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    • 3. 发明申请
    • PLANAR THERMOPILE INFRARED MICROSENSOR
    • 平面热像红外微型传感器
    • WO2010029488A1
    • 2010-03-18
    • PCT/IB2009/053896
    • 2009-09-07
    • NXP B.V.BOUTCHICH, MohamedBATAILLOU, Benoit
    • BOUTCHICH, MohamedBATAILLOU, Benoit
    • G01J5/12
    • G01J5/12G01J5/022G01J5/0806G01J5/0815G01J5/0853
    • An IR sensor comprises a heat sink substrate (10) having portions (12) of relatively high thermal conductivity and portions (14) of relatively low thermal conductivity and a planar thermocouple layer (16) having a hot junction (18) and a cold junction (20), with the hot junction (18) located on a portion (14) of the heat sink substrate with relatively low thermal conductivity. A low thermal conductivity dielectric layer (22) is provided over the thermocouple layer (16), and has a via (24) leading to the hot junction (18). An IR reflector layer (26) covers the low thermal conductivity dielectric layer (22) and the side walls of the via (24). An IR absorber (30; 30') is within the via. This structure forms a planar IR microsensor which uses a structured substrate and a dielectric layer to avoid the need for any specific packaging. This design provides a higher sensitivity by providing a focus on the thermocouple, and also gives better immunity to gas conduction and convection.
    • IR传感器包括散热基板(10),散热基板(10)具有相对较高导热率的部分(12)和具有相对较低导热率的部分(14)和具有热接点(18)的平面热电偶层(16) (20),热接头(18)位于散热器衬底的一部分(14)上,导热系数相对较低。 在热电偶层(16)之上提供低导热介电层(22),并且具有通向热连接点(18)的通孔(24)。 IR反射器层(26)覆盖低导热介电层(22)和通孔(24)的侧壁。 IR吸收器(30; 30')在通孔内。 该结构形成平面的IR微传感器,其使用结构化基板和电介质层以避免对任何特定封装的需要。 该设计通过提供对热电偶的关注而提供更高的灵敏度,并且还对气体传导和对流提供更好的抗扰性。