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    • 1. 发明申请
    • SCATTEROMETRY METROLOGY TARGET DESIGN OPTIMIZATION
    • 计量测量学目标设计优化
    • WO2010080732A3
    • 2010-10-07
    • PCT/US2010020046
    • 2010-01-04
    • KLA TENCOR CORPADEL MICHAEL EMANASSEN AMNONKANDEL DANIEL
    • ADEL MICHAEL EMANASSEN AMNONKANDEL DANIEL
    • H01L21/66
    • G03F7/70683G03F7/705G03F7/70633H01L22/12
    • A metrology target design may be optimized using inputs including metrology target design information, substrate information, process information, and metrology system information. Acquisition of a metrology signal with a metrology system may be modeled using the inputs to generate one or more optical characteristics of the metrology target. A metrology algorithm may be applied to the characteristics to determine a predicted accuracy and precision of measurements of the metrology target made by the metrology system. Part of the information relating to the metrology target design may be modified and the signal modeling and metrology algorithm may be repeated to optimize the accuracy and precision of the one or more measurements. The metrology target design may be displayed or stored after the accuracy and precision are optimized.
    • 度量目标设计可以使用包括度量衡目标设计信息,衬底信息,过程信息和度量衡系统信息的输入来优化。 采用计量系统采集计量信号可以使用输入来建模以产生计量目标的一个或多个光学特性。 计量算法可以应用于特征以确定由计量系统制造的计量目标的测量的预测精度和精度。 与计量目标设计有关的部分信息可能会被修改,信号建模和计量算法可能会重复,以优化一个或多个测量的准确度和精确度。 计量目标设计可以在精确度和精度得到优化之后显示或存储。
    • 5. 发明申请
    • METHOD AND SYSTEM FOR PROVIDING PROCESS TOOL CORRECTABLES USING AN OPTIMZED SAMPLING SCHEME WITH SMART INTERPOLATION
    • 使用优化采样方案与智能插值提供过程工具可修正性的方法和系统
    • WO2011103048A3
    • 2012-03-01
    • PCT/US2011024689
    • 2011-02-14
    • KLA TENCOR CORPIZIKSON PAVELKANDEL DANIELROBINSON JOHN
    • IZIKSON PAVELKANDEL DANIELROBINSON JOHN
    • H01L21/66H01L21/027
    • H01L22/20H01L2924/0002H01L2924/00
    • The present invention may include performing a first measurement on a wafer of a first lot of wafers via an omniscient sampling process, calculating a first set of process tool correctables utilizing one or more results of the measurement performed via an omniscient sampling process, randomly selecting a set of field sampling locations of the wafer of a first lot of wafers, calculating a second set of process tool correctables by applying an interpolation process to the randomly selected set of field sampling locations, wherein the interpolation process utilizes values from the first set of process tool correctables for the randomly selected set of field sampling locations in order to calculate correctables for fields of the wafer of the first lot not included in the set of randomly selected fields, and determining a sub-sampling scheme by comparing the first set of process tool correctables to the second set of correctables.
    • 本发明可以包括通过无所不在的采样处理在第一批晶片的晶片上进行第一测量,利用通过全方位采样过程执行的一个或多个测量结果来计算第一组处理工具校正值,随机选择 第一批晶片的晶片的一组场采样位置,通过对随机选择的一组场采样位置应用内插处理来计算第二组处理工具可校正值,其中所述内插处理利用来自第一组处理的值 用于随机选择的一组场采样位置的工具可校正,以便计算不包括在随机选择的场的集合中的第一批的晶片的场的可校正性,以及通过比较第一组处理工具来确定子采样方案 可纠正到第二组可纠正的。
    • 7. 发明申请
    • MULTI-LAYER OVERLAY METROLOGY TARGET AND COMPLIMENTARY OVERLAY METROLOGY MEASUREMENT SYSTEMS
    • 多层叠加计量目标和综合覆盖度量度测量系统
    • WO2012018673A3
    • 2012-05-18
    • PCT/US2011045778
    • 2011-07-28
    • KLA TENCOR CORPKANDEL DANIELLEVINSKI VLADIMIRCOHEN GUY
    • KANDEL DANIELLEVINSKI VLADIMIRCOHEN GUY
    • H01L21/027
    • G03F7/70633G03F7/70683
    • A multi-layer overlay target for use in imaging based metrology is disclosed. The overlay target includes a plurality of target structures including three or more target structures, each target structure including a set of two or more pattern elements, wherein the target structures are configured to share a common center of symmetry upon alignment of the target structures, each target structure being invariant to N degree rotation about the common center of symmetry, wherein N is equal to or greater than 180 degrees, wherein each of the two or more pattern elements has an individual center of symmetry, wherein each of the two or more pattern elements of each target structure is invariant to M degree rotation about the individual center of symmetry, wherein M is equal to or greater than 180 degrees.
    • 公开了一种用于基于成像的计量学的多层覆盖目标。 覆盖目标包括包括三个或更多个目标结构的多个目标结构,每个目标结构包括一组两个或多个模式元素,其中目标结构被配置为在目标结构对准时共享公共对称中心,每个目标结构 目标结构相对于公共对称中心不变为N度旋转,其中N等于或大于180度,其中两个或更多个图案元素中的每一个具有单独的对称中心,其中两个或更多个图案 每个目标结构的元素对于单个对称中心的M度旋转是不变的,其中M等于或大于180度。
    • 10. 发明申请
    • CONTINUOUSLY VARYING OFFSET MARK AND METHODS OF DETERMINING OVERLAY
    • 连续不断变化的标记和确定覆盖方法
    • WO2005079498A3
    • 2006-08-03
    • PCT/US2005005253
    • 2005-02-17
    • KLA TENCOR TECH CORPADEL MICHAEL ESELIGSON JOEL LKANDEL DANIEL
    • ADEL MICHAEL ESELIGSON JOEL LKANDEL DANIEL
    • G01B11/00G03F7/00G03F7/20H01L21/66H01L21/76H01L23/544
    • G03F7/70683B82Y10/00B82Y40/00G03F7/0002G03F7/70633H01L22/12
    • The present invention relates to overlay marks and methods for determining overlay error. One aspect of the present invention relates to a continuously varying offset mark. The continuously varying offset mark is a single mark that includes over laid periodic structures, which have offsets that vary as a function of position. By way of example, the periodic structures may correspond to gratings with different values of a grating characteristic such as pitch. Another aspect of the present invention relates to methods for determining overlay error from the continuously varying offset mark. The method generally includes determining the center of symmetry of the continuously varying offset mark and comparing it to the geometric center of the mark. If there is zero overlay, the center of symmetry tends to coincide with the geometric center of the mark. If overlay is non zero (e.g., misalignment between two layers), the center of symmetry is displaced from the geometric center of the mark. The displacement in conjunction with the preset gain of the continuously varying offset mark is used to calculate the overlay error.
    • 本发明涉及用于确定覆盖误差的覆盖标记和方法。 本发明的一个方面涉及连续变化的偏移标记。 连续变化的偏移标记是单个标记,其包括覆盖周期性结构,其具有作为位置的函数而变化的偏移。 作为示例,周期性结构可以对应于具有诸如间距的光栅特性的不同值的光栅。 本发明的另一方面涉及用于从连续变化的偏移标记确定覆盖误差的方法。 该方法通常包括确定连续变化的偏移标记的对称中心并将其与标记的几何中心进行比较。 如果零覆盖,则对称中心倾向于与标记的几何中心一致。 如果覆盖层不为零(例如,两层之间的未对准),则对称中心从标记的几何中心位移。 结合连续变化的偏移标记的预设增益的位移用于计算重叠误差。