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    • 10. 发明专利
    • Electroless plating method and plated component
    • 电镀方法和镀层组件
    • JP2005036292A
    • 2005-02-10
    • JP2003275640
    • 2003-07-16
    • Kanto Kasei Kogyo KkToyota Motor Corpトヨタ自動車株式会社関東化成工業株式会社
    • HIRAOKA MOTOKIBESSHO TAKESHIDAIZA SETSUHITOSUZUKI SHIGERUSUZUKI KOJI
    • C23C18/30
    • PROBLEM TO BE SOLVED: To shorten a treatment period of time to increase productivity, and to improve the adhesiveness of a plated film.
      SOLUTION: The electroless plating method comprises contacting a pelletized raw material of a resin having an unsaturated bond with an ozone solution to prepare an ozone-treated pellet, melting the ozone-treated pellet to form a resin-molded article, recontacting the resin-molded article with the ozone solution, and then forming an electroless-plated-film thereon. The method treats the resin with the ozone solution twice in the states of the pellet and the resin-molded article, to shorten the treatment period of time of contacting the resin-molded article with the ozone solution in comparison with a conventional method, and to inhibit the formation of an embrittled layer.
      COPYRIGHT: (C)2005,JPO&NCIPI
    • 要解决的问题:缩短处理时间以提高生产率,并提高镀膜的粘附性。 解决方案:化学镀方法包括将具有不饱和键的树脂的颗粒状原料与臭氧溶液接触以制备经臭氧处理的颗粒,将经臭氧处理的颗粒熔化以形成树脂模塑制品, 树脂成型体与臭氧溶液接触,然后在其上形成无电镀膜。 该方法在颗粒状态和树脂成型体的状态下用臭氧溶液处理树脂两次,以缩短与以往的方法相比,使树脂成形体与臭氧溶液接触的时间的处理时间, 抑制脆化层的形成。 版权所有(C)2005,JPO&NCIPI