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    • 2. 发明授权
    • Method for manufacturing a semiconductor device and apparatus for manufacturing a semiconductor device
    • 半导体装置的制造方法以及半导体装置的制造装置
    • US07018932B2
    • 2006-03-28
    • US10377597
    • 2003-03-04
    • Shinichi ItoTatsuhiko HigashikiKatsuya OkumuraKenji KawanoSoichi Inoue
    • Shinichi ItoTatsuhiko HigashikiKatsuya OkumuraKenji KawanoSoichi Inoue
    • H01L21/027G03F9/00
    • G03F7/70625G03F7/70633G03F7/70641G03F7/70675H01J2237/30438
    • A method for manufacturing a semiconductor device including, forming a photosensitive-film on a substrate, carrying the substrate on which the photosensitive-film is formed, to an exposure device provided with a mask in which an on-mask-inspection-mark and an on-mask-device-pattern are formed, selectively exposing the photosensitive-film to light to transfer the on-mask-inspection-mark to the photosensitive-film to form a latent-image of the inspection-mark on the photosensitive-film, heating at least that area of the photosensitive-film in which the latent-image of the inspection-mark is formed, measuring the inspection-mark, changing set-values for the exposure device used for the selective exposure, on the basis of result of the measurement so that exposure conditions conform to the set-values, exposing the photosensitive-film on the basis of the changed set-values to transfer the on-mask-device-pattern to the photosensitive-film to form a latent image of the device-pattern on the photosensitive-film, heating an entire surface of the photosensitive-film, and developing the photosensitive-film.
    • 一种半导体器件的制造方法,其特征在于,在将基板上形成有感光膜的基板上形成感光膜的制造方法,设置在具有掩模检查标记和掩模检查标记的掩模的曝光装置 形成掩模装置图案,选择性地将感光膜曝光以将掩模检查标记转印到感光膜上,以在感光膜上形成检查标记的潜像, 至少加热其中形成有检查标记的潜像的感光膜的面积,测量检查标记,改变用于选择性曝光的曝光装置的设定值,基于 所述测量使得曝光条件符合设定值,基于改变的设定值曝光感光膜以将掩模设备图案转印到感光膜上以形成该设备的潜像 p图案在p 感光膜,加热感光膜的整个表面,并显影感光膜。
    • 3. 发明授权
    • Exposure dose measuring method and exposure dose measuring mask
    • 曝光剂量测量方法和曝光剂量测量面膜
    • US06251544B1
    • 2001-06-26
    • US09334941
    • 1999-06-17
    • Soichi InoueShinichi ItoKei Hayasaki
    • Soichi InoueShinichi ItoKei Hayasaki
    • G03F900
    • G03F7/70558G03F1/44
    • In an exposure dose measuring method for measuring an effective exposure dose on a wafer by printing mask patterns formed on a mask onto a resist coated on the wafer by exposure, each of the mask patterns has light transmitting sections and light shielding sections repeated in a period p, a ratio of areas of the light transmitting sections to areas of the light shielding sections of each of the mask patterns differs from ratios of those of the others of the mask patterns, and the period p is set so as to satisfy a relationship of p/M≦&lgr;/(1+&sgr;)NA, where an exposure light wavelength at the time of exposing the mask patterns is &lgr;, a numerical aperture at a wafer side is NA, an illumination coherence factor is &sgr;, and a mask pattern magnification for patterns to be formed on the wafer is M.
    • 在曝光剂量测量方法中,通过将掩模上形成的掩模图案通过曝光印刷在涂覆在晶片上的抗蚀剂上来测量晶片上的有效曝光剂量,每个掩模图案具有在一段时间内重复的透光部分和遮光部分 p,光透射部分的面积与每个掩模图案的遮光部分的面积的比率与其他掩模图案的比率的比率不同,并且周期p被设定为满足其中的关系 曝光掩模图案时的曝光光波长为羔羊,晶圆侧的数值孔径为NA,照度相干系数为西格玛,在晶片上形成的图案的掩模图案放大率为M.
    • 7. 发明授权
    • Control method for exposure apparatus and control method for semiconductor manufacturing apparatus
    • 半导体制造装置的曝光装置的控制方法和控制方法
    • US06376139B1
    • 2002-04-23
    • US09671502
    • 2000-09-27
    • Tadahito FujisawaSoichi InoueKenji KawanoShinichi ItoIchiro Mori
    • Tadahito FujisawaSoichi InoueKenji KawanoShinichi ItoIchiro Mori
    • G03F900
    • G03F7/70625G03F7/70633G03F7/70641
    • A control method for an exposure apparatus, in which an exposure amount and a focus value are set in transferring a circuit pattern on a mask onto a resist formed on a wafer by the exposure apparatus, includes the steps of arranging, on the mask, an exposure amount monitor mark and a focus monitor mark used to separately monitor the effective exposure amount and the focus value on the wafer, transferring the exposure amount monitor mark and the focus monitor mark onto the resist to form an exposure amount monitor pattern and a focus monitor pattern, measuring the states of the exposure amount monitor pattern and the focus monitor pattern at least at one of timings after exposure, after post exposure baking, during a cooling process after baking, during a process after cooling, during development, and after development, on the basis of the measurement results, calculating the difference between an optimum exposure amount value and an exposure amount set value set in the exposure apparatus and the difference between an optimum focus value and a focus set value set in the exposure apparatus in transferring the exposure amount monitor mark and the focus monitor mark onto the resist, and changing the focus set value and the exposure amount set value of the exposure apparatus in accordance with the calculated differences.
    • 一种曝光装置的控制方法,其中设置曝光量和聚焦值以将掩模上的电路图案转印到通过曝光装置在晶片上形成的抗蚀剂上的步骤包括以下步骤:在掩模上布置 曝光量监视标记和用于分别监视晶片上的有效曝光量和聚焦值的聚焦监视器标记,将曝光量监视标记和聚焦监视标记转印到抗蚀剂上以形成曝光量监视器图案和聚焦监视器 至少在曝光后的定时,曝光后烘烤,烧成后的冷却过程中,冷却后,显影处理和显影后的处理中,至少测定曝光量监视器图案和聚焦监视器图案的状态, 基于测量结果,计算最佳曝光量值与曝光设定中设定的曝光量设定值之间的差 以及将曝光量监视标记和聚焦监视标记转印到抗蚀剂上的曝光装置中设置的最佳聚焦值和聚焦设定值之间的差异,并且改变曝光的聚焦设定值和曝光量设定值 仪器按照计算出的差异。