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1. 发明授权

US07686588B2 Liquid chemical supply system having a plurality of pressure detectors 有权
标题翻译：具有多个压力检测器的液体化学物质供应系统
公开(公告)号：US07686588B2
公开(公告)日：2010-03-30
申请号：US11581464
申请日：2006-10-17
申请人： Katsuya Okumura , Tetsuya Toyoda , Tomohiro Ito , Akira Murakumo , Atsuyuki Sakai
发明人： Katsuya Okumura , Tetsuya Toyoda , Tomohiro Ito , Akira Murakumo , Atsuyuki Sakai
IPC分类号： F04B49/22
CPC分类号： F04B49/08
摘要： A liquid chemical supply system that performs accurate pressure feedback control and controls the discharge flow rate of liquid chemical with high precision, even when the pressure setting value of the operation pressure differs due to changes in the type of liquid chemical, includes a pump having a pump chamber and an operation chamber separated by a diaphragm comprised of a flexible membrane. The intake and discharge of liquid chemical is performed in accordance with the change in pressure inside the operation chamber. An electro-pneumatic regulator supplies operation gas pressure to the operation chamber. A plurality of pressure sensors having different pressure detection ranges is provided for detecting the operation gas pressure. A controller selectively employs any of the detection results of the plurality of sensors in accordance with the pressure setting value of the operation air that is set for each use, and performs pressure feedback control.
摘要翻译：一种液体化学品供应系统，即使当由于液体化学品的类型的变化而导致的操作压力的压力设定值不同时，也能够精确地进行精确的压力反馈控制和控制液体化学品的排出流量，包括具有泵室和由包括柔性膜的隔膜隔开的操作室。根据操作室内的压力变化进行液体化学品的进出。电动气动调节器将操作气体压力提供给操作室。提供具有不同压力检测范围的多个压力传感器用于检测操作气体压力。控制器根据为每次使用设定的操作空气的压力设定值选择性地使用多个传感器的检测结果，并进行压力反馈控制。

2. 发明申请

US20070122291A1 Liquid chemical supply system having a plurality of pressure detectors 有权
标题翻译：具有多个压力检测器的液体化学物质供应系统
公开(公告)号：US20070122291A1
公开(公告)日：2007-05-31
申请号：US11581464
申请日：2006-10-17
申请人： Katsuya Okumura , Tetsuya Toyoda , Tomohiro Ito , Akira Murakumo , Atsuyuki Sakai
发明人： Katsuya Okumura , Tetsuya Toyoda , Tomohiro Ito , Akira Murakumo , Atsuyuki Sakai
IPC分类号： F04B49/00
CPC分类号： F04B49/08
摘要： [Problem] To always perform accurate pressure feedback control, and control the discharge flow rate of liquid chemical with high precision, even in situations in which the pressure setting value of the operation pressure differs due to changes in the type of liquid chemical, etc. [Means of solution] A pump 11 has a pump chamber 13 and an operation chamber 14 separated by a diaphragm 12 comprised of a flexible membrane, and performs the intake and discharge of liquid chemical in accordance with the change in pressure inside the operation chamber 14. An electro-pneumatic regulator 32 supplies operation air to the operation chamber 14. In addition, in the present system, a plurality of pressure sensors 51, 63 having different pressure detection ranges is provided as pressure detection means for detecting the operation air pressure. A controller 40 selectively employs any of the detection results of the plurality of sensors 51, 63 in accordance with the pressure setting value of the operation air that is set for each use, and performs pressure feedback control.
摘要翻译： [问题]为了始终进行精确的压力反馈控制，并且即使在由于液体化学品的类型的变化而导致的操作压力的设定值不同的情况下也能够高精度地控制液体化学品的排出流量。 [解决方案]泵11具有由柔性膜构成的隔膜12隔开的泵室13和操作室14，并根据操作室14内的压力变化进行液体化学品的进出。。电动气动调节器32将操作空气供给到操作室14。此外，在本系统中，具有不同压力检测范围的多个压力传感器51,63被设置为用于检测操作空气压力的压力检测装置。控制器40根据为每次使用设定的操作空气的压力设定值选择性地使用多个传感器51,63的检测结果中的任一个，并进行压力反馈控制。

3. 发明授权

US07988429B2 Chemical liquid supply system 有权
标题翻译：化学液体供应系统
公开(公告)号：US07988429B2
公开(公告)日：2011-08-02
申请号：US11659727
申请日：2005-07-29
申请人： Katsuya Okumura , Shigenobu Itoh , Tetsuya Toyoda , Kazuhiro Sugata
发明人： Katsuya Okumura , Shigenobu Itoh , Tetsuya Toyoda , Kazuhiro Sugata
IPC分类号： B65D37/00 , B65D83/00
CPC分类号： F04F1/06 , F04B43/073 , Y10T137/3124
摘要： A chemical liquid supply system that prevents the generation of heat during operation in a pump and allows downsizing the discharge pump for instilling a chemical liquid from a tip nozzle. Compressed air is supplied to an upper space of a resist bottle and the chemical liquid is conferred positive pressure and sent out to a pump chamber of a discharge pump, thereby the pump chamber is filled with a resist liquid. This eliminates the need of a conventional construction where a spring or others are used to drive a flexible membrane of the discharge pump to the operation chamber side to take in the resist liquid. As a result, no electric motor is used, so there is obviously no risk of heat damage to a semiconductor wafer and the discharge pump itself can be further downsized.
摘要翻译：一种化学液体供应系统，其防止在泵中操作期间产生热量并且允许排气泵小型化以从尖端喷嘴滴入化学液体。将压缩空气供给到抗蚀剂瓶的上部空间，并将化学液体赋予正压，并送出到排出泵的泵室，由此泵室中填充有抗蚀剂液体。这消除了使用弹簧等来驱动排出泵的柔性膜到操作室侧以吸收抗蚀剂液体的常规结构的需要。结果，不使用电动机，因此显然没有对半导体晶片的热损伤的风险，并且可以进一步减小排出泵本身的尺寸。

4. 发明申请

US20070267065A1 Chemical Liquid Supply System 有权
标题翻译：化学液体供应系统
公开(公告)号：US20070267065A1
公开(公告)日：2007-11-22
申请号：US11659727
申请日：2005-07-29
申请人： Katsuya Okumura , Shibenobu Itoh , Tetsuya Toyoda , Kazuhiro Sugata
发明人： Katsuya Okumura , Shibenobu Itoh , Tetsuya Toyoda , Kazuhiro Sugata
IPC分类号： F04B43/06 , F04B43/10
CPC分类号： F04F1/06 , F04B43/073 , Y10T137/3124
摘要： A chemical liquid supply system that prevents the generation of heat during operation in a pump and allows downsizing the discharge pump for instilling a chemical liquid from a tip nozzle. Compressed air is supplied to an upper space of a resist bottle and the chemical liquid is conferred positive pressure and sent out to a pump chamber of a discharge pump, thereby the pump chamber is filled with a resist liquid. This eliminates the need of a conventional construction where a spring or others are used to drive a flexible membrane of the discharge pump to the operation chamber side to take in the resist liquid. As a result, no electric motor is used, so there is obviously no risk of heat damage to a semiconductor wafer and the discharge pump itself can be further downsized.
摘要翻译：一种化学液体供应系统，其防止在泵中操作期间产生热量并且允许排气泵小型化以从尖端喷嘴滴入化学液体。将压缩空气供给到抗蚀剂瓶的上部空间，并将化学液体赋予正压，并送出到排出泵的泵室，由此泵室中填充有抗蚀剂液体。这消除了使用弹簧等来驱动排出泵的柔性膜到操作室侧以吸收抗蚀剂液体的常规结构的需要。结果，不使用电动机，因此显然没有对半导体晶片的热损伤的风险，并且可以进一步减小排出泵本身的尺寸。

5. 发明授权

US09034467B2 Reticle chuck cleaner 有权
标题翻译：标线卡盘清洁剂
公开(公告)号：US09034467B2
公开(公告)日：2015-05-19
申请号：US13192694
申请日：2011-07-28
申请人： Masamitsu Itoh , Katsuya Okumura , Taro Inada , Jun Watanabe
发明人： Masamitsu Itoh , Katsuya Okumura , Taro Inada , Jun Watanabe
IPC分类号： B32B7/12 , B08B7/00 , G03F7/20
CPC分类号： B08B7/0028 , B05D3/0254 , B05D5/00 , G03F7/707 , G03F7/70925 , Y10T428/28 , Y10T428/2848
摘要： According to one embodiment, a reticle chuck cleaner for cleaning a reticle chuck of an EUV exposure apparatus includes a substrate having a shape to be carried to the reticle chuck of the EUV exposure apparatus, and an adhesive formed on one of the main surfaces of the substrate.
摘要翻译：根据一个实施例，用于清洁EUV曝光装置的光罩卡盘的掩模版卡盘清洁器包括具有要携带到EUV曝光装置的掩模版卡盘的形状的基板，以及形成在其中一个主表面上的粘合剂基质。

6. 发明申请

US20130313429A1 METHOD AND APPARATUS FOR INSPECTING SAMPLE SURFACE 有权
公开(公告)号：US20130313429A1
公开(公告)日：2013-11-28
申请号：US13954425
申请日：2013-07-30
申请人： Nobuharu Noji , Yoshihiko Naito , Hirosi Sobukawa , Kenji Terao , Masahiro Hatakeyama , Katsuya Okumura
发明人： Nobuharu Noji , Yoshihiko Naito , Hirosi Sobukawa , Kenji Terao , Masahiro Hatakeyama , Katsuya Okumura
IPC分类号： H01J37/26
CPC分类号： H01J37/265 , G01R31/307 , H01J37/04 , H01J2237/2441 , H01J2237/2446 , H01J2237/2594 , H01J2237/2817
摘要： Provided is a method and an apparatus for inspecting a sample surface with high accuracy. Provided is a method for inspecting a sample surface by using an electron beam method sample surface inspection apparatus, in which an electron beam generated by an electron gun of the electron beam method sample surface inspection apparatus is irradiated onto the sample surface, and secondary electrons emanating from the sample surface are formed into an image toward an electron detection plane of a detector for inspecting the sample surface, the method characterized in that a condition for forming the secondary electrons into an image on a detection plane of the detector is controlled such that a potential in the sample surface varies in dependence on an amount of the electron beam irradiated onto the sample surface.

7. 发明授权

US08324726B2 Semiconductor device, electrode member and electrode member fabrication method 有权
标题翻译：半导体器件，电极部件和电极部件的制造方法
公开(公告)号：US08324726B2
公开(公告)日：2012-12-04
申请号：US11351338
申请日：2006-02-10
申请人： Katsuya Okumura , Yoshikazu Takahashi , Kazunori Takenouchi
发明人： Katsuya Okumura , Yoshikazu Takahashi , Kazunori Takenouchi
IPC分类号： H01L23/34
CPC分类号： H01L23/49811 , H01L23/49827 , H01L24/37 , H01L24/40 , H01L24/45 , H01L24/48 , H01L25/0655 , H01L25/072 , H01L2224/37147 , H01L2224/40095 , H01L2224/40139 , H01L2224/40225 , H01L2224/45015 , H01L2224/45124 , H01L2224/45147 , H01L2224/48091 , H01L2224/83801 , H01L2224/84801 , H01L2924/00014 , H01L2924/01002 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01019 , H01L2924/01023 , H01L2924/01029 , H01L2924/01033 , H01L2924/01042 , H01L2924/01068 , H01L2924/01074 , H01L2924/01078 , H01L2924/01082 , H01L2924/014 , H01L2924/1305 , H01L2924/13055 , H01L2924/351 , H05K1/115 , H01L2924/00 , H01L2924/00015 , H01L2224/05599
摘要： A semiconductor device that improves the heat cycle resistance and power cycle resistance of a power module. An electrode member in which copper posts are formed in a plurality of perforations cut in a support made of a ceramic material is soldered onto a side of an IGBT where an emitter electrode is formed. By soldering the copper posts onto the electrode, heat generated in the IGBT is transferred to the electrode member and is radiated. In addition, even if a material of which the IGBT is made and copper differ in thermal expansivity, stress on a soldered interface is reduced and distortion is reduced. This suppresses the appearance of a crack. As a result, the heat cycle resistance and power cycle resistance of a power module can be improved.
摘要翻译：一种改善功率模块的热循环电阻和功率循环电阻的半导体器件。在由陶瓷材料制成的支撑体上切割的多个穿孔中形成铜柱的电极部件被焊接到形成有发射极的IGBT的一侧。通过将铜柱焊接到电极上，在IGBT中产生的热量转移到电极部件并被辐射。此外，即使制造IGBT的材料和铜的热膨胀性不同，焊接界面上的应力降低，并且变形减小。这样可以抑制裂纹的出现。结果，可以提高功率模块的耐热循环电阻和功率循环电阻。

8. 发明授权

US08283755B2 Multichip semiconductor device, chip therefor and method of formation thereof 有权
标题翻译：多芯片半导体器件，芯片及其形成方法
公开(公告)号：US08283755B2
公开(公告)日：2012-10-09
申请号：US13067180
申请日：2011-05-13
申请人： Nobuo Hayasaka , Katsuya Okumura , Keiichi Sasaki , Mie Matsuo
发明人： Nobuo Hayasaka , Katsuya Okumura , Keiichi Sasaki , Mie Matsuo
IPC分类号： H01L29/40
CPC分类号： H01L23/642 , H01L21/76898 , H01L23/367 , H01L23/481 , H01L25/0655 , H01L25/0657 , H01L25/105 , H01L25/50 , H01L2224/0401 , H01L2224/0557 , H01L2224/06181 , H01L2224/13025 , H01L2224/14181 , H01L2224/16145 , H01L2224/16225 , H01L2224/32225 , H01L2224/73204 , H01L2225/06513 , H01L2225/06527 , H01L2225/06541 , H01L2225/06572 , H01L2225/06589 , H01L2225/1023 , H01L2225/1058 , H01L2924/01046 , H01L2924/01057 , H01L2924/01078 , H01L2924/01079 , H01L2924/10253 , H01L2924/13091 , H01L2924/15174 , H01L2924/15192 , H01L2924/15311 , H01L2924/1532 , H01L2924/15331 , H01L2924/00
摘要： A multichip semiconductor device is disclosed in which chips are stacked each of which comprises a semiconductor substrate formed on top with circuit components and an interlayer insulating film formed on the top of the semiconductor substrate. At least one of the chips has a connect plug of a metal formed in a through hole that passes through the semiconductor substrate and the interlayer insulating film. The chip with the connect plug is electrically connected with another chip by that connect plug.
摘要翻译：公开了一种多芯片半导体器件，其中堆叠芯片，每个芯片包括形成在顶部的半导体衬底和电路部件，以及形成在半导体衬底的顶部上的层间绝缘膜。至少一个芯片具有穿过半导体衬底和层间绝缘膜的通孔中形成的金属的连接插头。具有连接插头的芯片通过该连接插头与另一个芯片电连接。

9. 发明授权

US08247289B2 Capacitor and manufacturing method thereof 有权
标题翻译：电容器及其制造方法
公开(公告)号：US08247289B2
公开(公告)日：2012-08-21
申请号：US11508141
申请日：2006-08-23
申请人： Yoshiki Yamanishi , Muneo Harada , Takahiro Kitano , Tatsuzo Kawaguchi , Yoshihiro Hirota , Kinji Yamada , Tomotaka Shinoda , Katsuya Okumura , Shuichi Kawano
发明人： Yoshiki Yamanishi , Muneo Harada , Takahiro Kitano , Tatsuzo Kawaguchi , Yoshihiro Hirota , Kinji Yamada , Tomotaka Shinoda , Katsuya Okumura , Shuichi Kawano
IPC分类号： H01L21/8242 , H01L21/20 , H01L21/00
CPC分类号： H01L23/50 , H01G4/228 , H01G4/33 , H01L23/481 , H01L24/81 , H01L2224/81801 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01029 , H01L2924/01033 , H01L2924/01056 , H01L2924/01072 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/14 , H01L2924/19041 , H01L2924/30105 , H05K1/162 , H05K3/002 , H05K2201/09509 , H05K2201/096 , H05K2201/10378
摘要： A capacitor having a high quality and a manufacturing method of the same are provided.A capacitor has a lower electrode formed on an oxide film, a dielectric layer formed on the lower electrode, an upper electrode formed so as to face the lower electrode with the dielectric layer between, and an upper electrode formed so as to cover the upper electrode, an opening portion of the upper electrode and an opening portion of the dielectric layer. By forming the upper electrode on the dielectric layer, it is possible to pattern the dielectric layer by using the upper electrode as a mask, and provide a capacitor having a high-quality dielectric layer by preventing impurity diffusion into the dielectric layer. By forming the upper electrode on the dielectric layer, it is possible to prevent the dielectric layer from being exposed to etching liquid, liquid developer, etc.
摘要翻译：提供了具有高质量的电容器及其制造方法。电容器具有形成在氧化膜上的下电极，形成在下电极上的电介质层，形成为与电极之间介电层相对的下电极的上电极和形成为覆盖上电极的上电极，上电极的开口部分和电介质层的开口部分。通过在电介质层上形成上电极，可以通过使用上电极作为掩模对电介质层进行图案化，并且通过防止杂质扩散到电介质层中来提供具有高质量电介质层的电容器。通过在电介质层上形成上部电极，可以防止电介质层暴露于蚀刻液体，液体显影剂等

10. 发明授权

US08174093B2 Multichip semiconductor device, chip therefor and method of formation thereof 有权
公开(公告)号：US08174093B2
公开(公告)日：2012-05-08
申请号：US12926104
申请日：2010-10-26
申请人： Nobuo Hayasaka , Katsuya Okumura , Keiichi Sasaki , Mie Matsuo
发明人： Nobuo Hayasaka , Katsuya Okumura , Keiichi Sasaki , Mie Matsuo
IPC分类号： H01L29/40
CPC分类号： H01L23/642 , H01L21/76898 , H01L23/367 , H01L23/481 , H01L25/0655 , H01L25/0657 , H01L25/105 , H01L25/50 , H01L2224/0401 , H01L2224/0557 , H01L2224/06181 , H01L2224/13025 , H01L2224/14181 , H01L2224/16145 , H01L2224/16225 , H01L2224/32225 , H01L2224/73204 , H01L2225/06513 , H01L2225/06527 , H01L2225/06541 , H01L2225/06572 , H01L2225/06589 , H01L2225/1023 , H01L2225/1058 , H01L2924/01046 , H01L2924/01057 , H01L2924/01078 , H01L2924/01079 , H01L2924/10253 , H01L2924/13091 , H01L2924/15174 , H01L2924/15192 , H01L2924/15311 , H01L2924/1532 , H01L2924/15331 , H01L2924/00
摘要： A multichip semiconductor device is disclosed in which chips are stacked each of which comprises a semiconductor substrate formed on top with circuit components and an interlayer insulating film formed on the top of the semiconductor substrate. At least one of the chips has a connect plug of a metal formed in a through hole that passes through the semiconductor substrate and the interlayer insulating film. The chip with the connect plug is electrically connected with another chip by that connect plug.

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