao TakenakaMasahisa EndoMasato Yamada
    • C30B19/00H01L21/20H01L21/208H01L21/304H01L21/302
    • H01L21/304H01L21/02395H01L21/02463H01L21/02507H01L21/02546H01L21/02625H01L21/02628Y10S117/915
    • To manufacture epitaxial wafers with a smaller amount of semiconductor crystals at a lower cost by means of an efficient epitaxial growth process. An epitaxial wafer is made by forming, by means of epitaxial growth, GaAlAs layers with identical structures on both sides of a GaAs substrate wafer with the crystal plane orientation of {100}. The epitaxial wafer is then divided in the GaAs substrate wafer portion into two pieces to obtain two epitaxial wafers. To perform the epitaxial growth process, a plurality of GaAs substrate wafers are held at their edges and then the GaAs substrate wafers are placed in a Ga solution at prescribed spatial intervals. To divide the epitaxial wafer in the GaAs substrate portion into two pieces, the substrate wafer portion is cut parallel to the main surface. Or, the GaAs substrate wafer can also be removed by means of etching while the epitaxial wafer is rotated at a high speed in the etching solution.
    • 通过有效的外延生长工艺以更低的成本制造具有更少量的半导体晶体的外延晶片。 通过外延生长,通过在晶体平面取向为{100}的GaAs衬底晶片的两侧上形成具有相同结构的GaAlAs层来制造外延晶片。 然后将外延晶片在GaAs衬底晶片部分中分成两片,以获得两个外延晶片。 为了进行外延生长处理,将多个GaAs衬底晶片保持在其边缘,然后将GaAs衬底晶片以规定的空间间隔放置在Ga溶液中。 为了将GaAs衬底部分中的外延晶片分成两片,平行于主表面切割衬底晶片部分。 或者,也可以通过蚀刻去除GaAs衬底晶片,同时外延晶片在蚀刻溶液中以高速旋转。