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    • 2. 发明申请
    • DETERMINING THE DOPANT CONTENT OF A COMPENSATED SILICON SAMPLE
    • 确定补偿性硅样品的含量
    • US20140167731A1
    • 2014-06-19
    • US14235327
    • 2012-07-20
    • Sebastien DuboisNicolas EnjalbertJordi Veirman
    • Sebastien DuboisNicolas EnjalbertJordi Veirman
    • G01N27/20
    • G01N27/20C30B29/06C30B33/00G01N27/041
    • Method for determining dopant impurities concentrations in a silicon sample involves provision of a silicon ingot including donor type dopant impurities and acceptor type dopant impurities, a step for determining the position of a first area of the ingot in which a transition takes place between a first conductivity and a second opposite conductivity types, by subjecting ingot portions to chemical treatment based on hydrofluoric acid, nitric acid and acetic acid, enabling defects to be revealed on one of the portions corresponding to the transition between the first conductivity and the second conductivity types, a step of measuring the concentration of free charge carriers in a second area of the ingot, different from the first area, and a step for determining concentrations of dopant impurities in the sample from the position of the first area and the concentration of free charge carriers in the second area of the ingot.
    • 用于确定硅样品中的掺杂剂杂质浓度的方法包括提供包括施主型掺杂剂杂质和受主型掺杂剂杂质的硅锭,确定锭的第一区域的位置的步骤,其中在第一区域之间发生第一导电性 和第二相反的导电类型,通过使锭部分基于氢氟酸,硝酸和乙酸进行化学处理,使得能够在与第一导电性和第二导电类型之间的过渡相对应的部分之一上露出缺陷, 测量不同于第一区域的锭的第二区域中的游离载流子的浓度的步骤,以及从第一区域的位置和自由载流子浓度确定样品中掺杂剂杂质浓度的步骤 晶锭的第二个区域。
    • 4. 发明申请
    • DETERMINING THE DOPANT CONTENT OF A COMPENSATED SILICON SAMPLE
    • 确定补偿性硅样品的含量
    • US20140163913A1
    • 2014-06-12
    • US14235218
    • 2012-07-20
    • Sebastien DuboisNicolas EnjalbertJordi Veirman
    • Sebastien DuboisNicolas EnjalbertJordi Veirman
    • G01N27/04
    • G01N27/041C30B29/06C30B33/00
    • The method for determining the concentrations of dopant impurities in a silicon sample includes provision of a silicon ingot including donor-type dopant impurities and acceptor-type dopant impurities, a step for determining the position of a first area of the ingot in which a transition takes place between a first conductivity type and a second opposite conductivity type, a step for measuring the concentration of free charge carriers in the second area of the ingot, distinct from the first area, by Hall effect, Fourier transform infrared spectroscopy or a method using the lifetime of the charge carriers, and a step for determining the concentrations of dopant impurities in the sample from the position of the first area and the concentration of free charge carriers in the second area of the ingot.
    • 用于确定硅样品中的掺杂剂杂质的浓度的方法包括提供包括施主型掺杂剂杂质和受主型掺杂剂杂质的硅锭,确定转变所需的锭的第一区域的位置的步骤 位于第一导电类型和第二相反导电类型之间的步骤,用于通过霍尔效应,傅立叶变换红外光谱法或使用第二导电类型的方法测量与第一区域不同的锭的第二区域中的自由电荷载流子的浓度的步骤 电荷载体的寿命,以及从第一区域的位置和锭的第二区域中的游离载流子浓度确定样品中掺杂剂杂质的浓度的步骤。
    • 7. 发明申请
    • METHOD FOR ANNEALING PHOTOVOLTAIC CELLS
    • 退火光电池的方法
    • US20080075840A1
    • 2008-03-27
    • US11845841
    • 2007-08-28
    • Nicolas EnjalbertSebastien Dubois
    • Nicolas EnjalbertSebastien Dubois
    • H01L31/0216B05D5/12
    • H01L31/1868H01L31/1864Y02E10/547Y02P70/521
    • Method for annealing at least one photovoltaic cell comprising a substrate based on silicon with a first type of conductivity, a layer doped with a second type of conductivity produced in the substrate and forming a front face of the substrate, an antireflection layer produced on the front face of the substrate and forming a front face of the photovoltaic cell, at least one metallization on the front face of the cell and at least on metallization on a rear face of the substrate. This method comprises at least the steps of: a) a first annealing of the photovoltaic cell at a temperature between around 700° C. and 900° C., b) a second annealing of the photovoltaic cell at a temperature between around 200° C. and 500° C., at ambient pressure and in ambient air, with hydrogen being diffused in the substrate during the process.
    • 用于退火至少一个光伏电池的方法,所述光伏电池包括基于具有第一导电类型的硅的衬底,在衬底中产生的形成第二类导电性的层,并形成衬底的正面;在前面产生的抗反射层 并且形成光伏电池的正面,在电池的前表面上至少一个金属化,并且至少在基板的背面上的金属化上。 该方法至少包括以下步骤:a)在约700℃和900℃之间的温度下对光伏电池进行第一次退火,b)光伏电池在约200℃ 和500℃,在环境压力和环境空气中,氢在工艺过程中扩散到衬底中。
    • 10. 发明申请
    • METHOD OF PROCESSING A SEMICONDUCTOR SUBSTRATE BY THERMAL ACTIVATION OF LIGHT ELEMENTS
    • 通过热元件热激活加工半导体基板的方法
    • US20090253225A1
    • 2009-10-08
    • US12401152
    • 2009-03-10
    • Sebastien DuboisNicolas EnjalbertRemi Monna
    • Sebastien DuboisNicolas EnjalbertRemi Monna
    • H01L21/322H01L31/0232H01L31/0236
    • H01L31/182C30B29/52C30B33/02H01L21/3225H01L21/3242H01L31/03685H01L31/1812H01L31/1864Y02E10/546Y02P70/521
    • Method of processing a substrate containing at least one semiconductor of the SiXAY type and comprising at least four separate types of light elements, comprising at least the following steps: carrying out a first anneal of the substrate at a temperature T1 corresponding to a thermal activation temperature for a first one of the four types of light elements, carrying out a second anneal of the substrate at a temperature T2 corresponding to a thermal activation temperature for a second one of the four types of light elements, carrying out a third anneal of the substrate at a temperature T3 corresponding to a thermal activation temperature for a third one of the four types of light elements, carrying out a fourth anneal of the substrate at a temperature T4 corresponding to a thermal activation temperature for a fourth one of the four types of light elements, each anneal comprising a holding at the temperature T1, T2, T3 or T4 and the temperatures T1, T2, T3 and T4 being such that T1>T2>T3>T4.
    • 处理包含至少一种SiXay类型的半导体并且包括至少四种分离类型的光元件的衬底的方法,包括至少以下步骤:在对应于热活化温度的温度T1下进行衬底的第一退火 对于四种类型的光元件中的第一种,在与四种类型的光元件中的第二种类型的光元件的热激活温度相对应的温度T2下进行基板的第二退火,进行基板的第三退火 在与四种类型的光元件中的第三种类型的光元件的热活化温度相对应的温度T3下,在与四种类型的光中的第四种类型的光的热活化温度相对应的温度T4下进行基板的第四退火 元素,每个退火包括在温度T1,T2,T3或T4以及温度T1,T2,T3和T4的保持,使得T1> T2> T 3> T4。