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1. 发明授权

US07534077B2 Finishing machine 有权
标题翻译：整理机
公开(公告)号：US07534077B2
公开(公告)日：2009-05-19
申请号：US11204225
申请日：2005-08-16
申请人： Kazunori Ban , Takashi Sato , Kokoro Hatanaka
发明人： Kazunori Ban , Takashi Sato , Kokoro Hatanaka
IPC分类号： B23C1/00
CPC分类号： G05B19/4163 , Y02P90/265 , Y10T409/30084 , Y10T409/301792 , Y10T409/303472 , Y10T409/304256
摘要： A surface of a workpiece is traced when a machining tool is pressed onto the surface of the workpiece under force control so as to find the positional data of the surface shape. This positional data is corrected by an error caused by a bend of a robot. The positional data is compared with the target shape of the surface, from which the burr is removed. A shift of the surface shape in the normal line direction is found. The burr generation start position, the burr generation end position and the height of the burr are found by the shift start position, the shift end position and the shift size. A machining program is made which is composed of a pass connecting the burr end position with the burr start position and also composed of a cutting pass for removing the burr, and the thus made machining program is executed. As the burr position is found and the burr is removed when the machining tool is moved to the burr position, the burr can be effectively removed.
摘要翻译：当在力控制下将加工工具按压到工件的表面上时，跟踪工件的表面，以找到表面形状的位置数据。该位置数据由机器人的弯曲引起的误差进行校正。将位置数据与表面的目标形状进行比较，从中去除毛刺。发现表面形状在法线方向的移动。毛刺生成开始位置，毛刺生成结束位置和毛刺的高度由换档开始位置，换档结束位置和换档尺寸确定。进行加工程序，该加工程序由将毛刺末端位置与毛刺起始位置连接起来的通路构成，并且还包括用于去除毛刺的切割道，并且由此制造的加工程序被执行。当加工刀具移动到毛刺位置时，当发现毛刺位置并除去毛刺时，可以有效地去除毛刺。

2. 发明申请

US20060145494A1 Gripping type hand 有权
标题翻译：握手式手
公开(公告)号：US20060145494A1
公开(公告)日：2006-07-06
申请号：US11245012
申请日：2005-10-07
申请人： Ryo Nihei , Kazunori Ban , Takashi Sato , Toshinari Tamura , Kokoro Hatanaka
发明人： Ryo Nihei , Kazunori Ban , Takashi Sato , Toshinari Tamura , Kokoro Hatanaka
IPC分类号： B66C1/42
CPC分类号： B25J9/1612 , B25J13/082 , B25J15/08 , Y10S294/907
摘要： A gripping type hand including a plurality of finger mechanisms provided respectively with finger joints, actuators for driving the finger joints, and links supported by the finger joints and operating under driving force of the actuators. The gripping type hand includes an operation controlling section capable of respectively controlling the actuators of the plurality of finger mechanisms independently from each other; a position detecting section for respectively detecting operating positions of the finger joints of the plurality of finger mechanisms; and strain detecting sections provided respectively for the plurality of finger mechanisms and detecting strains generating in the links due to force applied to the finger mechanisms. The operation controlling section coordinately controls the actuators of the plurality of finger mechanisms to adjust gripping force generated by the plurality of finger mechanisms, based on the operating positions of the finger joints detected by the position detecting section and the strains of the links detected by the strain detecting sections.
摘要翻译：夹持型手包括分别设置有手指接头的多个指状机构，用于驱动指关节的致动器，以及由手指接头支撑的链节，并且在致动器的驱动力下操作。夹持型手包括能够彼此独立地分别控制多个手指机构的致动器的操作控制部; 位置检测部分，用于分别检测多个手指机构的手指关节的操作位置; 和应变检测部分分别设置用于多个手指机构，并且由于施加到手指机构的力而检测在链接中产生的应变。操作控制部基于由位置检测部检测到的手指关节的操作位置和由所述多个手指机构检测到的链节的张力，协调地控制多个手指机构的致动器，以调整由多个手指机构产生的夹持力应变检测部分。

3. 发明授权

US07445260B2 Gripping type hand 有权
标题翻译：握手式手
公开(公告)号：US07445260B2
公开(公告)日：2008-11-04
申请号：US11245012
申请日：2005-10-07
申请人： Ryo Nihei , Kazunori Ban , Takashi Sato , Toshinari Tamura , Kokoro Hatanaka
发明人： Ryo Nihei , Kazunori Ban , Takashi Sato , Toshinari Tamura , Kokoro Hatanaka
IPC分类号： B25J13/08 , B25J15/08
CPC分类号： B25J9/1612 , B25J13/082 , B25J15/08 , Y10S294/907
摘要： A gripping type hand including a plurality of finger mechanisms provided respectively with finger joints, actuators for driving the finger joints, and links supported by the finger joints and operating under driving force of the actuators. The gripping type hand includes an operation controlling section capable of respectively controlling the actuators of the plurality of finger mechanisms independently from each other; a position detecting section for respectively detecting operating positions of the finger joints of the plurality of finger mechanisms; and strain detecting sections provided respectively for the plurality of finger mechanisms and detecting strains generating in the links due to force applied to the finger mechanisms. The operation controlling section coordinately controls the actuators of the plurality of finger mechanisms to adjust gripping force generated by the plurality of finger mechanisms, based on the operating positions of the finger joints detected by the position detecting section and the strains of the links detected by the strain detecting sections.
摘要翻译：夹持型手包括分别设置有手指接头的多个指状机构，用于驱动指关节的致动器，以及由手指接头支撑的链节，并且在致动器的驱动力下操作。夹持型手包括能够彼此独立地分别控制多个手指机构的致动器的操作控制部; 位置检测部分，用于分别检测多个手指机构的手指关节的操作位置; 和应变检测部分分别设置用于多个手指机构，并且由于施加到手指机构的力而检测在链接中产生的应变。操作控制部基于由位置检测部检测到的手指关节的操作位置和由所述多个手指机构检测到的链节的张力，协调地控制多个手指机构的致动器，以调整由多个手指机构产生的夹持力应变检测部分。

4. 发明申请

US20060039768A1 Finishing machine 有权
标题翻译：整理机
公开(公告)号：US20060039768A1
公开(公告)日：2006-02-23
申请号：US11204225
申请日：2005-08-16
申请人： Kazunori Ban , Takashi Sato , Kokoro Hatanaka
发明人： Kazunori Ban , Takashi Sato , Kokoro Hatanaka
IPC分类号： B23C1/16
CPC分类号： G05B19/4163 , Y02P90/265 , Y10T409/30084 , Y10T409/301792 , Y10T409/303472 , Y10T409/304256
摘要： A surface of a workpiece, from which the burr is removed, is traced when a machining tool is pressed onto the surface of the workpiece under force control so as to find the positional data of the surface shape (S1). This positional data is corrected by an error caused by a bend of a robot (S2). The thus obtained positional data is compared with the target shape of the surface, from which the burr is removed, obtained from CAD data (S6, S10). A shift of the surface shape in the normal line direction is found (S7, S11). The burr generation start position, the burr generation end position and the height of the burr are found by the shift start position (S8), the shift end position and the shift size (S14). A machining program is made which is composed of a pass connecting the burr end position with the burr start position and also composed of a cutting pass for removing the burr, and the thus made machining program is executed (S16, S17). As the burr position is found and the burr is removed when the machining tool is moved to the burr position, the burr can be effectively removed. Due to the foregoing, it is possible to provide a finishing machine characterized in that useless burr removing actions can be reduced and, further, that the overcutting of a workpiece can be prevented.
摘要翻译：当加工工具在力控制下被压在工件的表面上时，跟踪去除毛刺的工件的表面，以找到表面形状的位置数据（S 1）。该位置数据由机器人的弯曲引起的误差进行校正（S 2）。将如此获得的位置数据与从CAD数据获得的表面的目标形状（从其中除去毛刺）进行比较（S 6，S 10）。发现在法线方向上的表面形状的偏移（S 7，S 11）。通过换档开始位置（S 8），换档结束位置和换档尺寸（S14）找到毛刺生成开始位置，毛刺生成结束位置和毛刺高度。进行加工程序，该加工程序由将毛刺末端位置与毛刺开始位置连接的通路构成，并且还包括用于去除毛刺的切割道，并且由此制造的加工程序被执行（S16，S17）。当加工刀具移动到毛刺位置时，当发现毛刺位置并除去毛刺时，可以有效地去除毛刺。由于上述原因，可以提供一种整理机，其特征在于可以减少无用的毛刺去除动作，另外可以防止工件的过度切割。

5. 发明授权

US07508155B2 Controller 有权
标题翻译：控制器
公开(公告)号：US07508155B2
公开(公告)日：2009-03-24
申请号：US11682774
申请日：2007-03-06
申请人： Takashi Sato , Kokoro Hatanaka
发明人： Takashi Sato , Kokoro Hatanaka
IPC分类号： G05D15/00
CPC分类号： G05B13/024 , B25J9/1633 , G05B2219/39322 , G05B2219/39332 , G05B2219/40032 , G05B2219/41021 , G05B2219/42092
摘要： A controller includes a first data acquiring portion for acquiring a time constant of a position control circuit based on a position command value to a drive source and an actual position value, during operation of a controlled object; a second data acquiring portion for acquiring a rigidity value for the controlled object and a workpiece based on a force data obtained when the controlled object is brought into contact with the workpiece; and an automatic gain calculating portion for calculating a force control gain of a force control circuit from the time constant of the position control circuit acquired by the first data acquiring portion and the rigidity value acquired by the second data acquiring portion, under conditions where a time constant of the force control circuit is larger than the time constant of the position control circuit.
摘要翻译：控制器包括：第一数据获取部分，用于在受控对象的操作期间，基于对驱动源的位置指令值和实际位置值获取位置控制电路的时间常数; 第二数据获取部分，用于基于当受控对象与工件接触时获得的力数据来获取受控对象和工件的刚度值; 以及自动增益计算部分，用于根据由第一数据获取部分获取的位置控制电路的时间常数和由第二数据获取部分获取的刚度值的时间常数来计算力控制电路的力控制增益，力控制电路的常数大于位置控制电路的时间常数。

6. 发明申请

US20090215247A1 MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE 有权
标题翻译：半导体器件的制造方法
公开(公告)号：US20090215247A1
公开(公告)日：2009-08-27
申请号：US12434637
申请日：2009-05-02
申请人： Takashi Sato , Junichi Takano , Takashi Sato , Tokuo Naitou
发明人： Takashi Sato , Junichi Takano , Takashi Sato , Tokuo Naitou
IPC分类号： H01L21/304
CPC分类号： H01L21/67092 , H01L21/78 , H01L2224/06181 , H01L2224/32245 , H01L2224/45144 , H01L2224/48091 , H01L2224/48247 , H01L2224/73265 , H01L2924/181 , H01L2924/00012 , H01L2924/00
摘要： Illumination devices (7a) and (7b) which irradiate light having a wavelength of 1.1 μm or less are arranged on a front surface and a rear surface of a cover (8) of a dicing device (1). After a wafer is placed on a dicing stage (3), when the wafer is diced by a blade (4a) attached to a spindle (5), light is irradiated on an entire surface of an upper surface (element forming surface) of the wafer by the illumination devices (7a) and (7b). At this time, an illuminance of light on the wafer is set at 70 lux or more and 2000 lux or less. By this means, during a dicing operation, an area to be a light-shielded area by the spindle (5) or the like is not present on the wafer.
摘要翻译：在扫描装置（1）的盖（8）的前表面和后表面上布置照射波长为1.1μm以下的光的照明装置（7a）和（7b）。在将晶片放置在切割台（3）上之后，当通过安装在主轴（5）上的刀片（4a）切割晶片时，将光照射在上表面（元件形成表面）的整个表面上晶片通过照明装置（7a）和（7b）。此时，晶片上的光的照度设定为70勒克司以上且2000lux以下。通过这种方式，在切割操作期间，晶片上不存在由主轴（5）等构成遮光区域的区域。

7. 发明授权

US07998793B2 Light illumination during wafer dicing to prevent aluminum corrosion 有权
标题翻译：晶圆切割时的光照，防止铝腐蚀
公开(公告)号：US07998793B2
公开(公告)日：2011-08-16
申请号：US12434637
申请日：2009-05-02
申请人： Takashi Sato , Junichi Takano , Takashi Sato , Tokuo Naitou
发明人： Takashi Sato , Junichi Takano , Takashi Sato , Tokuo Naitou
IPC分类号： H01L21/00
CPC分类号： H01L21/67092 , H01L21/78 , H01L2224/06181 , H01L2224/32245 , H01L2224/45144 , H01L2224/48091 , H01L2224/48247 , H01L2224/73265 , H01L2924/181 , H01L2924/00012 , H01L2924/00
摘要： Illumination devices (7a) and (7b) which irradiate light having a wavelength of 1.1 μm or less are arranged on a front surface and a rear surface of a cover (8) of a dicing device (1). After a wafer is placed on a dicing stage (3), when the wafer is diced by a blade (4a) attached to a spindle (5), light is irradiated on an entire surface of an upper surface (element forming surface) of the wafer by the illumination devices (7a) and (7b). At this time, an illuminance of light on the wafer is set at 70 lux or more and 2000 lux or less. By this means, during a dicing operation, an area to be a light-shielded area by the spindle (5) or the like is not present on the wafer.
摘要翻译：在切割装置（1）的盖（8）的前表面和后表面上布置照射波长为1.1μm以下的光的照明装置（7a）和（7b）。在将晶片放置在切割台（3）上之后，当通过安装在主轴（5）上的刀片（4a）切割晶片时，将光照射在上表面（元件形成表面）的整个表面上晶片通过照明装置（7a）和（7b）。此时，晶片上的光的照度设定为70勒克司以上且2000lux以下。通过这种方式，在切割操作期间，晶片上不存在由主轴（5）等构成遮光区域的区域。

8. 发明申请

US20080138962A1 Manufacturing Method of Semiconductor Device 审中-公开
标题翻译：半导体器件的制造方法
公开(公告)号：US20080138962A1
公开(公告)日：2008-06-12
申请号：US11632993
申请日：2004-07-22
申请人： Takashi Sato , Junichi Takano , Takashi Sato , Tokuo Naitou
发明人： Takashi Sato , Junichi Takano , Takashi Sato , Tokuo Naitou
IPC分类号： H01L21/304
CPC分类号： H01L21/67092 , H01L21/78 , H01L2224/06181 , H01L2224/32245 , H01L2224/45144 , H01L2224/48091 , H01L2224/48247 , H01L2224/73265 , H01L2924/181 , H01L2924/00012 , H01L2924/00
摘要： Illumination devices (7a) and (7b) which irradiate light having a wavelength of 1.1 μm or less are arranged on a front surface and a rear surface of a cover (8) of a dicing device (1). After a wafer is placed on a dicing stage (3), when the wafer is diced by a blade (4a) attached to a spindle (5), light is irradiated on an entire surface of an upper surface (element forming surface) of the wafer by the illumination devices (7a) and (7b). At this time, an illuminance of light on the wafer is set at 70 lux or more and 2000 lux or less. By this means, during a dicing operation, an area to be a light-shielded area by the spindle (5) or the like is not present on the wafer.
摘要翻译：在切割装置（1）的盖（8）的前表面和后表面上布置照射具有1.1μm或更小的波长的光的照明装置（7a）和（7b）。在将晶片放置在切割台（3）上之后，当通过安装在主轴（5）上的刀片（4a）切割晶片时，将光照射在上表面（元件形成表面）的整个表面上通过照明装置（7a）和（7b）的晶片。此时，晶片上的光的照度设定为70勒克司以上且2000lux以下。通过这种方式，在切割操作期间，晶片上不存在由主轴（5）等构成遮光区域的区域。

9. 发明授权

US10026968B2 Method for producing fuel cell electrode catalyst 有权
公开(公告)号：US10026968B2
公开(公告)日：2018-07-17
申请号：US14000569
申请日：2012-01-04
申请人： Masaki Horikita , Kunchan Lee , Yasuaki Wakizaka , Takashi Sato
发明人： Masaki Horikita , Kunchan Lee , Yasuaki Wakizaka , Takashi Sato
IPC分类号： H01M4/88 , H01M4/90 , H01M8/1018
CPC分类号： H01M4/8882 , H01M4/8825 , H01M4/9008 , H01M4/9016 , H01M4/9083 , H01M2008/1095
摘要： A method for producing a fuel cell electrode catalyst, including a step (I) of bringing an aqueous solution of a transition metal compound (1) into contact with ammonia and/or ammonia water to generate a precipitate (A) containing an atom of the transition metal, a step (II) of mixing at least the precipitate (A), an organic compound (B), and a liquid medium (C) to obtain a catalyst precursor liquid, and a step (IV) of subjecting the solid in the catalyst precursor liquid to heat treatment at a temperature of 500 to 1200° C. to obtain an electrode catalyst; a portion or the entirety of the transition metal compound (1) being a compound containing a transition metal element of group 4 or group 5 of the periodic table; and the organic compound (B) being at least one selected from sugars and the like.

10. 发明授权

US09818495B2 Containment vessel and nuclear power plant 有权
公开(公告)号：US09818495B2
公开(公告)日：2017-11-14
申请号：US13988966
申请日：2011-09-14
申请人： Takashi Sato
发明人： Takashi Sato
IPC分类号： G21C13/10 , G21C13/00 , G21C9/004 , G21C9/008 , G21C9/06 , G21C15/18 , G21F9/02
CPC分类号： G21C13/00 , G21C9/004 , G21C9/008 , G21C9/06 , G21C13/10 , G21C15/18 , G21F9/02 , Y02E30/40
摘要： A containment vessel has an inner shell covering a reactor pressure vessel and an outer shell forming an outer well which is a gas-tight space covering the horizontal outer periphery of the inner shell. The inner shell has a first cylindrical side wall surrounding the horizontal periphery of the reactor pressure vessel, a containment vessel head which covers the upper part of the reactor pressure vessel, and a first top slab connecting in a gas-tight manner the periphery of the containment vessel head and the upper end of the first cylindrical side wall. The outer shell has a second cylindrical side wall surrounding the outer periphery of the first cylindrical side wall, and also has a second to slab connecting in a gas-tight manner the vicinity of the upper end of the second cylindrical side wall and the first cylindrical side wall.

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