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1. 发明申请

WO2012096855A2 METHODS AND SYSTEMS OF OBJECT BASED METROLOGY FOR ADVANCED WAFER SURFACE NANOTOPOGRAPHY 审中-公开
标题翻译：基于目标的方法和系统用于高级波形表面纳米尺度的方法和系统
公开(公告)号：WO2012096855A2
公开(公告)日：2012-07-19
申请号：PCT/US2012/020573
申请日：2012-01-08
申请人： KLA-TENCOR CORPORATION , CHEN, Haiguang , SINHA, Jaydeep, K. , KAMENSKY, Sergey
发明人： CHEN, Haiguang , SINHA, Jaydeep, K. , KAMENSKY, Sergey
IPC分类号： H01L21/66 , H01L21/00
CPC分类号： H01L22/12 , H01L22/20 , H01L2924/0002 , H01L2924/00
摘要： Disclosed herein is a system and method for enhanced and expanded localized geometry characterization. Objects of interest are classified according to user-defined parameters, and this enables enhanced contrast and more accurate feature detection, as well as more accurately defined feature object regions.
摘要翻译：本文公开了用于增强和扩展的局部几何表征的系统和方法。感兴趣的对象根据用户定义的参数分类，这使得能够增强对比度和更精确的特征检测以及更准确地定义的特征对象区域。

2. 发明申请

WO2014063055A1 SYSTEMS, METHODS AND METRICS FOR WAFER HIGH ORDER SHAPE CHARACTERIZATION AND WAFER CLASSIFICATION USING WAFER DIMENSIONAL GEOMETRY TOOLS 审中-公开
标题翻译：用于波形高阶形状表征的系统，方法和量度和使用波形尺寸几何工具的波浪分类
公开(公告)号：WO2014063055A1
公开(公告)日：2014-04-24
申请号：PCT/US2013/065692
申请日：2013-10-18
申请人： KLA-TENCOR CORPORATION
发明人： CHEN, Haiguang , SINHA, Jaydeep K. , KAMENSKY, Sergey , VEERARAGHAVAN, Sathish , VUKKADALA, Pradeep
IPC分类号： H01L21/66
CPC分类号： G01B11/24 , G01B2210/56 , G01N21/9501 , G06F17/00 , H01L22/12
摘要： Systems and methods for improving results of wafer higher order shape (HOS) characterization and wafer classification are disclosed. The systems and methods in accordance with the present disclosure are based on localized shapes. A wafer map is partitioned into a plurality of measurement sites to improve the completeness of wafer shape representation. Various site based HOS metric values may be calculated for wafer characterization and/or classification purposes, and may also be utilized as control input for a downstream application. In addition, polar grid partitioning schemes are provided. Such polar grid partitioning schemes may be utilized to partition a wafer surface into measurement sites having uniform site areas while providing good wafer edge region coverage.
摘要翻译：公开了用于改善晶片高阶形状（HOS）表征和晶片分类的结果的系统和方法。根据本公开的系统和方法基于局部形状。将晶片图分割成多个测量点，以提高晶片形状表示的完整性。可以为晶片表征和/或分类目的计算各种基于站点的HOS度量值，并且还可以用作下游应用的控制输入。此外，还提供了极坐标分割方案。这种极性栅格分割方案可用于将晶片表面分割成具有均匀位置区域的测量位置，同时提供良好的晶片边缘区域覆盖。

3. 发明申请

WO2012094421A2 METHODS AND SYSTEMS FOR IMPROVED LOCALIZED FEATURE QUANTIFICATION IN SURFACE METROLOGY TOOLS 审中-公开
标题翻译：用于改进表面计量工具中的本地化特征量化的方法和系统
公开(公告)号：WO2012094421A2
公开(公告)日：2012-07-12
申请号：PCT/US2012/020225
申请日：2012-01-04
申请人： KLA-TENCOR CORPORATION , CHEN, Haiguang , SINHA, Jaydeep , TANG, Shuohong , HAGER, John , ZENG, Andrew , KAMENSKY, Sergey
发明人： CHEN, Haiguang , SINHA, Jaydeep , TANG, Shuohong , HAGER, John , ZENG, Andrew , KAMENSKY, Sergey
IPC分类号： H01L21/66
CPC分类号： G06T5/002 , G06T5/20 , G06T7/0004 , G06T2207/30148
摘要： A method for enabling more accurate measurements of localized features on wafers is disclosed. The method includes: a) performing high order surface fitting to more effectively remove the low frequency shape components and also to reduce possible signal attenuations commonly observed from filtering; b) constructing and applying a proper two dimensional LFM window to the residual image from the surface fitting processing stage to effectively reduce the residual artifacts at the region boundaries; c) calculating the metrics of the region using the artifact-reduced image to obtain more accurate and reliable measurements; and d) using site-based metrics obtained from front and back surface data to quantify the features of interest. A method for filtering data from measurements of localized features on wafers is disclosed. This method includes an algorithm designed to adjust the filtering behavior according to the statistics of extreme data samples. A method for utilizing the 2D window and the data filtering to yield a more robust and more accurate Localized Feature quantification methodology is disclosed.
摘要翻译：公开了一种能够更精确地测量晶片上局部特征的方法。该方法包括：a）执行高阶表面拟合以更有效地去除低频形状分量，并且还可以减少通常从滤波观察到的可能的信号衰减; b）从表面拟合处理阶段构造和应用适当的二维LFM窗口到残余图像，以有效地减少区域边界处的残余伪像; c）使用伪影图像计算该区域的度量以获得更准确和可靠的测量; 以及d）使用从前面和背面数据获得的基于站点的度量来量化感兴趣的特征。公开了一种用于从晶片上的局部特征的测量中滤出数据的方法。该方法包括根据极端数据样本统计来调整过滤行为的算法。公开了一种利用2D窗口和数据过滤产生更强大和更准确的局部特征量化方法的方法。

4. 发明公开

EP2661769A2 METHODS AND SYSTEMS FOR IMPROVED LOCALIZED FEATURE QUANTIFICATION IN SURFACE METROLOGY TOOLS 审中-公开
标题翻译：方法和系统改进的属地化特征量化与表面测量工具
公开(公告)号：EP2661769A2
公开(公告)日：2013-11-13
申请号：EP12732237.8
申请日：2012-01-04
申请人： KLA-Tencor Corporation
发明人： CHEN, Haiguang , SINHA, Jaydeep , TANG, Shuohong , HAGER, John , ZENG, Andrew , KAMENSKY, Sergey
IPC分类号： H01L21/66
CPC分类号： G06T5/002 , G06T5/20 , G06T7/0004 , G06T2207/30148
摘要： A method for enabling more accurate measurements of localized features on wafers is disclosed. The method includes: a) performing high order surface fitting to more effectively remove the low frequency shape components and also to reduce possible signal attenuations commonly observed from filtering; b) constructing and applying a proper two dimensional LFM window to the residual image from the surface fitting processing stage to effectively reduce the residual artifacts at the region boundaries; c) calculating the metrics of the region using the artifact-reduced image to obtain more accurate and reliable measurements; and d) using site-based metrics obtained from front and back surface data to quantify the features of interest. A method for filtering data from measurements of localized features on wafers is disclosed. This method includes an algorithm designed to adjust the filtering behavior according to the statistics of extreme data samples. A method for utilizing the 2D window and the data filtering to yield a more robust and more accurate Localized Feature quantification methodology is disclosed.

5. 发明授权

EP2663998B1 METHOD AND SYSTEM OF OBJECT BASED METROLOGY FOR ADVANCED WAFER SURFACE NANOTOPOGRAPHY 有权
公开(公告)号：EP2663998B1
公开(公告)日：2019-12-25
申请号：EP12734373.9
申请日：2012-01-08
申请人： KLA-Tencor Corporation
发明人： CHEN, Haiguang , SINHA, Jaydeep, K. , KAMENSKY, Sergey
IPC分类号： H01L21/66 , H01L21/00

6. 发明公开

EP2909857A1 SYSTEMS, METHODS AND METRICS FOR WAFER HIGH ORDER SHAPE CHARACTERIZATION AND WAFER CLASSIFICATION USING WAFER DIMENSIONAL GEOMETRY TOOLS 有权
标题翻译：系统，方法和标准来塑造WAFERS高阶和晶圆分类表征与晶圆尺寸几何图形工具
公开(公告)号：EP2909857A1
公开(公告)日：2015-08-26
申请号：EP13846801.2
申请日：2013-10-18
申请人： Kla-Tencor Corporation
发明人： CHEN, Haiguang , SINHA, Jaydeep K. , KAMENSKY, Sergey , VEERARAGHAVAN, Sathish , VUKKADALA, Pradeep
IPC分类号： H01L21/66
CPC分类号： G01B11/24 , G01B2210/56 , G01N21/9501 , G06F17/00 , H01L22/12
摘要： Systems and methods for improving results of wafer higher order shape (HOS) characterization and wafer classification are disclosed. The systems and methods in accordance with the present disclosure are based on localized shapes. A wafer map is partitioned into a plurality of measurement sites to improve the completeness of wafer shape representation. Various site based HOS metric values may be calculated for wafer characterization and/or classification purposes, and may also be utilized as control input for a downstream application. In addition, polar grid partitioning schemes are provided. Such polar grid partitioning schemes may be utilized to partition a wafer surface into measurement sites having uniform site areas while providing good wafer edge region coverage.

7. 发明公开

EP2663998A2 METHODS AND SYSTEMS OF OBJECT BASED METROLOGY FOR ADVANCED WAFER SURFACE NANOTOPOGRAPHY 有权
标题翻译：方法和系统支持先进晶圆表面NANO TOPOGRAPHIE基于对象的测量
公开(公告)号：EP2663998A2
公开(公告)日：2013-11-20
申请号：EP12734373.9
申请日：2012-01-08
申请人： KLA-Tencor Corporation
发明人： CHEN, Haiguang , SINHA, Jaydeep, K. , KAMENSKY, Sergey
IPC分类号： H01L21/66 , H01L21/00
摘要： A system and method for enhanced and expanded localized geometry characterization. Objects of interest are enhanced, detected, and classified according to user-defined parameters, and this enables enhanced contrast and more accurate feature detection, as well as more accurately defined feature object regions for feature geometry measurement and characterization.

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