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    • 4. 发明授权
    • Semiconductor acceleration sensor with beam structure
    • 具有梁结构的半导体加速度传感器
    • US5619050A
    • 1997-04-08
    • US399345
    • 1995-03-06
    • Hirofumi UenoyamaKenichi AoMasakazu KanosueYasutoshi SuzukiYukihiro Takeuchi
    • Hirofumi UenoyamaKenichi AoMasakazu KanosueYasutoshi SuzukiYukihiro Takeuchi
    • G01P15/125G01P15/08G01P15/12H01L29/84H01L29/82
    • G01P15/0802G01P15/12Y10S73/01
    • A semiconductor acceleration sensor capable of reducing a leakage current and manufacturing method thereof is disclosed. A beam structure is disposed on a silicon substrate. The beam structure has a movable section, and the movable section is disposed spaced at a prescribed distance above silicon substrate. A movable electrode section is formed in one portion of movable section. Fixed electrodes made of an impurity diffusion layer are formed in silicon substrate to correspond to both sides of a movable electrode section. A peripheral circuit is formed in silicon substrate. The beam structure and the peripheral circuit are electrically connected by an electroconductive thin film, made of polysilicon. Then, when a voltage is applied to the beam structure, and a voltage is applied to both fixed electrodes, an inversion layer is formed, and an electrical current flows between the fixed electrodes. In the case where an acceleration is received and movable section is displaced, the electrical current flowing between the fixed electrodes changes.
    • 公开了能够减小漏电流的半导体加速度传感器及其制造方法。 梁结构设置在硅衬底上。 梁结构具有可移动部分,并且可移动部分设置在硅基板上方规定距离处。 可动电极部分形成在可动部分的一部分中。 在硅衬底中形成由杂质扩散层制成的固定电极,以对应于可动电极部分的两侧。 在硅衬底中形成外围电路。 光束结构和外围电路通过由多晶硅制成的导电薄膜电连接。 然后,当向梁结构施加电压并且向两个固定电极施加电压时,形成反型层,并且电流在固定电极之间流动。 在接收到加速度并且可移动部分移位的情况下,在固定电极之间流动的电流改变。
    • 5. 发明授权
    • Method for fabricating a semiconductor acceleration sensor
    • 半导体加速度传感器的制造方法
    • US5851851A
    • 1998-12-22
    • US399342
    • 1995-03-06
    • Hirofumi UenoyamaMasakazu KanosueKenichi AoYasutoshi Suzuki
    • Hirofumi UenoyamaMasakazu KanosueKenichi AoYasutoshi Suzuki
    • G01P15/08G01P15/12H01L21/78
    • G01P15/0802G01P15/124G01P2015/0814
    • It is an object to provide a method of fabrication for a semiconductor acceleration sensor which can prevent destruction of a movable portion during dicing. A sacrificial layer composed of silicon oxide film is formed on a silicon substrate, and a movable member composed of polycrystalline silicon is formed on the sacrificial layer. A polyimide film is applied on the movable member at room temperature and heated to approximately 350.degree. C. to harden. The movable member is supported by this polyimide film. Accordingly, etching liquid penetration holes are formed on the polyimide film. Further, the sacrificial layer disposed between the movable member and the silicon substrate is etched away by means of dipping the silicon substrate into hydrofluoric acid-based etching liquid. Thereafter, the silicon substrate is dipped into demineralized water to replace the etching liquid with demineralized water, and subsequently the silicon substrate is dried. Accordingly, the silicon substrate is diced and thereafter the polyimide film is etched away by O.sub.2 ashing.
    • 本发明的目的是提供一种半导体加速度传感器的制造方法,其可以防止在切割期间可动部分的破坏。 在硅衬底上形成由氧化硅膜构成的牺牲层,在牺牲层上形成由多晶硅构成的可动构件。 将聚酰亚胺膜在室温下涂布在可动件上并加热至约350℃以硬化。 可动构件由该聚酰亚胺膜支撑。 因此,在聚酰亚胺膜上形成蚀刻液体穿透孔。 此外,通过将硅衬底浸入氢氟酸蚀刻液中,设置在可移动部件和硅衬底之间的牺牲层被蚀刻掉。 此后,将硅衬底浸入软化水​​中以用软化水代替蚀刻液,随后将硅衬底干燥。 因此,对硅衬底进行切割,然后通过氧化物灰蚀蚀刻掉聚酰亚胺膜。
    • 8. 发明授权
    • Magnetoresistive element and manufacturing method therefor
    • 磁阻元件及其制造方法
    • US5471084A
    • 1995-11-28
    • US94142
    • 1993-07-30
    • Yasutoshi SuzukiKenichi AoHirofumi UenoyamaHiroki NoguchiKoji EguchiIchiro ItoYoshimi Yoshino
    • Yasutoshi SuzukiKenichi AoHirofumi UenoyamaHiroki NoguchiKoji EguchiIchiro ItoYoshimi Yoshino
    • H01L43/08H01L27/22
    • H01L43/08
    • This invention relates to a magnetoresistive element used for a magnetic sensor, etc. A ferromagnetic magnetoresistive element thin film is formed so as to be electrically connected to and so as to overlap the upper end portion of an aluminum wiring metal on a substrate. Through using a vacuum heat treatment with a temperature between 350.degree. and 450.degree. C., a Ni--Al-based alloy is formed at the overlapping portion. Therefore, even when a surface protection film of silicon nitride is subsequently formed by plasma CVD on the substrate, the alloy prevents the nitriding of the upper end portion of the aluminum wiring metal. Accordingly, the surface can be protected from moisture by the silicon nitride film without increasing the contact resistance between the magnetoresistive element thin film and the wiring metal. Instead of the Ni--Al-based alloy, other conductive metals such as TiW, TiN, Ti, Zr, or the like may be used. Also, the surface protection film may be a multi-layered film having a first film containing no nitrogen, such as a silicon oxide film, and a second film of silicon nitride film formed on the first film.
    • PCT No.PCT / JP92 / 01581 Sec。 371日期:1993年7月30日 102(e)日期1993年7月30日PCT提交1992年12月3日PCT公布。 公开号WO93 / 11569 日本特许公报1993年6月10日。本发明涉及用于磁传感器等的磁阻元件。铁磁磁阻元件薄膜形成为与铝布线的上端部电连接并与其重叠 金属在基板上。 通过使用350〜450℃的真空热处理,在重叠部分形成Ni-Al系合金。 因此,即使在基板上随后通过等离子体CVD形成氮化硅的表面保护膜,合金也能防止铝布线金属的上端部的氮化。 因此,可以防止表面被氮化硅膜防止湿气,而不增加磁阻元件薄膜和布线金属之间的接触电阻。 可以使用TiW,TiN,Ti,Zr等其他导电性金属代替Ni-Al系合金。 此外,表面保护膜也可以是具有不含氮的第一膜的多层膜,例如氧化硅膜,以及形成在第一膜上的第二氮化硅膜。
    • 10. 发明授权
    • Rotation detector having two pairs of symmetrically positioned magnetoresistive element circuits
    • 旋转检测器具有两对对称位置的磁阻元件电路
    • US06366079B1
    • 2002-04-02
    • US09699557
    • 2000-10-31
    • Hirofumi Uenoyama
    • Hirofumi Uenoyama
    • G01B730
    • G01D5/147G01P3/488G01R33/09
    • Rotation of a rotating object such as a toothed rotor is detected based on put potentials of a bridge circuit having four magnetoresistive elements. The bridge circuit formed on an integrated circuit chip is positioned in a biasing magnetic field generated by a magnet disposed at a vicinity of the toothed rotor. A pair of magnetoresistive elements form a first circuit in the bridge while the others pairs forms a second circuit. To cancel influence of magnetostrictive effects due to an external force imposed on the integrated circuit chip, the first and second circuits in the bridge are positioned symmetrically to each other with respect to a center line of the biasing magnetic field.
    • 基于具有四个磁阻元件的桥接电路的放置电位检测诸如齿形转子的旋转物体的旋转。 形成在集成电路芯片上的桥接电路位于由设置在齿形转子附近的磁体产生的偏置磁场中。 一对磁阻元件在桥中形成第一电路,而其它对形成第二电路。 为了消除由于施加在集成电路芯片上的外力引起的磁致伸缩效应的影响,桥中的第一和第二电路相对于偏置磁场的中心线对称地定位。