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1. 发明授权

US4220707A Epoxy resin composition for image formation 失效
标题翻译：用于图像形成的环氧树脂组合物
公开(公告)号：US4220707A
公开(公告)日：1980-09-02
申请号：US898793
申请日：1978-04-24
申请人： Kaoru Ohmura , Kiichiro Sasaguri , Kazuo Toyomoto
发明人： Kaoru Ohmura , Kiichiro Sasaguri , Kazuo Toyomoto
IPC分类号： C08G59/00 , C08G59/68 , G03F7/004 , G03F7/038 , H05K3/00 , G03C5/00 , G03C1/68
CPC分类号： G03F7/0385 , Y10S430/12 , Y10S430/128
摘要： An epoxy resin composition comprising an epoxy compound having an average of one or more epoxy groups per molecule, an amine curing agent and a reductive metal compound or complex can produce excellent developed color images, and concave-convex images by energy irradiation. The epoxy resin composition can give excellent physical, chemical and electrical properties to the formed images and various inorganic and organic materials can be used as substrate.
摘要翻译：包含每分子平均具有一个或多个环氧基的环氧化合物，胺固化剂和还原性金属化合物或络合物的环氧树脂组合物可以通过能量照射产生优异的显色图像和凹凸图像。环氧树脂组合物可以对所形成的图像提供优异的物理，化学和电学性质，并且可以使用各种无机和有机材料作为基材。

2. 发明授权

US3956239A Epoxy resin composition including amide derivative of 4-aminomethyl-1,8-diaminooctane 失效
标题翻译：环氧树脂组合物包括4-氨基甲基-1,8-二氨基辛烷的酰胺衍生物
公开(公告)号：US3956239A
公开(公告)日：1976-05-11
申请号：US518016
申请日：1974-10-25
申请人： Hiroshi Komoto , Kazuo Toyomoto , Kaoru Ohmura , Kenji Ito , Hideo Sekiguchi
发明人： Hiroshi Komoto , Kazuo Toyomoto , Kaoru Ohmura , Kenji Ito , Hideo Sekiguchi
IPC分类号： C08G59/54 , C08G30/14
CPC分类号： C08G59/54
摘要： An epoxy resin composition having excellent curability comprising 100 parts by weight of an epoxy resin having at least two epoxy groups per molecule and about 1 to 300 parts by weight of an amide derivative of 4-aminomethyl-1,8-diaminooctane.
摘要翻译：具有优异固化性的环氧树脂组合物，其包含100重量份的每分子具有至少两个环氧基的环氧树脂和约1至300重量份的4-氨基甲基-1,8-二氨基辛烷的酰胺衍生物。

3. 发明授权

US4208477A Heat resistant photoresist composition and process for preparing the same 失效
标题翻译：耐热光致抗蚀剂组合物及其制备方法
公开(公告)号：US4208477A
公开(公告)日：1980-06-17
申请号：US961462
申请日：1978-11-16
申请人： Kaoru Ohmura , Ichiro Shibasaki , Takeo Kimura
发明人： Kaoru Ohmura , Ichiro Shibasaki , Takeo Kimura
IPC分类号： C08G73/14 , G03F7/037 , G03F7/038 , G03C1/72
CPC分类号： C08G73/14 , G03F7/037 , G03F7/0387
摘要： An organic polar solvent-soluble aromatic polyamide-imide having therein aromatic nuclei linked at their respective 1- and 3-positions and having therein amide linkages and terminal groups unsubstituted or partially substituted with acrylate or methacrylate groups is found to impart excellent heat resistance and insulating property to a photoresist composition produced therefrom.
摘要翻译：其中具有其各自的1-位和3-位上具有酰胺键和未被取代或部分被丙烯酸酯或甲基丙烯酸酯基团取代的端基的芳族核的有机极性溶剂可溶性芳族聚酰胺 - 酰亚胺被发现赋予优异的耐热性和绝缘性性质由其制备的光致抗蚀剂组合物。

4. 发明授权

US4310641A Heat resistant photoresist composition and process for preparing the same 失效
标题翻译：耐热光致抗蚀剂组合物及其制备方法
公开(公告)号：US4310641A
公开(公告)日：1982-01-12
申请号：US062800
申请日：1979-08-01
申请人： Kaoru Ohmura , Ichiro Shibasaki , Takeo Kimura , Muneaki Kimura
发明人： Kaoru Ohmura , Ichiro Shibasaki , Takeo Kimura , Muneaki Kimura
IPC分类号： C08G73/14 , G03F7/037 , G03F7/038 , C08F283/04 , C08G63/76
CPC分类号： C08G73/14 , G03F7/037 , G03F7/0387
摘要： An organic polar solvent-soluble aromatic polyamide-imide having therein aromatic nuclei linked at their respective 1 - and 3 -positions and having therein amide linkages and terminal groups partially substituted with cinnamate groups is found to impart excellent heat resistance and insulating property to a photoresist composition produced therefrom.
摘要翻译：其中具有其各自的1位和3位上具有酰胺键和部分被肉桂酸酯基取代的末端基团的芳族核的有机极性溶剂可溶性芳族聚酰胺 - 酰亚胺被发现赋予光致抗蚀剂优异的耐热性和绝缘性由其制备的组合物。

5. 发明授权

US4180404A Heat resistant photoresist composition and process for preparing the same 失效
标题翻译：耐热光致抗蚀剂组合物及其制备方法
公开(公告)号：US4180404A
公开(公告)日：1979-12-25
申请号：US961534
申请日：1978-11-16
申请人： Kaoru Ohmura , Ichiro Shibasaki , Takeo Kimura , Muneaki Kimura
发明人： Kaoru Ohmura , Ichiro Shibasaki , Takeo Kimura , Muneaki Kimura
IPC分类号： C08G73/14 , G03F7/037 , G03F7/038 , G03C1/72 , C08G18/00
CPC分类号： C08G73/14 , G03F7/037 , G03F7/0387
摘要： An organic polar solvent-soluble aromatic polyamide-imide having therein aromatic nuclei linked at their respective 1- and 3- positions and having therein amide linkages and terminal groups partially substituted with cinnamate groups is found to impart excellent heat resistance and insulating property to a photoresist composition produced therefrom.
摘要翻译：其中具有其各自的1-和3-位上具有酰胺键和部分被肉桂酸酯基取代的末端基团的芳族核的有机极性溶剂可溶性芳族聚酰胺 - 酰亚胺被发现赋予光致抗蚀剂优异的耐热性和绝缘性由其制备的组合物。

6. 发明授权

US4377652A Polyamide-imide compositions and articles for electrical use prepared therefrom 失效
标题翻译：聚酰胺 - 酰亚胺组合物和由其制备的电用制品
公开(公告)号：US4377652A
公开(公告)日：1983-03-22
申请号：US10290
申请日：1979-02-08
申请人： Kaoru Ohmura , Ichiro Shibasaki , Takeo Kimura
发明人： Kaoru Ohmura , Ichiro Shibasaki , Takeo Kimura
IPC分类号： C08K5/54 , C08L79/08 , H01B3/30 , H05K1/03 , C08G73/14
CPC分类号： H01B3/306 , C08K3/08 , C08K3/10 , C08K5/54 , H01B3/305 , H05K1/0346
摘要： An article for electrical use such as insulative substrates, electrical circuit borads and electrical elements, wholly or partly consisting out of an aromatic polyamide-imide having a reduced viscosity of from about 0.3 to 1.5, which polyamide-imide may contain a granular material dispersed therein, and a composition comprising 100 parts by weight of said polyamide-imide and additional about 100 to 4,000 parts by weight of a granular material and optionally about 10 to 10,000 parts by weight of a polar organic solvent.
摘要翻译：一种用于电气用途的物品，例如绝缘基材，电路桥接器和电气元件，其全部或部分由具有约0.3至1.5的比浓粘度的芳族聚酰胺 - 酰亚胺组成，该聚酰胺 - 酰亚胺可以含有分散在其中的颗粒状物质，以及包含100重量份所述聚酰胺 - 酰亚胺和另外约100至4,000重量份颗粒材料和任选地约10至10,000重量份极性有机溶剂的组合物。

7. 发明授权

US4316974A Polymers for use in heat resistant photoresist composition and process for preparing the same 失效
标题翻译：用于耐热光致抗蚀剂组合物的聚合物及其制备方法
公开(公告)号：US4316974A
公开(公告)日：1982-02-23
申请号：US104050
申请日：1979-12-17
申请人： Kaoru Ohmura , Ichiro Shibasaki , Takeo Kimura
发明人： Kaoru Ohmura , Ichiro Shibasaki , Takeo Kimura
IPC分类号： C08G73/14 , G03F7/037 , G03F7/038 , C08G73/10 , C08F8/00
CPC分类号： C08G73/14 , G03F7/037 , G03F7/0387
摘要： An organic polar solvent-soluble aromatic polyamide-imide having therein aromatic nuclei linked at their respective 1 - and 3 - positions and having therein amide linkages and terminal groups unsubstituted or partially substituted with acrylate or methacrylate groups is found to impart excellent heat resistance and insulating property to a photoresist composition produced therefrom.
摘要翻译：其中具有芳香族核的有机极性溶剂可溶性芳族聚酰胺 - 酰亚胺在其相应的1和3位上连接并且具有未取代或部分被丙烯酸酯或甲基丙烯酸酯基团取代的酰胺键和端基的化合物被发现赋予优异的耐热性和绝缘性性质由其制备的光致抗蚀剂组合物。

8. 发明授权

US4401521A Method for manufacturing a fine-patterned thick film conductor structure 失效
标题翻译：精细图案化的厚膜导体结构的制造方法
公开(公告)号：US4401521A
公开(公告)日：1983-08-30
申请号：US323337
申请日：1981-11-20
申请人： Kaoru Ohmura , Ryohei Koyama , Takeo Kimura
发明人： Kaoru Ohmura , Ryohei Koyama , Takeo Kimura
IPC分类号： H05K3/20 , H05K3/38 , C25D1/00 , C25D1/20
CPC分类号： H05K3/205 , H05K2203/0152 , H05K2203/0376 , H05K2203/0726 , H05K3/386
摘要： A method for manufacturing a fine-patterned thick film conductor structure free from ununiformity in film thickness comprises steps of forming resist on a thin metal plate at areas other than land areas, electroplating the thin metal plate using the thin metal plate as a cathode electrode to form conductors having a circuit density of no less than three lines/mm and a thickness of 15-200 .mu.m, bonding the electroplated thin metal plate to an insulative substrate with the thin metal plate side facing up and etching the thin metal plate. The fine-patterned conductors are suited for use in small-sized coils, high density connectors and high density wirings.Further disclosed is a method for manufacturing a fine-patterned thick film printed circuit board free from side protrusion comprising steps of forming resist on a thin metal plate at areas other than land areas, electroplating the thin metal plate to a thickness of 0.3-10 .mu.m at a current density of 0.05-2 A/dm.sup.2, electroplating the thin metal plate to a desired final thickness at a current density of 3-20 A/dm.sup.2, and removing all or the areas other than the land areas of the thin metal plate.
摘要翻译：制造薄膜厚度不均匀的精细图案化的厚膜导体结构的方法包括以下步骤：在金属板之外的区域以外的区域上形成抗蚀剂，使用薄金属板作为阴极电镀薄金属板电路密度不小于三线/毫米，厚度为15-200微米的导体，将电镀薄金属板接合到绝缘基板上，薄金属板面朝上并蚀刻薄金属板。精细图案导体适用于小型线圈，高密度连接器和高密度布线。进一步公开了一种制造没有侧面突起的精细图案化的厚膜印刷电路板的方法，包括以下步骤：在金属板上的除了陆地区域之外的区域上形成抗蚀剂，将薄金属板电镀至0.3-10μm的厚度 m，电流密度为0.05-2A / dm 2，以3-20A / dm 2的电流密度将薄金属板电镀到所需的最终厚度，并除去薄金属以外的所有或其他区域盘子。

9. 发明授权

US4392013A Fine-patterned thick film conductor structure and manufacturing method thereof 失效
标题翻译：精细图案厚膜导体结构及其制造方法
公开(公告)号：US4392013A
公开(公告)日：1983-07-05
申请号：US219155
申请日：1980-12-22
申请人： Kaoru Ohmura , Takeo Kimura , Tetsuhiro Kusunose
发明人： Kaoru Ohmura , Takeo Kimura , Tetsuhiro Kusunose
IPC分类号： H01L21/70 , H05K1/00 , H05K1/16 , H05K3/10 , H05K3/18 , H05K3/24 , H05K3/38 , H05K1/02
CPC分类号： H01L21/705 , H05K1/165 , H05K3/108 , H05K3/241 , H05K1/0393 , H05K2203/0723 , H05K3/181 , H05K3/388
摘要： In manufacturing a fine-patterned thick film conductor structure, a thin film conductor layer having a film thickness of 0.1-10 .mu.m is formed on an insulating substrate and conductive material is then electroplated on the thin film conductor layer to the thickness of 34.9-190 .mu.m under the condition of a cathode current density of no less than 5 A/dm.sup.2. In patterning the conductors, a film thickness-to-conductor interspacing ratio is selected to be no less than 1.4 to prevent widthwise thickening of the conductors in the electroplating process. Resulting conductor structure has a circuit density of no less than 5 lines/mm and a film thickness of 35-200 .mu.m. It is useful for a high density printed circuit board and a miniature coil.
摘要翻译：在精细图案化的厚膜导体结构的制造中，在绝缘基板上形成膜厚为0.1-10μm的薄膜导体层，然后将导电材料电镀在薄膜导体层上，厚度为34.9- 在阴极电流密度不小于5A / dm2的条件下为190μm。在图案化导体时，膜厚对导体间隔比选择为不小于1.4，以防止电镀过程中导体的宽度增厚。所得导体结构的电路密度不小于5线/ mm，膜厚度为35-200μm。对于高密度印刷电路板和微型线圈是有用的。

10. 发明授权

US4227039A Thin-film microcircuit board 失效
标题翻译：薄膜微电路板
公开(公告)号：US4227039A
公开(公告)日：1980-10-07
申请号：US953497
申请日：1978-10-23
申请人： Ichiro Shibasaki , Kaoru Ohmura , Takeo Kimura , Hidehiko Kobayashi
发明人： Ichiro Shibasaki , Kaoru Ohmura , Takeo Kimura , Hidehiko Kobayashi
IPC分类号： C23C14/04 , H01L27/01 , H05K3/02
CPC分类号： C23C14/048 , H01L27/016 , H05K3/027 , H05K2201/0112 , H05K2201/0317 , H05K2201/0326 , H05K2203/056 , H05K2203/107 , Y10T428/24851
摘要： Deposited on a glass or ceramic substrate for a thin-film microcircuit board such as a hybrid IC board or a transparent electrode is a thin-film laminate, which comprises a dispersion metal thin-film dispersible and evaporable upon application of an energy above a threshold value and an electrical property-imparting film defining a conductor or a resistor. Then a high intensity of light having an energy sufficient to cause dispersion is applied selectively on the thin-film laminate, thereby removing exposed portions of the thin-film laminate as a result of dispersion and evaporation thereof. Unexposed portions of the thin-film laminate provide a desired pattern. The electrical property-imparting film is a thin-film of noble metal such as gold, silver or platinum or a thin film of transparent electrode material such as SnO.sub.2 or In.sub.2 O.sub.3, which is not easily dispersible upon application of the above energy.
摘要翻译：沉积在诸如混合IC板或透明电极之类的薄膜微电路板的玻璃或陶瓷衬底上的是薄膜层压体，其包括分散金属薄膜，其在施加高于阈值的能量时可分散和蒸发值和限定导体或电阻器的赋予电气特性的膜。然后，选择性地在薄膜层叠体上施加具有足以引起分散的能量的高强度的光，从而除去作为其分散和蒸发的结果的薄膜层叠体的暴露部分。薄膜层叠体的未曝光部分提供所需的图案。电性赋予膜是金，银，铂等贵金属的薄膜，SnO 2，In 2 O 3等透明电极材料的薄膜，在施加上述能量时不容易分散。

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