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    • 7. 发明授权
    • Nonvolatile semiconductor memory device and method for manufacturing the same
    • 非易失性半导体存储器件及其制造方法
    • US08035150B2
    • 2011-10-11
    • US11563417
    • 2006-11-27
    • Hiromasa Fujimoto
    • Hiromasa Fujimoto
    • H01L29/768H01L29/788
    • H01L27/115H01L27/11521
    • A memory cell array of a NOR type flash memory is constructed by arranging memory cell transistors in a matrix, each of the memory cell transistors includes a contact connecting a semiconductor substrate to an overlayer wire. Columns of the memory cell transistors are isolated from one another by shallow trench isolations. The height of top surface of a filling oxide film in the shallow trench isolation which is adjacent to each drain contact is equal to that of top surface of the drain region. The top surface of a filling oxide film in the shallow trench isolation which is adjacent to each channel region is higher than a top surface of the semiconductor substrate in the channel region.
    • NOR型闪速存储器的存储单元阵列是通过将存储单元晶体管布置在矩阵中而构成的,每个存储单元晶体管包括将半导体衬底连接到覆盖线的触点。 存储单元晶体管的列通过浅沟槽隔离彼此隔离。 与每个漏极接触相邻的浅沟槽隔离物中的填充氧化膜的顶表面的高度等于漏区的顶表面的高度。 与沟道区相邻的浅沟槽隔离中的填充氧化膜的顶面高于沟道区的半导体衬底的上表面。
    • 8. 发明授权
    • Semiconductor device and method for fabricating the same
    • 半导体装置及其制造方法
    • US06770517B2
    • 2004-08-03
    • US10028803
    • 2001-12-28
    • Hiroaki NakaokaHiromasa FujimotoAtsushi HoriTakashi UeharaTakehiro Hirai
    • Hiroaki NakaokaHiromasa FujimotoAtsushi HoriTakashi UeharaTakehiro Hirai
    • H01L2100
    • H01L29/78696H01L29/66772H01L29/78612H01L29/78621Y10S438/91
    • In a silicon layer formed on an insulator layer, a lattice defect region is formed to be adjacent to a channel region and source/drain regions, and the lower part of the channel region functions as a high-concentration channel region. The holes of hole-electron pairs generated in the channel region are eliminated by recombination in the lattice defect region, thereby suppressing the bipolar operation resulting from the accumulation of holes and increasing the source/drain breakdown voltage. The threshold value of a parasitic transistor is increased by the high-concentration channel region so as to reduce the leakage current in the OFF state. Alternatively, the holes may be moved to the source region to disappear therein by providing, instead of the lattice defect region, a high-concentration diffusion layer constituting and operating as a pn diode between the channel and source regions. Thus, it is possible to provide an SOI transistor causing no decrease in the source/drain breakdown voltage resulting from substrate floating effects and causing little OFF leakage current because of the activation of the parasitic transistor.
    • 在形成在绝缘体层上的硅层中,形成与沟道区域和源极/漏极区域相邻的晶格缺陷区域,沟道区域的下部部分作为高浓度沟道区域。 通过在晶格缺陷区域中的复合消除在沟道区域中产生的空穴 - 电子对的空穴,从而抑制由于空穴的积累而产生的双极性运算并增加源极/漏极击穿电压。 寄生晶体管的阈值由高浓度沟道区域增加,以便在OFF状态下减少漏电流。 或者,可以通过提供构成并在沟道和源极区域之间作为pn二极管工作的高浓度扩散层而不是晶格缺陷区域,而将孔移动到源极区域以消失。 因此,可以提供一种SOI晶体管,其不会由于衬底浮置效应而导致的源极/漏极击穿电压降低,并且由于寄生晶体管的激活而导致小的漏电流。