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    • 5. 发明申请
    • Method of manufacturing semiconductor device including nonvolatile memory
    • 包括非易失性存储器的半导体器件的制造方法
    • US20050136597A1
    • 2005-06-23
    • US10961084
    • 2004-10-12
    • Kazuyoshi ShinadaAkira Kimitsuka
    • Kazuyoshi ShinadaAkira Kimitsuka
    • H01L21/8247H01L21/336H01L27/115H01L29/788H01L29/792
    • H01L27/11521H01L27/115H01L27/11524
    • There is provided a method of manufacturing a semiconductor device including a nonvolatile memory including forming an element isolation area surrounding an element area in a semiconductor substrate doped with a first type conductive impurity, forming a gate insulating film on the element area, forming selectively a cap film on the gate insulating film, burying selectively with a mask film surrounding the cap film on the gate insulating film, forming a tunnel window by removing selectively the cap film, forming an impurity diffusion layer in a surface region of the semiconductor substrate underneath the gate insulating film by introducing a second type conductive impurity using the mask film as a mask, removing the gate insulating film in the tunnel window, forming a tunnel insulating film in the tunnel window, forming a floating gate electrode film, an inter-gate electrode film, and a control gate electrode film on the tunnel insulating film, and forming a source-drain in the semiconductor substrate to interpose a surface region of the semiconductor substrate beneath the control gate electrode film by introducing the second type conductive impurity into the surface region using the control gate electrode film as a mask.
    • 提供一种制造包括非易失性存储器的半导体器件的方法,包括在掺杂有第一类型导电杂质的半导体衬底中形成围绕元件区域的元件隔离区域,在元件区域上形成栅极绝缘膜,选择性地形成帽 在栅极绝缘膜上形成膜,在栅极绝缘膜上选择性地掩盖围绕盖膜的掩模膜,通过选择性地去除盖膜形成隧道窗,在栅极下方的半导体衬底的表面区域中形成杂质扩散层 通过使用掩模膜作为掩模引入第二类导电杂质的绝缘膜,去除隧道窗中的栅极绝缘膜,在隧道窗中形成隧道绝缘膜,形成浮栅电极膜,栅极间电极膜 ,以及在隧道绝缘膜上的控制栅电极膜,并在半沟形成源极漏极 通过使用控制栅电极膜作为掩模将第二类导电杂质引入到表面区域中,将半导体衬底的表面区域设置在控制栅电极膜的下方。
    • 6. 发明授权
    • Method of making a bipolar transistor
    • 制造双极晶体管的方法
    • US4504332A
    • 1985-03-12
    • US374232
    • 1982-05-03
    • Kazuyoshi Shinada
    • Kazuyoshi Shinada
    • H01L29/73H01L21/20H01L21/3215H01L21/331H01L29/732H01L21/225H01L21/265H01L21/28
    • H01L29/66287H01L21/02381H01L21/02532H01L21/02639H01L21/32155H01L29/7325Y10S438/969
    • This invention provides a method for manufacturing a bipolar transistor which comprises steps of selectively forming in the surface of a semiconductor substrate an embedded layer of a conductivity type opposite to that of the substrate, covering the substrate with an insulating layer doped, at the surface thereof with an impurity in the superficial region thereof, removing by etching the insulating layer to form an opening portion through which part of the embedded layer is exposed, simultaneously forming by epitaxial growth a single-crystal semiconductor layer of the same conductivity type as that of the embedded layer on the embedded layer at the opening portion and a polycrystalline semiconductor layer on the insulating layer, diffusing by heating the impurity in the insulating layer into the polycrystalline semiconductor layer to provide a conductivity type opposite to that of the single-crystal semiconductor layer, and successively forming an internal base region and an emitter region in the single-crystal semiconductor layer. The invention also provided a bipolar transistor manufactured by the aforementioned method.
    • 本发明提供了一种制造双极晶体管的方法,包括以下步骤:在半导体衬底的表面上选择性地形成与衬底相反的导电类型的嵌入层,在衬底的表面上覆盖掺杂有绝缘层的衬底 在其表面区域具有杂质,通过蚀刻绝缘层去除以形成嵌入层的一部分暴露的开口部分,同时通过外延生长形成与所述绝缘层相同的导电类型的单晶半导体层 在开口部分的嵌入层上的嵌入层和绝缘层上的多晶半导体层,通过将绝缘层中的杂质加热到多晶半导体层中以提供与单晶半导体层相反的导电类型而扩散, 并依次形成内基区和发射极 ion在单晶半导体层。 本发明还提供了通过上述方法制造的双极晶体管。
    • 7. 发明授权
    • Method of forming Schottky-I.sup.2 L devices by implantation and laser
bombardment
    • 通过注入和激光轰击形成肖特基I2L器件的方法
    • US4338139A
    • 1982-07-06
    • US210749
    • 1980-11-26
    • Kazuyoshi Shinada
    • Kazuyoshi Shinada
    • H01L21/266H01L21/768H01L21/8226H01L21/263H01L21/285H01L29/48
    • H01L21/76888H01L21/266H01L21/8226Y10S148/092Y10S148/093
    • A method for manufacturing a semiconductor device having a Schottky junction which comprises a process for burying first and second regions of a second conductivity type spaced from each other in a semiconductor body of a first conductivity type, a process for locally disposing a first interconnection layer made of a metal on a surface region of the semiconductor body facing the first region, a process for forming an insulating film on the surface of the first interconnection layer by subjecting the surface to anodic oxidation, a process for ion-implanting an impurity of the second conductivity type into the semiconductor body except a portion thereof under the first interconnection layer at such an energy level that the impurity may reach the first and second regions, a process for activating the ion-implanted layer by applying a laser beam thereto, and a process for forming a second interconnection layer connected with the activated layer by covering the whole surface of the semiconductor body with a metal and patterning the metal.
    • 一种用于制造具有肖特基结的半导体器件的方法,该半导体器件包括在第一导电类型的半导体本体中相互隔开的第二导电类型的第一和第二区域的掩埋工艺,用于局部地布置第一互连层的工艺 在半导体主体的面向第一区域的表面区域上的金属,通过对表面进行阳极氧化在第一互连层的表面上形成绝缘膜的工艺,用于离子注入第二区域的杂质的工艺 导电类型进入半导体本体,除了第一互连层下方的部分,杂质可以到达第一和第二区域的能级,通过施加激光束来激活离子注入层的工艺,以及工艺 用于通过覆盖半圆形的整个表面来形成与活化层连接的第二互连层 具有金属的导体和图案化金属。
    • 8. 发明授权
    • Method of manufacturing semiconductor device including nonvolatile memory
    • 包括非易失性存储器的半导体器件的制造方法
    • US07115471B2
    • 2006-10-03
    • US10961084
    • 2004-10-12
    • Kazuyoshi ShinadaAkira Kimitsuka
    • Kazuyoshi ShinadaAkira Kimitsuka
    • H01L21/336
    • H01L27/11521H01L27/115H01L27/11524
    • There is provided a method of manufacturing a semiconductor device including a nonvolatile memory including forming an element isolation area surrounding an element area in a semiconductor substrate doped with a first type conductive impurity, forming a gate insulating film on the element area, forming selectively a cap film on the gate insulating film, burying selectively with a mask film surrounding the cap film on the gate insulating film, forming a tunnel window by removing selectively the cap film, forming an impurity diffusion layer in a surface region of the semiconductor substrate underneath the gate insulating film by introducing a second type conductive impurity using the mask film as a mask, removing the gate insulating film in the tunnel window, forming a tunnel insulating film in the tunnel window, forming a floating gate electrode film, an inter-gate electrode film, and a control gate electrode film on the tunnel insulating film, and forming a source-drain in the semiconductor substrate to interpose a surface region of the semiconductor substrate beneath the control gate electrode film by introducing the second type conductive impurity into the surface region using the control gate electrode film as a mask.
    • 提供一种制造包括非易失性存储器的半导体器件的方法,包括在掺杂有第一类型导电杂质的半导体衬底中形成围绕元件区域的元件隔离区域,在元件区域上形成栅极绝缘膜,选择性地形成帽 在栅极绝缘膜上形成膜,在栅极绝缘膜上选择性地掩盖围绕盖膜的掩模膜,通过选择性地去除盖膜形成隧道窗,在栅极下方的半导体衬底的表面区域中形成杂质扩散层 通过使用掩模膜作为掩模引入第二类导电杂质的绝缘膜,去除隧道窗中的栅极绝缘膜,在隧道窗中形成隧道绝缘膜,形成浮栅电极膜,栅极间电极膜 ,以及在隧道绝缘膜上的控制栅电极膜,并在半沟形成源极漏极 通过使用控制栅电极膜作为掩模将第二类导电杂质引入到表面区域中,将半导体衬底的表面区域设置在控制栅电极膜的下方。
    • 10. 发明授权
    • Method of producing semiconductor device
    • 半导体器件的制造方法
    • US4597824A
    • 1986-07-01
    • US670010
    • 1984-11-09
    • Kazuyoshi ShinadaMasaki Sato
    • Kazuyoshi ShinadaMasaki Sato
    • H01L21/033H01L21/225H01L21/336H01L29/10H01L29/78H01L21/306B44C1/22C03C15/00C03C25/06
    • H01L29/6659H01L21/0337H01L21/2255H01L29/1083H01L29/78H01L29/7836
    • A method of producing a MOS transistor of LDD structure with p(n) type pockets. A doped oxide film in which impurities such as phosphorus and impurities such as arsenic are doped is formed on a semiconductor substrate, and a nitride film is formed in regions where p type pockets are formed on the both sides of a gate electrode. By implementing heat treatment in the atmosphere of oxygen, the portion below the nitride film is placed in the condition where it is equivalent when heat treated in the atmosphere of nitrogen whereby a p type impurity region and an n.sup.- type impurity region are formed. The region except for that below the nitride film is heat treated in the atmosphere of oxygen to form an n.sup.+ type impurity region. Further, with the gate electrode as a mask, n.sup.- type impurity region and p type impurity region are formed, thereafter selectively growing a film on the side walls of the gate electrode to form an n.sup.+ type impurity region with the gate electrode and the film as masks, thus producing a MOS transistor.
    • 一种制造具有p(n)型袋的LDD结构的MOS晶体管的方法。 在半导体衬底上形成掺杂有杂质如砷的杂质如砷的掺杂氧化物膜,并且在栅电极的两侧形成有p型穴的区域中形成氮化物膜。 通过在氧气氛下进行热处理,将氮化膜下方的部分置于在氮气气氛中进行热处理时相当的状态,由此形成p型杂质区域和n型杂质区域。 除了氮化物膜下方的区域在氧气氛中进行热处理以形成n +型杂质区域。 此外,以栅电极为掩模,形成n型杂质区和p型杂质区,然后在栅电极的侧壁上选择性地生长膜以与栅电极和膜形成n +型杂质区 作为掩模,从而产生MOS晶体管。