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1. 发明授权

US07040966B2 Carbonation of pH controlled KOH solution for improved polishing of oxide films on semiconductor wafers 失效
标题翻译：碳酸化pH控制的KOH溶液，以改善对半导体晶片上的氧化膜的抛光
公开(公告)号：US07040966B2
公开(公告)日：2006-05-09
申请号：US10825849
申请日：2004-04-16
申请人： Joseph F. Salfelder , Wayne Swart , Gopalakrishna B. Prabhu , Srinivas R. Mirmira , Laertis Economikos , Fen Fen Jamin , Donald J. Delehanty , Daniel Heenan , Joseph M. Danza
发明人： Joseph F. Salfelder , Wayne Swart , Gopalakrishna B. Prabhu , Srinivas R. Mirmira , Laertis Economikos , Fen Fen Jamin , Donald J. Delehanty , Daniel Heenan , Joseph M. Danza
IPC分类号： B24B1/00
CPC分类号： H01L21/31053
摘要： A method and polishing system for planarizing a substrate having one or more materials formed thereon. The method generally includes positioning the substrate in proximity with a polishing pad, dispensing a polishing fluid to the polishing pad, the polishing fluid being subjected to carbonation prior to being dispensed to the polishing pad, and polishing the substrate. The polishing system generally includes a polishing platen having a polishing pad disposed thereon and in proximity to the substrate, a controller configured to cause the polishing pad to contact the substrate, and a polishing fluid delivery system to deliver a polishing fluid to the polishing pad, the polishing fluid delivery system including a carbonation system.
摘要翻译：一种用于平坦化其上形成有一种或多种材料的基板的方法和抛光系统。该方法通常包括将衬底定位在抛光垫附近，将抛光流体分配到抛光垫，抛光流体在分配到抛光垫之前进行碳酸化，并抛光衬底。抛光系统通常包括具有设置在其上并且靠近基板的抛光垫的抛光台板，配置成使抛光垫与基板接触的控制器和抛光流体输送系统以将抛光流体输送到抛光垫，抛光液输送系统包括碳酸化系统。

2. 发明授权

US5451290A Gas distribution system 失效
标题翻译：燃气分配系统
公开(公告)号：US5451290A
公开(公告)日：1995-09-19
申请号：US17360
申请日：1993-02-11
申请人： Joseph F. Salfelder
发明人： Joseph F. Salfelder
IPC分类号： C23F4/00 , H01J37/32 , H01L21/302 , H01L21/3065 , H01L21/311 , H01L21/00
CPC分类号： H01J37/3244 , H01L21/31116
摘要： Improved apparatus and a method for reducing polymerparticle contamination of semiconductor wafers being processed in a system for plasma-etching silicon dioxide. A quartz gas distribution plate contains a number of gas inlet holes having cross-sectional areas sufficiently small to prevent plasma from being present in the gas inlet holes to inhibit formation of polymer material and flaking of contamination particles therefrom. The gas inlet holes are formed on the surface of the quartz gas distribution plate directly over a wafer being processed. Alternatively, the gas inlet holes are formed in the quartz plate to radially extend to the peripheral edge of the quartz plate so that contamination particles, if any, fall outside the bounds of a wafer beneath the quartz plate. The method disclosed includes the step of feeding CHF.sub.3 gas through the gas inlet holes having cross-sectional areas sufficiently small to prevent formation of polymer within the holes and subsequent flaking and contamination of a wafer being processed.
摘要翻译：改进的设备和减少在用于等离子体蚀刻二氧化硅的系统中处理的半导体晶片的聚合物颗粒污染的方法。石英气体分配板包含多个气体入口孔，其截面面积足够小，以防止气体入口孔中存在等离子体，从而抑制聚合物材料的形成和污染颗粒的剥落。气体入口孔直接在被处理的晶片上形成在石英气体分配板的表面上。或者，气体入口孔形成在石英板中以径向延伸到石英板的周边边缘，使得污染颗粒（如果有的话）落在石英板下面的晶片的界限之外。所公开的方法包括通过气体入口孔进入CHF 3气体的步骤，该气体入口孔的截面面积足够小，以防止在孔内形成聚合物，并随后剥落和污染被处理的晶片。

3. 发明授权

US5631803A Erosion resistant electrostatic chuck with improved cooling system 失效
标题翻译：耐腐蚀静电吸盘具有改进的冷却系统
公开(公告)号：US5631803A
公开(公告)日：1997-05-20
申请号：US369237
申请日：1995-01-06
申请人： John F. Cameron , Joseph F. Salfelder , Chandra Deshpandey
发明人： John F. Cameron , Joseph F. Salfelder , Chandra Deshpandey
IPC分类号： B23Q3/15 , H01L21/02 , H01L21/311 , H01L21/3213 , H01L21/683 , H02N13/00
CPC分类号： H01L21/02071 , H01L21/31138 , H01L21/6831
摘要： An electrostatic chuck (20) for holding a substrate (40) in a process chamber (50) comprises a base (25) supporting a resilient insulator (30). The insulator (30) comprises (i) an electrode (35) embedded therein; (ii) a top surface (34) with a peripheral edge (32); and (iii) cooling grooves (45) for holding coolant in the top surface (34), the tips (125) of the cooling grooves (45) and the peripheral edge (32) of the insulator (30) defining an edge gap (130) having a width w. The width w of the edge gap (130) is sized sufficiently small that the coolant in the grooves (45) cools the perimeter (120) of the substrate (40) held on the chuck (20). The insulator (30) is sufficiently thick that when a substrate (40) is electrostatically held on the chuck (20) and coolant is held in the cooling grooves (45), the insulator (30) in the edge gap (130) resiliently conforms to the substrate (40) so that substantially no coolant leaks out from the tips (125) of the cooling grooves (45). Preferably, the coolant grooves (45) do not cut into the electrode (35).
摘要翻译：用于将基板（40）保持在处理室（50）中的静电卡盘（20）包括支撑弹性绝缘体（30）的基座（25）。绝缘体（30）包括（i）嵌入其中的电极（35）（ii）具有周边边缘（32）的顶表面（34）; 和（iii）用于在顶表面（34）中保持冷却剂的冷却槽（45），冷却槽（45）的顶端（125）和绝缘体（30）的周边边缘（32）限定边缘间隙 130）具有宽度w。边缘间隙（130）的宽度w的尺寸足够小，使得凹槽（45）中的冷却剂冷却保持在卡盘（20）上的基底（40）的周边（120）。绝缘体（30）足够厚，当基板（40）被静电保持在卡盘（20）上并且冷却剂被保持在冷却槽（45）中时，边缘间隙（130）中的绝缘体（30）弹性地符合到基板（40），使得基本上没有冷却剂从冷却槽（45）的末端（125）泄漏出来。优选地，冷却剂槽（45）不切入电极（35）。

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