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1. 发明申请

US20110100870A1 SUPPORTING BODY AND SUBSTRATE STORAGE CONTAINER 有权
标题翻译：支撑体和底座储物容器
公开(公告)号：US20110100870A1
公开(公告)日：2011-05-05
申请号：US12997414
申请日：2009-06-12
申请人： Kazumasa Ohnuki , Hiroyuki Shida , Satoshi Odashima
发明人： Kazumasa Ohnuki , Hiroyuki Shida , Satoshi Odashima
IPC分类号： B65D85/00 , H01L21/673 , F16M13/00
CPC分类号： H01L21/67379 , H01L21/67383
摘要： A separate supporting body for supporting semiconductor wafers of φ450 mm is attached to the inner surface of either side wall of a container body. Each supporting body is formed of a front supporting piece that is projected laterally from a frame and horizontally retains the wafer on, at least, the side part in the front peripheral edge; and a rear supporting piece that is projected laterally from frame and horizontally retains the wafer on, at least, the side part in the rear peripheral edge. Front supporting piece is formed of a projected part that extends from the front of frame toward the front peripheral edge of the semiconductor wafer and a curved part that extends rearwards from projected part along the peripheral edge of the semiconductor wafer.
摘要翻译：用于支撑450mm的半导体晶片的单独的支撑体附接到容器主体的任一侧壁的内表面。每个支撑体由从框架横向突出的前支撑件形成，并且将晶片水平地保持在至少在前周边边缘中的侧部; 以及从框架侧向突出并水平地将晶片保持在至少在后周缘中的侧部的后支撑件。前支撑件由从框架的前部向半导体晶片的前周边延伸的突起部分和从投影部分沿着半导体晶片的周缘向后延伸的弯曲部分形成。

2. 发明授权

US08627959B2 Substrate storage container 有权
标题翻译：基材储存容器
公开(公告)号：US08627959B2
公开(公告)日：2014-01-14
申请号：US12997414
申请日：2009-06-12
申请人： Kazumasa Ohnuki , Hiroyuki Shida , Satoshi Odashima
发明人： Kazumasa Ohnuki , Hiroyuki Shida , Satoshi Odashima
IPC分类号： B65D85/48 , B65D85/00
CPC分类号： H01L21/67379 , H01L21/67383
摘要： A separate supporting body for supporting semiconductor wafers of φ450 mm is attached to the inner surface of either side wall of a container body. Each supporting body is formed of a front supporting piece that is projected laterally from a frame and horizontally retains the wafer on, at least, the side part in the front peripheral edge; and a rear supporting piece that is projected laterally from frame and horizontally retains the wafer on, at least, the side part in the rear peripheral edge. Front supporting piece is formed of a projected part that extends from the front of frame toward the front peripheral edge of the semiconductor wafer and a curved part that extends rearwards from projected part along the peripheral edge of the semiconductor wafer.
摘要翻译：用于支撑phi450mm的半导体晶片的单独的支撑体附接到容器主体的任一侧壁的内表面。每个支撑体由从框架横向突出的前支撑件形成，并且将晶片水平地保持在至少在前周边边缘中的侧部; 以及从框架侧向突出并水平地将晶片保持在至少在后周缘中的侧部的后支撑件。前支撑件由从框架的前部向半导体晶片的前周边延伸的突起部分和从投影部分沿着半导体晶片的周缘向后延伸的弯曲部分形成。

3. 发明授权

US07875501B2 Holding jig, semiconductor wafer grinding method, semiconductor wafer protecting structure and semiconductor wafer grinding method and semiconductor chip fabrication method using the structure 有权
标题翻译：保持夹具，半导体晶片研磨方法，半导体晶片保护结构和半导体晶片研磨方法以及使用该结构的半导体芯片制造方法
公开(公告)号：US07875501B2
公开(公告)日：2011-01-25
申请号：US12282984
申请日：2007-03-09
申请人： Kiyofumi Tanaka , Satoshi Odashima , Noriyoshi Hosono , Hironobu Fujimoto , Takeshi Segawa
发明人： Kiyofumi Tanaka , Satoshi Odashima , Noriyoshi Hosono , Hironobu Fujimoto , Takeshi Segawa
IPC分类号： H01L21/44 , H01L21/48 , H01L21/50
CPC分类号： H01L21/6875 , B24B37/042 , B24B41/061 , B65G49/061 , B65G2249/045 , Y10T428/24322
摘要： A backgrinding machine 10 of a semiconductor wafer W includes: a table 13 set on the working plane of a mount 11; a multiple number of holding jigs 20 arranged via check tables 15 on table 13; a grinding machine 30 for performing a grinding process of the rear side of semiconductor wafer W held by holding jig 20; and a washing device 40 for ground semiconductor wafers W. Each holding jig 20 is constructed of a concave 22 depressed on the surface of a base plate 21, a multiple number of supporting projections 23 projectively arrayed on the bottom surface of concave 22, a deformable contact film 24, covering the concave 22, being supported by the multiple supporting projections 23, for detachably holding semiconductor wafer W in close contact with it; and an exhaust path 25 for conducting air from the concave 22 covered by contact film 24 to the outside.
摘要翻译：半导体晶片W的背面研磨机10包括：设置在安装件11的工作面上的工作台13; 通过表13上的检查台15布置多个保持夹具20; 用于进行通过保持夹具20保持的半导体晶片W的后侧的研磨处理的研磨机30; 以及用于接地半导体晶片W的洗涤装置40.每个保持夹具20由在基板21的表面上凹陷的凹部22构成，多个支撑突起23投影地排列在凹部22的底面上，接触膜24，覆盖凹部22，由多个支撑突起23支撑，用于可拆卸地保持半导体晶片W与其紧密接触; 以及用于将空气从由接触膜24覆盖的凹部22引导到外部的排气路径25。

4. 发明申请

US20060243620A1 Fixing carrier, fixing carrier manufacturing method, method of using fixing carriers and substrate storage container 审中-公开
标题翻译：固定载体，固定载体制造方法，使用固定载体和基材储存容器的方法
公开(公告)号：US20060243620A1
公开(公告)日：2006-11-02
申请号：US11342704
申请日：2006-01-31
申请人： Satoshi Odashima , Noriyoshi Hosono
发明人： Satoshi Odashima , Noriyoshi Hosono
IPC分类号： B65D85/00
CPC分类号： H01L21/67346 , H01L21/67383 , H01L21/67393
摘要： An object is to provide a fixing carrier, a fixing carrier manufacturing method, a method of using the fixing carrier and a substrate storage container, which provide proper shipment of items to be loaded that are prone to warp and crack. A base 2 having rigidity is hollowed on its surface and formed with a sectioned space 3 laminated and covered by a supporting layer 8 that supports semiconductor wafer W, multiple projections 4 that are formed in the sectioned space and supports supporting layer 8 in contact therewith and an exhaust passage 6 that is bored through base 2 and draws air out of sectioned space 3 covered by supporting layer 8. Since semiconductor wafer W that is prone to warp and crack is supported by supporting layer 8 of a fixing carrier 1 and accommodated in the container body of a substrate storage container, instead of being kept directly in the container, so it is possible to achieve safe and proper shipment between factories.
摘要翻译：本发明的目的是提供一种固定载体，固定载体制造方法，使用固定载体和基材储存容器的方法，其提供容易发生翘曲和裂纹的待加载物品的正确运输。具有刚性的基座2在其表面上是中空的，并且形成有由支撑半导体晶片W的支撑层8层叠并覆盖的截面空间3，多个突起4形成在截面空间中并支撑与其接触的支撑层8，排气通道6，其穿过底座2，并将空气抽出由支撑层8覆盖的截面空间3中。由于容易翘曲和裂纹的半导体晶片W由固定载体1的支撑层8支撑并容纳在容器体的基材储存容器，而不是直接保存在容器中，因此可以在工厂之间实现安全合适的运输。

5. 发明申请

US20090081852A1 HOLDING JIG, SEMICONDUCTOR WAFER GRINDING METHOD, SEMICONDUCTOR WAFER PROTECTING STRUCTURE AND SEMICONDUCTOR WAFER GRINDING METHOD AND SEMICONDUCTOR CHIP FABRICATION METHOD USING THE STRUCTURE 有权
标题翻译：控制晶圆，半导体晶粒磨削方法，半导体晶体保护结构和半导体晶粒研磨方法及半导体芯片制造方法
公开(公告)号：US20090081852A1
公开(公告)日：2009-03-26
申请号：US12282984
申请日：2007-03-09
申请人： Kiyofumi Tanaka , Satoshi Odashima , Noriyoshi Hosono , Hironobu Fujimoto , Takeshi Segawa
发明人： Kiyofumi Tanaka , Satoshi Odashima , Noriyoshi Hosono , Hironobu Fujimoto , Takeshi Segawa
IPC分类号： H01L21/304 , B24B41/06
CPC分类号： H01L21/6875 , B24B37/042 , B24B41/061 , B65G49/061 , B65G2249/045 , Y10T428/24322
摘要： A backgrinding machine 10 of a semiconductor wafer W includes: a table 13 set on the working plane of a mount 11; a multiple number of holding jigs 20 arranged via check tables 15 on table 13; a grinding machine 30 for performing a grinding process of the rear side of semiconductor wafer W held by holding jig 20; and a washing device 40 for ground semiconductor wafers W. Each holding jig 20 is constructed of a concave 22 depressed on the surface of a base plate 21, a multiple number of supporting projections 23 projectively arrayed on the bottom surface of concave 22, a deformable contact film 24, covering the concave 22, being supported by the multiple supporting projections 23, for detachably holding semiconductor wafer W in close contact with it; and an exhaust path 25 for conducting air from the concave 22 covered by contact film 24 to the outside.
摘要翻译：半导体晶片W的背面研磨机10包括：设置在安装件11的工作面上的工作台13; 通过表13上的检查台15布置多个保持夹具20; 用于进行通过保持夹具20保持的半导体晶片W的后侧的研磨处理的研磨机30; 以及用于接地半导体晶片W的洗涤装置40.每个保持夹具20由在基板21的表面上凹陷的凹部22构成，多个支撑突起23投影地排列在凹部22的底面上，接触膜24，覆盖凹部22，由多个支撑突起23支撑，用于可拆卸地保持半导体晶片W与其紧密接触; 以及用于将空气从由接触膜24覆盖的凹部22引导到外部的排气路径25。

6. 发明授权

US08322533B2 Lid body for substrate storage container and substrate storage container 失效
标题翻译：用于基材储存容器和基材储存容器的盖体
公开(公告)号：US08322533B2
公开(公告)日：2012-12-04
申请号：US12667894
申请日：2008-07-04
申请人： Satoshi Odashima , Hidehiro Masuko
发明人： Satoshi Odashima , Hidehiro Masuko
IPC分类号： B65D85/00 , B65D85/90
CPC分类号： H01L21/67353 , H01L21/67373 , H01L21/67379 , Y10T292/0969
摘要： A substrate storage container includes a locking mechanism, provided in a lid for opening and closing an opened front portion of a container body which stores a substrate of three sheets or less, for locking the lid fitted into the front portion of the container body. The locking mechanism is supported by the lid which is substantially laterally long when viewed from the front. The locking mechanism includes an advance/retreat engaging body that opposes an inner periphery of the front portion of the container body when the lid is fitted into the front portion of the container body, and a spring member that causes the advance/retreat engaging body to advance from the lid to the inner periphery of the front portion of the container body and thus causes a tip end portion side thereof to interfere when the lid is fitted into the front portion of the container body.
摘要翻译：衬底存储容器包括锁定机构，该锁定机构设置在用于打开和关闭存储三张或更少张的基板的容器主体的敞开的前部的盖中，用于锁定装配到容器主体前部的盖。锁定机构由盖子支撑，当从前面观察时，盖子基本上横向长。锁定机构包括：当盖体装配在容器主体的前部时与前述收容体的前端部的内周面抵接的前后退接合体;以及弹簧部件，其使前进后退卡合体从盖子前进到容器主体的前部的内周，并且因此当盖子装配到容器主体的前部部分时，其前端部分侧发生干涉。

7. 发明授权

US08178024B2 Injection molding die and injection molding method 失效
标题翻译：注塑模具和注塑成型方法
公开(公告)号：US08178024B2
公开(公告)日：2012-05-15
申请号：US12525980
申请日：2008-02-20
申请人： Satoshi Odashima , Hidehiro Masuko
发明人： Satoshi Odashima , Hidehiro Masuko
IPC分类号： B29C33/14 , B29C45/14
CPC分类号： B29C45/36 , B29C45/14 , B29C45/14778 , B29K2995/0026 , B29L2031/712 , B29L2031/7134 , H01L21/67346 , H01L21/67353 , H01L21/67383 , H01L21/67386
摘要： A die is formed of a cavity mold having a hollow portion and a slidable core mold that allows a core to be inserted into hollow portion of cavity mold. An insert part that has been previously molded is fitted to and supported by the front end of core of core mold. Then, insert part is inserted into die and clamped therein, then a molten molding material is injected into die so as to perform injection molding of a container body of a substrate storage container with its rear part formed with insert part. Since insert part is put into contact with hollow portion of cavity core so as to restrain vibration of tapering flat core, core of core mold will not be flapped or flexed even if difference in injection pressure occurs in the molding material.
摘要翻译：模具由具有中空部分的空腔模具和允许芯体插入空腔模具的中空部分的可滑动的芯模具形成。已经预先模制的插入部件被装配到芯模的芯的前端并由其支撑。然后，将插入部插入模具中并夹紧，然后将熔融成型材料注入模具中，以使其后部形成有插入部分的基板储存容器的容器主体进行注射成型。由于插入部分与腔芯的中空部分接触，以便抑制锥形扁芯的振动，即使模制材料中发生注射压力的差异，芯模的芯也不会翘起或弯曲。

8. 发明授权

US5336443A Anisotropically electroconductive adhesive composition 失效
标题翻译：各向异性导电粘合剂组合物
公开(公告)号：US5336443A
公开(公告)日：1994-08-09
申请号：US20564
申请日：1993-02-22
申请人： Satoshi Odashima
发明人： Satoshi Odashima
IPC分类号： C09J9/02 , H01B1/24 , H05K3/32 , H01B1/00 , H01B1/04 , H01B1/20
CPC分类号： H05K3/323 , C09J9/02 , H01B1/24 , H05K2201/0323 , H05K2203/0307 , H05K3/321
摘要： An improvement is proposed in an anisotropically electroconductive adhesive composition comprising an insulating adhesive resin as a matrix and electroconductive carbon particles dispersed in the matrix used for electrically connecting oppositely facing electrode terminals on various kinds of electronic devices and circuit boards. Different from conventional spherical carbon particles, the conductive particles used here are carbon particles each having a plurality of projections on the surface as formed, for example, by the high-temperature calcination of spherical carbon particles blended with a tar or pitch. By virtue of the projections on the carbon particles, the electric connection formed by using the inventive adhesive composition is very reliable and durable even under adverse ambient conditions involving a high temperature, high humidity, vibrations and mechanical shocks by virtue of the anchoring effect by the projections.
摘要翻译：在各向异性导电粘合剂组合物中提出了一种各向异性导电粘合剂组合物，其包含作为基质的绝缘粘合树脂和分散在用于电连接各种电子器件和电路板上的相对面对的电极端子的基质中的导电碳颗粒。与常规球形碳颗粒不同，这里使用的导电颗粒是碳颗粒，每个碳颗粒在表面上具有多个突起，例如通过与焦油或沥青混合的球形碳颗粒的高温煅烧而形成。由于碳颗粒上的突起，通过使用本发明的粘合剂组合物形成的电连接是非常可靠和耐用的，即使在涉及高温，高湿度，振动和机械冲击的恶劣环境条件下，由于锚固效应预测。

9. 发明申请

US20100206767A1 LID BODY FOR SUBSTRATE STORAGE CONTAINER AND SUBSTRATE STORAGE CONTAINER 失效
标题翻译：用于基座储存容器和底板储存容器的身体
公开(公告)号：US20100206767A1
公开(公告)日：2010-08-19
申请号：US12667894
申请日：2008-07-04
申请人： Satoshi Odashima , Hidehiro Masuko
发明人： Satoshi Odashima , Hidehiro Masuko
IPC分类号： H01L21/673 , B65D45/32
CPC分类号： H01L21/67353 , H01L21/67373 , H01L21/67379 , Y10T292/0969
摘要： A substrate storage container includes a locking mechanism, provided in a lid for opening and closing an opened front portion of a container body which stores a substrate of three sheets or less, for locking the lid fitted into the front portion of the container body. The locking mechanism is supported by the lid which is substantially laterally long when viewed from the front. The locking mechanism includes an advance/retreat engaging body that opposes an inner periphery of the front portion of the container body when the lid is fitted into the front portion of the container body, and a spring member that causes the advance/retreat engaging body to advance from the lid to the inner periphery of the front portion of the container body and thus causes a tip end portion side thereof to interfere when the lid is fitted into the front portion of the container body.
摘要翻译：衬底存储容器包括锁定机构，该锁定机构设置在用于打开和关闭存储三张或更少张的基板的容器主体的敞开的前部的盖中，用于锁定装配到容器主体前部的盖。锁定机构由盖子支撑，当从前面观察时，盖子基本上横向长。锁定机构包括：当盖体装配在容器主体的前部时与前述收容体的前端部的内周面抵接的前后退接合体;以及弹簧部件，其使前进后退卡合体从盖子前进到容器主体的前部的内周，并且因此当盖子装配到容器主体的前部部分时，其前端部分侧发生干涉。

10. 发明授权

US5484648A Heat-sealable connector and method for the preparation thereof 失效
标题翻译：热封连接器及其制备方法
公开(公告)号：US5484648A
公开(公告)日：1996-01-16
申请号：US105731
申请日：1993-08-11
申请人： Satoshi Odashima , Kazuyoshi Yoshida
发明人： Satoshi Odashima , Kazuyoshi Yoshida
IPC分类号： H01R4/04 , H05K1/00 , H05K3/12 , H05K3/32 , H05K3/38 , B32B9/00
CPC分类号： H01R4/04 , H05K3/12 , H05K1/0393 , H05K2203/0783 , H05K3/323 , H05K3/386 , Y10T428/24917 , Y10T428/249994 , Y10T428/25 , Y10T428/251 , Y10T428/254 , Y10T428/2813 , Y10T428/2817
摘要： Proposed is an improved heat-sealable connector having aligned lines of an electroconductive paste formed by screen printing on the surface of a flexible substrate. Different from conventional heat-sealable connectors, the electroconductive lines are not formed directly on the surface of the substrate but the substrate surface is first provided with a layer of a solvent-absorptive material and the electroconductive lines are formed on the solvent absorptive layer by screen printing so that the screen-printed lines of the paste never cause running to broaden the line width by virtue of immediate absorption of the solvent in the paste into the solvent-absorptive layer to contribute not only to the productivity but also to the quality of the product connectors.
摘要翻译：提出了一种改进的可热封连接器，其具有通过丝网印刷在柔性基板的表面上形成的导电浆料的对准线。与传统的可热密封连接器不同，导电线不直接形成在基板的表面上，而是首先提供一层溶剂吸收材料的基板表面，并且通过屏幕在溶剂吸收层上形成导电线印刷，使得糊状物的丝网印刷线不会导致运行，从而通过立即将糊料中的溶剂吸收到溶剂吸收层中来扩大线宽，不仅有助于生产率，而且有助于提高生产率产品连接器。

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