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    • 4. 发明申请
    • Plasma Treatment Method and Plasma Etching Method
    • 等离子体处理方法和等离子体蚀刻方法
    • US20080085604A1
    • 2008-04-10
    • US11631597
    • 2005-07-06
    • Yasuyuki HoshinoSeiji Samukawa
    • Yasuyuki HoshinoSeiji Samukawa
    • H01L21/302
    • H01L21/3065H01L21/31116H01L21/32137
    • The present invention develops a process for plasma treatment using a gas having no greenhouse effect in order to realize global environmental preservation and sophistication of plasma process performance and provides a process for plasma etching with high accuracy which process can depress damage to devices. The process for plasma treatment according to the present invention comprises the steps of feeding a treatment gas containing fluorine gas (F2) into a plasma generating chamber, alternately repeating application of high frequency electric field and stop of the application thereof to generate plasma, and carrying out substrate treatment by irradiating the plasma to a substrate. Furthermore, the substrate treatment may be carried out by individually or alternately extracting negative ions or positive ions from the plasma, or selectively extracting only negative ions, neutralizing them, to generate a neutral beam and irradiating the neutral beam to the substrate.
    • 本发明开发了一种使用不具有温室效应的气体进行等离子体处理的方法,以实现全球环境保持和等离子体处理性能的复杂化,并且以高精度提供等离子体蚀刻的方法,该方法可以抑制对器件的损害。 根据本发明的等离子体处理方法包括以下步骤:将含氟气体(F 2 N 2)的处理气体进料到等离子体产生室中,交替重复施加高频电场并停止 其用于产生等离子体,并通过将等离子体照射到基底上进行基板处理。 此外,基板处理可以通过单独或交替地从等离子体中提取负离子或正离子,或者仅选择性地仅提取负离子,中和它们,以产生中性光束并将中性光束照射到衬底来进行。