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    • 2. 发明授权
    • Non-volatile memory array using gate breakdown structures
    • 使用门击穿结构的非易失性存储器阵列
    • US06522582B1
    • 2003-02-18
    • US09553571
    • 2000-04-19
    • Kameswara K. RaoMartin L. VoogelJames KarpShahin ToutounchiMichael J. HartDaniel GitlinKevin T. LookJongheon JeongRadko G. Bankras
    • Kameswara K. RaoMartin L. VoogelJames KarpShahin ToutounchiMichael J. HartDaniel GitlinKevin T. LookJongheon JeongRadko G. Bankras
    • G11C1400
    • G11C16/08
    • Memory cell structures and related circuitry for use in non-volatile memory devices are described. The cell structures can be fabricated utilizing standard CMOS processes, e.g. sub 0.35 micron or sub 0.25 micron processes. Preferably, the cell structures can be fabricated using 0.18 micron or 0.15 micron standard CMOS processes. Advantageously, the cell structures can be programmed so that a conductive path is formed between like type materials. For example, in certain cell structures a cell is programmed by applying a programming voltage in such a way as to form a conductive path between a p-type gate and a p-type source/drain region or an n-type gate and an n-type source/drain region. Programming cells in this manner advantageously provides a programmed cell having a low, linear resistance after programming. In addition, novel charge pump circuits are provided that, in a preferred embodiment, are located “on chip” with an array of memory cells. These charge pump circuits are preferably fabricated utilizing the same standard CMOS processing techniques that were utilized to form the memory cell structures and related circuitry.
    • 描述了用于非易失性存储器件的存储单元结构和相关电路。 可以使用标准CMOS工艺制造电池结构,例如 次0.35微米或次级0.25微米工艺。 优选地,可以使用0.18微米或0.15微米标准CMOS工艺制造电池结构。 有利地,电池结构可以被编程,使得在相似类型的材料之间形成导电路径。 例如,在某些单元结构中,通过施加编程电压来编程单元,以便在p型栅极和p型源极/漏极区域或n型栅极和n型栅极之间形成导电路径 型源极/漏极区域。 以这种方式编程单元有利地在编程之后提供具有低线性电阻的编程单元。 此外,提供了新颖的电荷泵电路,在优选实施例中,它们以“存储器”阵列位于芯片上。 这些电荷泵电路优选地利用用于形成存储器单元结构和相关电路的相同的标准CMOS处理技术来制造。
    • 4. 发明授权
    • Electrostatic-discharge protection circuit
    • 静电放电保护电路
    • US06268639B1
    • 2001-07-31
    • US09248547
    • 1999-02-11
    • Sheau-Suey LiShahin ToutounchiMichael J. HartXin X. WuDaniel Gitlin
    • Sheau-Suey LiShahin ToutounchiMichael J. HartXin X. WuDaniel Gitlin
    • H01L218222
    • H01L27/0251Y10S438/983
    • An ESD protection circuit includes a bipolar transistor, a resistor, and a zener diode formed on and within a semiconductor substrate. The resistor extends between the base and emitter regions of the transistor so that voltage developed across the resistor can turn on the transistor. The zener diode is formed in series with the resistor and extends between the base and collector regions of the transistor. Thus configured, breakdown current through the zener diode, typically in response to an ESD event, turns on the transistor to provide a nondestructive discharge path for the ESD. The zener diode includes anode and cathode diffusions. The cathode diffusion extends down into the semiconductor substrate in a direction perpendicular to the substrate. The anode diffusion extends down through the cathode diffusion into the semiconductor substrate. The anode diffusion extends down further than the cathode diffusion so that the zener diode is arranged vertically with respect to the substrate. The cathode diffusion can be formed using two separate diffusions, one of which extends deeper into the substrate than other.
    • ESD保护电路包括形成在半导体衬底上和半导体衬底内的双极晶体管,电阻器和齐纳二极管。 电阻器在晶体管的基极和发射极区域之间延伸,使跨越电阻器的电压可以导通晶体管。 齐纳二极管与电阻器串联形成,并在晶体管的基极和集电极区域之间延伸。 如此配置,通常通过齐纳二极管的击穿电流(通常响应于ESD事件)导通晶体管,以为ESD提供非破坏性的放电路径。 齐纳二极管包括阳极和阴极扩散。 阴极扩散沿垂直于衬底的方向向下延伸到半导体衬底中。 阳极扩散通过阴极扩散向下延伸到半导体衬底中。 阳极扩散比阴极扩散向下延伸,使得齐纳二极管相对于衬底垂直布置。 可以使用两个分开的扩散形成阴极扩散,其中一个扩散比其它扩散更深。
    • 5. 发明授权
    • Method of forming a zener diode
    • 形成齐纳二极管的方法
    • US06645802B1
    • 2003-11-11
    • US09877690
    • 2001-06-08
    • Sheau-Suey LiShahin ToutounchiMichael J. HartXin X. WuDaniel Gitlin
    • Sheau-Suey LiShahin ToutounchiMichael J. HartXin X. WuDaniel Gitlin
    • H01L218234
    • H01L27/0251Y10S438/983
    • An ESD protection circuit includes a bipolar transistor, a resistor, and a zener diode formed on and within a semiconductor substrate. The resistor extends between the base and emitter regions of the transistor so that voltage developed across the resistor can turn on the transistor. The zener diode is formed in series with the resistor and extends between the base and collector regions of the transistor. Thus configured, breakdown current through the zener diode, typically in response to an ESD event, turns on the transistor to provide a nondestructive discharge path for the ESD. The zener diode includes anode and cathode diffusions. The cathode diffusion extends down into the semiconductor substrate in a direction perpendicular to the substrate. The anode diffusion extends down through the cathode diffusion into the semiconductor substrate. The anode diffusion extends down further than the cathode diffusion so that the zener diode is arranged vertically with respect to the substrate. The cathode diffusion can be formed using two separate diffusions, one of which extends deeper into the substrate than other.
    • ESD保护电路包括形成在半导体衬底上和半导体衬底内的双极晶体管,电阻器和齐纳二极管。 电阻器在晶体管的基极和发射极区域之间延伸,使跨越电阻器的电压可以导通晶体管。 齐纳二极管与电阻器串联形成,并在晶体管的基极和集电极区域之间延伸。 如此配置,通常通过齐纳二极管的击穿电流(通常响应于ESD事件)导通晶体管,以为ESD提供非破坏性的放电路径。 齐纳二极管包括阳极和阴极扩散。 阴极扩散沿垂直于衬底的方向向下延伸到半导体衬底中。 阳极扩散通过阴极扩散向下延伸到半导体衬底中。 阳极扩散比阴极扩散向下延伸,使得齐纳二极管相对于衬底垂直布置。 可以使用两个分开的扩散形成阴极扩散,其中一个扩散比其它扩散更深。
    • 8. 发明授权
    • Pass gate circuit with body bias control
    • 通过门电路与体偏置控制
    • US5880620A
    • 1999-03-09
    • US840582
    • 1997-04-22
    • Daniel GitlinSheau-Suey LiMartin L. VoogelTiemin Zhao
    • Daniel GitlinSheau-Suey LiMartin L. VoogelTiemin Zhao
    • G11C5/14H03K17/06H03K3/01
    • G11C5/146H03K17/063H03K2217/0018
    • A pass gate circuit includes a pass transistor and a body bias control circuit for biasing the body of the pass transistor to reduce body effect. The body bias control circuit includes one or more control transistors arranged to selectively connect the substrate (body) of the pass transistor to the drain or gate of the pass transistor when predetermined voltages are applied to the drain and gate of the pass transistor. As a result, the pass transistor exhibits a reduced body effect in the on-state. In one embodiment, the body bias control circuit includes a first control transistor having a drain and gate connected to the gate of the pass transistor, a gate connected to the drain of the pass transistor, and a source. The body bias control circuit also includes a second control transistor having a drain connected to the source of the first control transistor, a source connected to a body of the pass transistor, and a gate connected to the drain of the pass transistor. The bodies of the pass transistor, first control transistor and second control transistor are electrically interconnected. With this arrangement, the body of the pass transistor is biased "high" by the gate of the pass transistor only when both the gate and drain of the pass transistor are at a high voltage level.
    • 通路电路包括通过晶体管和体偏置控制电路,用于偏置通过晶体管的主体以减小体效应。 体偏置控制电路包括一个或多个控制晶体管,其布置成当预定电压施加到传输晶体管的漏极和栅极时,选择性地将传输晶体管的衬底(主体)连接到传输晶体管的漏极或栅极。 结果,通过晶体管在导通状态下表现出减小的体效应。 在一个实施例中,体偏置控制电路包括第一控制晶体管,其具有连接到传输晶体管的栅极的漏极和栅极,连接到传输晶体管的漏极的栅极和源极。 体偏置控制电路还包括第二控制晶体管,其具有连接到第一控制晶体管的源极的漏极,连接到传输晶体管的主体的源极和连接到通过晶体管的漏极的栅极。 传输晶体管,第一控制晶体管和第二控制晶体管的主体电互连。 通过这种布置,只有当传输晶体管的栅极和漏极都处于高电压电平时,传输晶体管的主体被传输晶体管的栅极偏置“高”。
    • 10. 发明授权
    • Mixed mode RAM/ROM cell using antifuses
    • 使用反熔丝的混合模式RAM / ROM单元
    • US5870327A
    • 1999-02-09
    • US963532
    • 1997-11-03
    • Daniel GitlinDennis L. SegersMichael J. Hart
    • Daniel GitlinDennis L. SegersMichael J. Hart
    • G11C7/20G11C17/00
    • G11C7/20
    • A mixed mode RAM/ROM cell includes a volatile memory cell and an antifuse coupled to the cell. In an array of mixed mode memory cells, addressing circuitry is coupled to the volatile memory cells and programming circuitry is coupled to the antifuses. After an antifuse is programmed, the associated memory cell is transformed from a volatile memory to a non-volatile memory. Specifically, during normal operation, a standard supply voltage is provided to all antifuses. Thus, after a power down or power fluctuation, the programmed antifuses ensure subsequent configuration of their respective volatile memory cells.
    • 混合模式RAM / ROM单元包括易失性存储单元和耦合到单元的反熔丝。 在混合模式存储器单元的阵列中,寻址电路耦合到易失性存储器单元,并且编程电路耦合到反熔丝。 在反熔丝被编程之后,相关联的存储器单元从易失性存储器转换成非易失性存储器。 具体地说,在正常操作期间,向所有反熔丝提供标准电源电压。 因此,在断电或功率波动之后,编程的反熔丝确保其各自的易失性存储单元的后续配置。