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1. 发明专利

JP2004131804A Pretreatment method for electroless plating workpiece and method for manufacturing plating coated member 有权
公开(公告)号：JP2004131804A
公开(公告)日：2004-04-30
申请号：JP2002298063
申请日：2002-10-10
申请人： Kanto Kasei Kogyo Kk , Mitsubishi Rayon Co Ltd , Toyota Motor Corp , トヨタ自動車株式会社 , 三菱レイヨン株式会社 , 関東化成工業株式会社
发明人： HIRAOKA MOTOKI , BESSHO TAKESHI , SUZUKI SHIGERU , SUZUKI KOJI , FUJII SEIZO , SAKAI HIROSHI
IPC分类号： C23C18/30
摘要： PROBLEM TO BE SOLVED: To form a plating film having excellent adhesiveness without roughening the surface of a resin workpiece by eliminating the need for etching treatment or gaseous ozone treatment.
SOLUTION: The plating workpiece consisting of a resin containing a graft copolymer using silicone reinforced acrylic rubber which does not contain a diene rubber component or of which the amount of the diene rubber component contained therein is ≤10mass% is used and after the plating workpiece is brought into contact with an ozone solution, a solution containing at least either of an ionic surfactant and nonionic surfactant and an alkaline component is brought into contact therewith. The deterioration of the diene rubber component by the ozone and the degradation in the strength of adhesion of the plating film are prevented.
COPYRIGHT: (C)2004,JPO

2. 发明专利

JP2004131805A Pretreatment method for electroless plating workpiece and method for manufacturing plating coated member 有权
标题翻译：电镀工艺的预处理方法及其制造方法
公开(公告)号：JP2004131805A
公开(公告)日：2004-04-30
申请号：JP2002298065
申请日：2002-10-10
申请人： Kanto Kasei Kogyo Kk , Toyota Motor Corp , Umg Abs Ltd , トヨタ自動車株式会社 , ユーエムジー・エービーエス株式会社 , 関東化成工業株式会社
发明人： HIRAOKA MOTOKI , BESSHO TAKESHI , SUZUKI SHIGERU , SUZUKI KOJI , FUJII SEIZO , SAKAI HIROSHI
IPC分类号： C23C18/20
摘要： PROBLEM TO BE SOLVED: To form a plating film having excellent adhesiveness without roughening the surface of a resin workpiece by eliminating the need for etching treatment or gaseous ozone treatment.
SOLUTION: The plating workpiece consisting of a resin containing a graft copolymer including a rubber component is used, the resin not containing a diene rubber component or containing the diene rubber component in the amount of ≤10mass% to 100mass% of the resin, after the plating workpiece is brought into contact with an ozone solution, a solution containing at least either of an ionic surfactant and nonionic surfactant and an alkaline component is brought into contact therewith. A degradation in the strength of adhesion of the plating film due to a deterioration in the diene rubber component caused by ozone is prevented.
COPYRIGHT: (C)2004,JPO
摘要翻译：要解决的问题：通过消除对蚀刻处理或气态臭氧处理的需要，形成具有优异粘合性的镀膜，而不使树脂工件的表面粗糙化。解决方案：使用包含含有橡胶组分的接枝共聚物的树脂的电镀工件，不含二烯橡胶组分或含有二烯橡胶组分的树脂的含量为树脂的≤10质量％至100质量％在电镀工件与臭氧溶液接触后，使含有离子表面活性剂和非离子表面活性剂和碱性成分中的至少一种的溶液接触。防止由臭氧引起的二烯橡胶成分的劣化导致的镀膜附着强度的降低。版权所有（C）2004，JPO

3. 发明专利

JP2004263224A Pretreatment method for material to be electroless plated, method for manufacturing plated member, and plated parts 有权
公开(公告)号：JP2004263224A
公开(公告)日：2004-09-24
申请号：JP2003053073
申请日：2003-02-28
申请人： Kanto Kasei Kogyo Kk , Toyota Motor Corp , Umg Abs Ltd , トヨタ自動車株式会社 , ユーエムジー・エービーエス株式会社 , 関東化成工業株式会社
发明人： HIRAOKA MOTOKI , BESSHO TAKESHI , SUZUKI SHIGERU , SUZUKI KOJI , FUJII SEIZO , SAKAI HIROSHI
IPC分类号： C08J7/00 , C23C18/20 , C25D5/56
摘要： PROBLEM TO BE SOLVED: To improve an adhesiveness of a plated film in a low-temperature range of -10°C or lower.
SOLUTION: This method for manufacturing a plated member comprises irradiating a resin material containing 30 to 40 mass% diene rubber component with ultra-violet rays, and then electroless plating the material. Because of containing 30 to 40 mass% diene rubber component, the resin material acquires many active centers after being treated with ultraviolet rays, has the adhesiveness improved, and has also the rubber elasticity in the low-temperature range improved.
COPYRIGHT: (C)2004,JPO&NCIPI

4. 发明专利

JP2004018686A Resin composition for foam molding and molded article thereof 有权
公开(公告)号：JP2004018686A
公开(公告)日：2004-01-22
申请号：JP2002175790
申请日：2002-06-17
申请人： Mitsubishi Rayon Co Ltd , 三菱レイヨン株式会社
发明人： FUJII SEIZO
IPC分类号： H04B7/24 , C08F265/06 , C08J9/04 , C08K3/00 , C08L51/00 , C08L51/04 , H04W16/08 , H04W88/08
摘要： PROBLEM TO BE SOLVED: To provide a foam-molding resin composition which is capable of molding at a high extent of foaming and to provide a molded article thereof. SOLUTION: The resin composition for foam molding contains 100 parts by mass of (A) a rubber-reinforced styrene-based resin component which comprises an acetone-soluble component having a mass-average molecular weight of 150,000 or more and 1-20 parts by mass of (B) a methacrylate-based copolymer component having a reduced viscosity higher than 1.0 dL/g. COPYRIGHT: (C)2004,JPO

5. 发明专利

JP2003327817A Resin composition for direct plating 有权
标题翻译：用于直接镀层的树脂组合物
公开(公告)号：JP2003327817A
公开(公告)日：2003-11-19
申请号：JP2002131931
申请日：2002-05-07
申请人： Mitsubishi Rayon Co Ltd , 三菱レイヨン株式会社
发明人： SAKAI HIROSHI , FUJII SEIZO
IPC分类号： C08L69/00 , C08L25/12 , C08L51/04 , C08L55/02 , C25D5/56
摘要： PROBLEM TO BE SOLVED: To provide a resin composition for direct plating, having excellent direct plating property, especially the extensibility of an electric copper plating layer and having excellent impact resistance and heat-resistance.
SOLUTION: The resin composition for direct plating is composed of (C) 10-50 mass% graft copolymer produced by grafting (b) a monomer containing an aromatic vinyl compound and a vinyl cyanide compound to (a) a rubbery polymer having an average particle diameter of 0.2-0.5 μm and containing 5-20 mass% particles having particle diameter of 0.8-1.5 μm, (E) 5-40 mass% copolymer composed of (e1) an aromatic vinyl compound, (e2) a vinyl cyanide compound and (e3) other monovinyl compound and (D) 20-70 mass% polycarbonate resin. The invention further provides a resin plating method to apply a Pd-Sn colloid catalyst treatment to a molded article of the resin composition, make the article electrically conductive and apply direct electric plating, and a plated resin article produced by the plating method.
COPYRIGHT: (C)2004,JPO
摘要翻译：要解决的问题：提供直接电镀用树脂组合物，具有优异的直接电镀性，特别是电镀铜层的延展性，并且具有优异的耐冲击性和耐热性。解决方案：用于直接电镀的树脂组合物由（C）10-50质量％的接枝共聚物组成，该接枝共聚物通过将（b）含有芳族乙烯基化合物和氰乙烯化合物的单体接枝到（a）橡胶状聚合物上，所述橡胶状聚合物具有平均粒径为0.2-0.5μm，含有5-20质量％的粒径为0.8-1.5μm的颗粒，（E）由（e1）芳族乙烯基化合物组成的（E）5-40质量％共聚物，（e2）乙烯基氰化物化合物和（e3）其它单乙烯基化合物和（D）20-70质量％聚碳酸酯树脂。本发明还提供一种对该树脂组合物的成型体进行Pd-Sn胶体催化剂处理的树脂电镀方法，使制品导电并进行直接电镀，以及通过电镀法制造的电镀树脂制品。版权所有（C）2004，JPO

6. 发明专利

JP2002371167A Constructional material 审中-公开
标题翻译：结构材料
公开(公告)号：JP2002371167A
公开(公告)日：2002-12-26
申请号：JP2001181529
申请日：2001-06-15
申请人： Mitsubishi Rayon Co Ltd , 三菱レイヨン株式会社
发明人： SOGA MASAHIRO , FUJII SEIZO
IPC分类号： C08L51/00 , C08L33/12
摘要： PROBLEM TO BE SOLVED: To provide a constructional material made of a thermoplastic resin, excellent in weather resistance, impact resistance, and an appearance as a mold product.
SOLUTION: This constructional material is given by using a thermoplastic resin composition which contains (A1) a graft copolymer obtained by grafting an aromatic alkenyl compound and a vinylcyanide compound on a rubber component comprising (r-1) a polyalkyl acrylate-based rubber and (B) a polymethyl methacrylate resin. The constructional material is also given by using the thermoplastic resin composition which contains (A2) a graft copolymer obtained by grafting the aromatic alkenyl compound and the vinylcyanide compound on another rubber component comprising (r-2) a composite rubber made of a polyalkyl acrylate and a polyorganosiloxane and/or (r-3) a composite rubber made of the polyalkyl acrylate and polybutadiene and (B) the polymethyl methacrylat resin.
COPYRIGHT: (C)2003,JPO
摘要翻译：要解决的问题：提供一种由热塑性树脂制成的结构材料，耐候性，耐冲击性和作为模具产品的外观优异。解决方案：该结构材料通过使用热塑性树脂组合物给出，该热塑性树脂组合物含有（A1）通过将芳族烯基化合物和乙烯基氰化物化合物接枝在橡胶组分上获得的接枝共聚物，所述橡胶组分包含（r-1）丙烯酸烷基酯基橡胶和（ B）聚甲基丙烯酸甲酯树脂。通过使用含有（A2）通过将芳族烯基化合物和乙烯基氰化物化合物接枝在另一种橡胶组分上而获得的接枝共聚物的（A2）的热塑性树脂组合物，可以得到结构材料，该橡胶组分包含（r-2）由聚丙烯酸烷基酯制成的复合橡胶，聚有机硅氧烷和/或（r-3）由聚丙烯酸烷基酯和聚丁二烯制成的复合橡胶和（B）聚甲基丙烯酸甲酯树脂。

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