专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

1. 发明授权

US07420807B2 Cooling device for electronic apparatus 失效
标题翻译：电子设备冷却装置
公开(公告)号：US07420807B2
公开(公告)日：2008-09-02
申请号：US10524770
申请日：2003-08-18
申请人： Kazuyuki Mikubo , Sakae Kitajo , Yasuhiro Sasaki , Atsushi Ochi , Mitsuru Yamamoto
发明人： Kazuyuki Mikubo , Sakae Kitajo , Yasuhiro Sasaki , Atsushi Ochi , Mitsuru Yamamoto
IPC分类号： H05K7/20
CPC分类号： H01L23/473 , G06F1/20 , H01L23/467 , H01L2924/0002 , H01L2924/00
摘要： The present invention provides a cooling apparatus which is easy to build and to fix it to electronic devices, superior in thermal conduction and heat dissipation, and possible to make thin the total configuration of the apparatus. The liquid cooling unit 9 and the air cooling unit 12 are formed in a unit. A heat absorption surface 19 of the liquid cooling unit 9 is contacted or bonded to the heat generation component such as the CPU and the heat generator, which have the largest power consumption and also locally generate heat within a small area in the box 2. In the liquid cooling unit 9, a liquid cooling pump 14 composed of an electromagnetic pump is arranged for circulating the coolant in the flow path 10. The heat generated by the heat generation components such as CPU 6, heat generator 7, and the like is thermally diffused with heat conduction into the whole liquid cooling unit 9 by circulating the coolant with the liquid cooling pump 14.
摘要翻译：本发明提供了一种易于构建并将其固定在电子设备上的散热装置，其热传导和散热优良，并且可以使装置的总体构型变薄。液体冷却单元9和空气冷却单元12形成为一个单元。液体冷却单元9的吸热表面19接触或结合到具有最大功率消耗的CPU和热发生器等发热组件，并且还在箱体2的小区域内局部地产生热量。在液体冷却单元9中，布置有由电磁泵组成的液体冷却泵14，用于使冷却剂在流路10中循环。由CPU 6，发热体7等发热部件产生的热量，通过使冷却液与液体冷却泵14循环，热传导到整个液体冷却单元9。

2. 发明申请

US20050231914A1 Cooling device for electronic apparatus 失效
标题翻译：电子设备冷却装置
公开(公告)号：US20050231914A1
公开(公告)日：2005-10-20
申请号：US10524770
申请日：2003-08-18
申请人： Kazuyuki Mikubo , Sakae Kitajo , Yasuhiro Sasaki , Atsushi Ochi , Mitsuru Yamamoto
发明人： Kazuyuki Mikubo , Sakae Kitajo , Yasuhiro Sasaki , Atsushi Ochi , Mitsuru Yamamoto
IPC分类号： G06F1/20 , H01L23/467 , H01L23/473 , H05K7/20
CPC分类号： H01L23/473 , G06F1/20 , H01L23/467 , H01L2924/0002 , H01L2924/00
摘要： The present invention provides a cooling apparatus which is easy to build and to fix it to electronic devices, superior in thermal conduction and heat dissipation, and possible to make thin the total configuration of the apparatus. The liquid cooling unit 9 and the air cooling unit 12 are formed in a unit. A heat absorption surface 19 of the liquid cooling unit 9 is contacted or bonded to the heat generation component such as the CPU and the heat generator, which have the largest power consumption and also locally generate heat within a small area in the box 2. In the liquid cooling unit 9, a liquid cooling pump 14 composed of an electromagnetic pump is arranged for circulating the coolant in the flow path 10. The heat generated by the heat generation components such as CPU 6, heat generator 7, and the like is thermally diffused with heat conduction into the whole liquid cooling unit 9 by circulating the coolant with the liquid cooling pump 14.
摘要翻译：本发明提供了一种易于构建并将其固定在电子设备上的散热装置，其热传导和散热优良，并且可以使装置的总体构型变薄。液体冷却单元9和空气冷却单元12形成为一个单元。液体冷却单元9的吸热表面19接触或结合到功率消耗最大的诸如CPU和发热体的发热组件，并且还在箱2中的小区域内局部产生热量。液体冷却单元9，由电磁泵构成的液体冷却泵14布置成使冷却剂在流路10中循环。由诸如CPU 6，发热体7等的发热组件产生的热量是热的通过使液体冷却泵14循环冷却剂，将热传导到整个液体冷却单元9中。

3. 发明申请

US20070006996A1 Cooler for electronic equipment 审中-公开
标题翻译：冷却器用于电子设备
公开(公告)号：US20070006996A1
公开(公告)日：2007-01-11
申请号：US10562362
申请日：2004-06-25
申请人： Kazuyuki Mikubo , Sakae Kitajo , Atsushi Ochi , Mitsuru Yamamoto
发明人： Kazuyuki Mikubo , Sakae Kitajo , Atsushi Ochi , Mitsuru Yamamoto
IPC分类号： F28D15/00
CPC分类号： G06F1/203 , G06F2200/201
摘要： [Object] A cooling device for a thin electronic equipment having a larger heat radiation area and preventing leakage of refrigerant. [Means for Solving Problems] A cooling device includes first and second cooling panels (1, 2) wherein a passage (11, 21) is formed by bonding together a top heat radiation panel and a bottom heat radiation panel each having a groove therein, and a circulation pump (3) for circulating refrigerant within the passage (11, 21). In the top heat radiation panel of the second cooling panel (2) are formed an outlet port through which the refrigerant flows out from the passage (21) to the circulation pump (3) and an inlet port through which the refrigerant flows in from the circulation pump (3) to the passage (21). The circulation pump (3) is fixed onto the top heat radiation plate of the cooling panel (2) so that the suction port and discharge port are aligned with the outlet port and inlet port, respectively.
摘要翻译：用于薄型电子设备的冷却装置具有较大的散热面积并防止制冷剂泄漏。解决问题的手段冷却装置包括第一和第二冷却板（1,2），其中通过将顶部散热板和每个在其中具有凹槽的底部散热板粘合在一起而形成通道（11,21）以及用于使制冷剂在通道（11,21）内循环的循环泵（3）。在第二冷却板（2）的顶部散热板中形成有一个出口，制冷剂通过该出口从通道（21）流出到循环泵（3）和制冷剂从其中流入的入口循环泵（3）到通道（21）。循环泵（3）固定在冷却板（2）的顶部散热板上，使得吸入口和排出口分别与出口和入口对准。

4. 发明申请

US20060139882A1 Cooler for electronic equipment 失效
标题翻译：冷却器用于电子设备
公开(公告)号：US20060139882A1
公开(公告)日：2006-06-29
申请号：US10561980
申请日：2004-06-25
申请人： Kazuyuki Mikubo , Sakae Kitajo , Atsushi Ochi , Mitsuru Yamamoto
发明人： Kazuyuki Mikubo , Sakae Kitajo , Atsushi Ochi , Mitsuru Yamamoto
IPC分类号： H05K7/20
CPC分类号： H01L23/473 , H01L2924/0002 , H01L2924/3011 , H01L2924/00
摘要： A cooling device includes a cooling panel wherein a passage is formed by bonding together a bottom heat radiation plate having a groove formed therein and a top heat radiation plate, and a circulation pump circulating refrigerant within the passage. The top heat radiation plate is provided with an outlet port through which the refrigerant flows out from the passage to the circulation pump and an inlet port through which the refrigerant flows in from the circulation pump to the passage. The circulation pump is fixed onto the top heat radiation plate of the cooling panel so that the suction port and discharge port are aligned with the outlet port and inlet port, respectively.
摘要翻译：冷却装置包括冷却板，其中通过将具有形成在其中的槽的底部散热板和顶部散热板结合在一起形成通道，以及在通道内循环制冷剂的循环泵。顶部散热板设有出口，制冷剂通过该出口从通道流到循环泵，以及制冷剂从循环泵流入通道的入口。循环泵被固定在冷却板的顶部散热板上，使得吸入口和排出口分别与出口和入口对准。

5. 发明授权

US07483261B2 Cooling device for an electronic equipment 失效
标题翻译：电子设备冷却装置
公开(公告)号：US07483261B2
公开(公告)日：2009-01-27
申请号：US10561980
申请日：2004-06-25
申请人： Kazuyuki Mikubo , Sakae Kitajo , Atsushi Ochi , Mitsuru Yamamoto
发明人： Kazuyuki Mikubo , Sakae Kitajo , Atsushi Ochi , Mitsuru Yamamoto
IPC分类号： H05K7/20
CPC分类号： H01L23/473 , H01L2924/0002 , H01L2924/3011 , H01L2924/00
摘要： A cooling device includes a cooling panel wherein a passage is formed by bonding together a bottom heat radiation plate having a groove formed therein and a top heat radiation plate, and a circulation pump circulating refrigerant within the passage. The top heat radiation plate is provided with an outlet port through which the refrigerant flows out from the passage to the circulation pump and an inlet port through which the refrigerant flows in from the circulation pump to the passage. The circulation pump is fixed onto the top heat radiation plate of the cooling panel so that the suction port and discharge port are aligned with the outlet port and inlet port, respectively.
摘要翻译：冷却装置包括冷却板，其中通过将具有形成在其中的槽的底部散热板和顶部散热板结合在一起形成通道，以及在通道内循环制冷剂的循环泵。顶部散热板设有出口，制冷剂通过该出口从通道流到循环泵，以及制冷剂从循环泵流入通道的入口。循环泵被固定在冷却板的顶部散热板上，使得吸入口和排出口分别与出口和入口对准。

6. 发明申请

US20070065308A1 Diaphragm pump and cooling system with the diaphragm pump 审中-公开
标题翻译：隔膜泵和隔膜泵的冷却系统
公开(公告)号：US20070065308A1
公开(公告)日：2007-03-22
申请号：US10566580
申请日：2004-07-21
申请人： Mitsuru Yamamoto , Yasuhiro Sasaki , Atsushi Ochi , Sakae Kitajo
发明人： Mitsuru Yamamoto , Yasuhiro Sasaki , Atsushi Ochi , Sakae Kitajo
IPC分类号： F04B17/00
CPC分类号： F04B43/02 , F04B43/046
摘要： A diaphragm pump enabling an increase in pump efficiency by reducing the pressure loss of liquid and reduction in thickness. The flow passage in piezoelectric pump (1) includes a pressure chamber (50) formed into a flat shape in cross section and a suction side flow passage (70a) and discharge side flow passage (70b). The suction side flow passage (70a) and the discharge side flow passage (70b) are disposed at both ends of the pressure chamber (50) so that the axes thereof are aligned with each other. The check valves (20a, 20b) are respectively disposed on the suction side flow passage (70a) and the discharge side flow passage (70b), and are tilted relative to the flow direction of the liquid.
摘要翻译：一种隔膜泵，通过减少液体的压力损失和减小厚度，可以提高泵的效率。压电泵（1）中的流路包括形成为扁平形状的压力室（50）和吸入侧流路（70a）和排出侧流路（70b）。吸入侧流路（70a）和排出侧流路（70b）设置在压力室（50）的两端，使其轴线彼此对准。止回阀（20a，20b）分别设置在吸入侧流路（70a）和排出侧流路（70b）上，相对于液体的流动方向倾斜。

7. 发明授权

US07564164B2 Drive circuit for piezoelectric pump and cooling system that uses this drive circuit 失效
标题翻译：使用该驱动电路的压电泵和冷却系统的驱动电路
公开(公告)号：US07564164B2
公开(公告)日：2009-07-21
申请号：US10590081
申请日：2005-02-01
申请人： Mitsuru Yamamoto , Sunao Hamamura , Yasuhiro Sasaki , Sakae Kitajo
发明人： Mitsuru Yamamoto , Sunao Hamamura , Yasuhiro Sasaki , Sakae Kitajo
IPC分类号： H01L41/09
CPC分类号： F04B45/047 , F04B17/003 , F04B43/046 , G06F1/206 , H01L23/473 , H01L41/042 , H01L2924/0002 , Y02D10/16 , H01L2924/00
摘要： A piezoelectric element of the piezoelectric pump is driven by the output signal of an amplifier that takes as input a signal that is generated by a sine wave oscillator of the same frequency that drives the piezoelectric element. The amplifier is driven by a high voltage obtained by conversion from a low-voltage power supply by a voltage-boosting converter, whereby the piezoelectric element is driven by a low-frequency sine wave of high voltage. The frequency of the sine wave oscillation is further adjusted by a signal from a first control circuit at the time of activation. In addition, the amplitude of the sine wave oscillation is adjusted by the output signal of a second control circuit that takes as input a signal from temperature sensor for sensing the temperature of the heat-generating body.
摘要翻译：压电泵的压电元件由放大器的输出信号驱动，该放大器将驱动压电元件的相同频率的正弦波振荡器产生的信号作为输入。放大器由通过由升压转换器从低压电源转换而获得的高电压驱动，由此压电元件由高电压的低频正弦波驱动。在激活时，来自第一控制电路的信号进一步调整正弦波振荡的频率。此外，正弦波振荡的振幅通过第二控制电路的输出信号进行调节，该第二控制电路将用于感测发热体温度的温度传感器的信号作为输入。

8. 发明授权

US06829079B2 Optical path control apparatus with mirror section, and manufacturing method for the same 有权
标题翻译：具有镜面部分的光路控制装置及其制造方法
公开(公告)号：US06829079B2
公开(公告)日：2004-12-07
申请号：US10028238
申请日：2001-12-21
申请人： Mikio Oda , Mitsuru Yamamoto , Hikaru Kouta , Yasuhiro Sasaki , Sakae Kitajo , Yuzo Shimada
发明人： Mikio Oda , Mitsuru Yamamoto , Hikaru Kouta , Yasuhiro Sasaki , Sakae Kitajo , Yuzo Shimada
IPC分类号： G02F129
CPC分类号： G02B6/352 , G02B6/3548 , G02B6/357 , G02B6/3572 , G02B6/3574 , G02B6/3578 , G02B6/3598 , G02B6/43 , G02B2006/12145
摘要： An optical path control apparatus includes a first substrate. A second substrate is movably provided for the first substrate. A mirror section is provided on the second substrate. A driving section moves the second substrate such that a first optical path of input light to the mirror section is optically connected to one of a plurality of second optical paths.
摘要翻译：光路控制装置包括第一基板。可动地设置第二基板用于第一基板。在第二基板上设置镜部。驱动部移动第二基板，使得输入光的第一光路到镜部分光学连接到多个第二光路中的一个。

9. 发明申请

US20070242427A1 Drive Circuit for Piezoelectric Pump and Cooling System That Uses This Drive Circuit 失效
标题翻译：使用该驱动电路的压电泵和冷却系统的驱动电路
公开(公告)号：US20070242427A1
公开(公告)日：2007-10-18
申请号：US10590081
申请日：2005-02-01
申请人： Mitsuru Yamamoto , Sunao Hamamura , Yasuhiro Sasaki , Sakae Kitajo
发明人： Mitsuru Yamamoto , Sunao Hamamura , Yasuhiro Sasaki , Sakae Kitajo
IPC分类号： H05K7/20 , H02N2/00
CPC分类号： F04B45/047 , F04B17/003 , F04B43/046 , G06F1/206 , H01L23/473 , H01L41/042 , H01L2924/0002 , Y02D10/16 , H01L2924/00
摘要： A drive circuit of a piezoelectric pump that is both light and compact, that can drive a piezoelectric pump with a low level of undesired noise, and that can further realize with low power consumption a coolant device capable of reliable operation at the time of activation. A piezoelectric element of the piezoelectric pump is driven by the output signal of an amplifier that takes as input a signal that is generated by a sine wave oscillator of the same frequency that drives the piezoelectric element. The amplifier is driven by a high voltage obtained by conversion from a low-voltage power supply by a voltage-boosting converter, whereby the piezoelectric element is driven by a low-frequency sine wave of high voltage. The frequency of the sine wave oscillation is further adjusted by a signal from a first control circuit at the time of activation. In addition, the amplitude of the sine wave oscillation is adjusted by the output signal of a second control circuit that takes as input a signal from temperature sensor for sensing the temperature of the heat-generating body.
摘要翻译：压电泵的驱动电路既轻又紧凑，可以驱动具有低水平的不期望的噪声的压电泵，并且可以在低功耗的情况下进一步实现能够在激活时可靠运行的冷却剂装置。压电泵的压电元件由放大器的输出信号驱动，该放大器将驱动压电元件的相同频率的正弦波振荡器产生的信号作为输入。放大器由通过由升压转换器从低压电源转换而获得的高电压驱动，由此压电元件由高电压的低频正弦波驱动。在激活时，来自第一控制电路的信号进一步调整正弦波振荡的频率。此外，正弦波振荡的振幅通过第二控制电路的输出信号进行调节，该第二控制电路将用于感测发热体温度的温度传感器的信号作为输入。

10. 发明授权

US06670699B2 Semiconductor device packaging structure 有权
公开(公告)号：US06670699B2
公开(公告)日：2003-12-30
申请号：US10090459
申请日：2002-03-04
申请人： Kazuyuki Mikubo , Sakae Kitajo , Yuzo Shimada
发明人： Kazuyuki Mikubo , Sakae Kitajo , Yuzo Shimada
IPC分类号： H01L2302
CPC分类号： H05K1/0272 , H01L23/433 , H01L23/473 , H01L23/49822 , H01L24/48 , H01L2224/05599 , H01L2224/16 , H01L2224/16225 , H01L2224/32225 , H01L2224/45099 , H01L2224/48091 , H01L2224/48227 , H01L2224/73204 , H01L2224/73253 , H01L2224/73265 , H01L2224/85399 , H01L2924/00014 , H01L2924/01087 , H01L2924/12041 , H01L2924/12042 , H01L2924/14 , H01L2924/15153 , H01L2924/1517 , H01L2924/15311 , H05K1/0207 , H05K1/112 , H05K3/4602 , H05K2201/064 , H05K2201/09536 , H05K2201/10416 , H05K2201/10977 , H01L2924/00 , H01L2224/45015 , H01L2924/207
摘要： A semiconductor package comprising an LSI chip, a chip bump, an interposer, and a BGA bump is mounted at a predetermined position of a printed wiring board having a core layer. A heat sink for dissipating heat generated from the LSI chip is installed within the core layer. Further, heat radiating vias for conveying heat generated from the LSI chip to the heat sink are provided within the printed wiring board so that the BGA bump in the LSI chip is thermally liked with the heat sink. The heat generated from the LSI chip is mainly dissipated through a route of chip bump→interposer→BGA bump→heat radiating via→heat sink. By virtue of the above construction, the semiconductor device packaging structure can reduce the packaging volume of the heat sink while providing satisfactory cooling capacity and, at the same time, can minimize the length of signal wiring between LSI chips.

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式