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    • 5. 发明申请
    • Material for Formation of Resist Protection Film and Method of Forming Resist Pattern Therewith
    • 抗蚀剂保护膜形成材料及其形成方法
    • US20080311523A1
    • 2008-12-18
    • US11658900
    • 2005-07-29
    • Kotaro EndoMasaaki YoshidaKeita Ishizuka
    • Kotaro EndoMasaaki YoshidaKeita Ishizuka
    • G03F7/004G03F7/20
    • G03F7/2041G03F7/11
    • In the liquid immersion lithography process, by simultaneously preventing deterioration of a resist film and deterioration of an immersion liquid employed during liquid immersion lithography which uses various immersion liquids, including water, resistance to post exposure delay of the resist film can be improved without increasing the number of processes, thereby making it possible to form a high resolution resist pattern using liquid immersion lithography. Furthermore, it is possible to apply a high refractive index liquid immersion medium, used in combination with the high refractive index liquid immersion medium, thus making it possible to further improve pattern accuracy. Using a composition comprising an acrylic resin component having characteristics which have substantially no compatibility with a liquid in which a resist film is immersed, particularly water, and are also soluble in alkaline, a protective film is formed on the surface of a resist film used.
    • 在液浸光刻工艺中,通过同时防止抗蚀剂膜的劣化以及使用包括水在内的各种浸渍液体的液浸光刻中所使用的浸渍液的劣化,可以提高抗蚀剂膜的后曝光延迟性,而不会增加 处理次数,从而可以使用液浸光刻法形成高分辨率抗蚀剂图案。 此外,可以应用与高折射率浸液介质组合使用的高折射率液浸介质,从而可以进一步提高图案精度。 使用包含与浸渍有抗蚀剂膜的液体基本上不相容的特性的丙烯酸树脂组分的组合物,特别是水,并且也可溶于碱性,在所用的抗蚀剂膜的表面上形成保护膜。
    • 6. 发明授权
    • Material for formation of resist protection film and method of forming resist pattern therewith
    • 用于形成抗蚀剂保护膜的材料及其形成抗蚀剂图案的方法
    • US07879529B2
    • 2011-02-01
    • US11658900
    • 2005-07-29
    • Kotaro EndoMasaaki YoshidaKeita Ishizuka
    • Kotaro EndoMasaaki YoshidaKeita Ishizuka
    • G03F7/11G03F7/26C07D265/00C07D285/00
    • G03F7/2041G03F7/11
    • In the liquid immersion lithography process, by simultaneously preventing deterioration of a resist film and deterioration of an immersion liquid employed during liquid immersion lithography which uses various immersion liquids, including water, resistance to post exposure delay of the resist film can be improved without increasing the number of processes, thereby making it possible to form a high resolution resist pattern using liquid immersion lithography. Furthermore, it is possible to apply a high refractive index liquid immersion medium, used in combination with the high refractive index liquid immersion medium, thus making it possible to further improve pattern accuracy. Using a composition comprising an acrylic resin component having characteristics which have substantially no compatibility with a liquid in which a resist film is immersed, particularly water, and are also soluble in alkaline, a protective film is formed on the surface of a resist film used.
    • 在液浸光刻工艺中,通过同时防止抗蚀剂膜的劣化以及使用包括水在内的各种浸渍液体的液浸光刻中所使用的浸渍液的劣化,可以提高抗蚀剂膜的后曝光延迟性,而不会增加 处理次数,从而可以使用液浸光刻法形成高分辨率抗蚀剂图案。 此外,可以应用与高折射率浸液介质组合使用的高折射率液浸介质,从而可以进一步提高图案精度。 使用包含与浸渍有抗蚀剂膜的液体基本上不相容的特性的丙烯酸树脂组分的组合物,特别是水,并且也可溶于碱性,在所用的抗蚀剂膜的表面上形成保护膜。
    • 9. 发明申请
    • Photoresist composition and method for forming resist pattern using the same
    • 光刻胶组合物及其形成方法
    • US20060166130A1
    • 2006-07-27
    • US10547427
    • 2004-03-24
    • Toshiyuki OgataKotaro EndoHiromitsu TsujiMasaaki Yoshida
    • Toshiyuki OgataKotaro EndoHiromitsu TsujiMasaaki Yoshida
    • G03C1/76
    • G03F7/0046G03F7/0395Y10S430/108
    • A photoresist composition containing a polymer (A) containing an alkali-soluble constituent unit (a1) containing an alicyclic group having both a fluorine atom or a fluorinated alkyl group (i) and an alcoholic hydroxyl group (ii), whose alkali-solubility is changeable by an action of an acid; an acid generator (B) which generates an acid by light irradiation; and a dissolution inhibitor (C) having a fluorine atom(s) and/or a nitrogen-containing compound (D) selected from a tertiary amine (d1) having a polar group, a tertiary alkylamine (d2) having 7 or more and 15 or less of carbon atoms or an ammonium salt (d3). The composition has a resist property capable of accomplishing line and space (1:1) of 90 nm or less in good shape as a pattern processing accuracy of a semiconductor integrated circuit by lithography.
    • 1.一种光致抗蚀剂组合物,其含有含有具有氟原子或氟代烷基(i)和醇羟基(ii)的脂环族基团的碱溶性结构单元(a1)的聚合物(A),其碱溶性为 可以通过酸的作用而变化; 通过光照射产生酸的酸产生剂(B); 和具有氟原子的溶解抑制剂(C)和/或选自具有极性基团的叔胺(d1),具有7以上的叔烷基胺(d2)和15以上的含氮化合物(D) 或更少的碳原子或铵盐(d3)。 该组合物具有能够通过光刻作为半导体集成电路的图案处理精度而实现90nm或更小的线和空间(1:1)的良好形状的抗蚀剂性质。
    • 10. 发明授权
    • Photoresist composition and resist pattern formation method by the use thereof
    • 光刻胶组合物和抗蚀剂图案形成方法
    • US07700257B2
    • 2010-04-20
    • US10547427
    • 2004-03-24
    • Toshiyuki OgataKotaro EndoHiromitsu TsujiMasaaki Yoshida
    • Toshiyuki OgataKotaro EndoHiromitsu TsujiMasaaki Yoshida
    • G03F7/004G03F7/30
    • G03F7/0046G03F7/0395Y10S430/108
    • A photoresist composition containing a polymer (A) containing an alkali-soluble constituent unit (a1) containing an alicyclic group having both a fluorine atom or a fluorinated alkyl group (i) and an alcoholic hydroxyl group (ii), whose alkali-solubility is changeable by an action of an acid; an acid generator (B) which generates an acid by light irradiation; and a dissolution inhibitor (C) having a fluorine atom(s) and/or a nitrogen-containing compound (D) selected from a tertiary amine (d1) having a polar group, a tertiary alkylamine (d2) having 7 or more and 15 or less of carbon atoms or an ammonium salt (d3). The composition has a resist property capable of accomplishing line and space (1:1) of 90 nm or less in good shape as a pattern processing accuracy of a semiconductor integrated circuit by lithography.
    • 1.一种光致抗蚀剂组合物,其含有含有具有氟原子或氟代烷基(i)和醇羟基(ii)的脂环族基团的碱溶性结构单元(a1)的聚合物(A),其碱溶性为 可以通过酸的作用而变化; 通过光照射产生酸的酸产生剂(B); 和具有氟原子的溶解抑制剂(C)和/或选自具有极性基团的叔胺(d1),具有7以上的叔烷基胺(d2)和15以上的含氮化合物(D) 或更少的碳原子或铵盐(d3)。 该组合物具有能够通过光刻作为半导体集成电路的图案处理精度而实现90nm或更小的线和空间(1:1)的良好形状的抗蚀剂性质。